SQUARE Cellphone ICs 1,150

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX9986AETP-T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N20		1	.8 mm	5 mm	Not Qualified			e0			5 mm
MC13202FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN		QUAD	S-PQCC-N32		3	1 mm	5 mm	Not Qualified			e3	40	260	5 mm
SKY65048-360LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		DUAL	S-PDSO-N8		1	1 mm	2 mm	Not Qualified			e3		260	2 mm
SKY66420-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,20		.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N16			.8 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
MAX4003EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0			3 mm
MAX4003EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e3	30	260	3 mm
ADF4360-8BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3	30	260	4 mm
ADF4360-1BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3	30	260	4 mm
ADF7021-NBCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm
MAX5864ETM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS	.0165 mA	3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD	S-XQCC-N48	VOLTAGE	1	.8 mm	7 mm	Not Qualified	DIFFERENTIAL	1.5 V	e0		245	7 mm
MAX5864ETM+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e3	30	260	7 mm
SKY66423-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,20		.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N16			.8 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
ADL5387ACPZ-WP	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BIPOLAR		5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3		260	4 mm
MAX2902ETI+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					4.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		QUAD	S-XQCC-N28		1	.9 mm	5 mm	Not Qualified			e3	30	260	5 mm
ADL5387ACPZ-R7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BIPOLAR		5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3		260	4 mm
LT5521EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N16		1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
SKY65366-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel			QUAD	S-XQMA-N28			1.15 mm	6 mm					NOT SPECIFIED	NOT SPECIFIED	6 mm
SKY65933-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16		SQUARE	UNSPECIFIED	YES	1					1.8 V		MICROELECTRONIC ASSEMBLY			.475 mm	85 Cel		-40 Cel			QUAD	S-XQMA-N16			.8 mm	2.5 mm					NOT SPECIFIED	NOT SPECIFIED	2.5 mm
SKY66121-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1				600 mA	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32		.8 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N16		3	.81 mm	4 mm						260	4 mm
SKY66122-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	36	HVQCCN	SQUARE		YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20		.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N36		3	1 mm	6 mm							6 mm
SKY68031-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT					SQUARE			1																			3
RFX1010	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel			QUAD	S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
RFX2402E	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel			QUAD	S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY65344-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	BCC	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER			1 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N20			1.4 mm	6 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	6 mm
RFX2411	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	125 Cel		-40 Cel			QUAD	S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY65313-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel			QUAD	S-XQMA-N28		3	1 mm	6 mm							6 mm
SKY66119-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	28	QCCN	SQUARE		YES	1				20 mA	3.3 V		CHIP CARRIER				85 Cel		-40 Cel	GOLD OVER NICKEL		QUAD	S-XQCC-N28		3	1.15 mm	6 mm				e4		260	6 mm
ISL5216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	S-PBGA-B196		3	1.5 mm	15 mm				e1			15 mm
RFX5000B	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SE5007BT-R	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N16			.6 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY13491-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		SQUARE	UNSPECIFIED	YES	1					2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel		-30 Cel			QUAD	S-XQMA-N22		3	.9 mm	2.5 mm						260	2.9 mm
SKY65174-21	Skyworks Solutions	RF FRONT END CIRCUIT	OTHER	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel		-35 Cel			DUAL	S-XDMA-N10			.95 mm	4 mm					NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY66115-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32		.8 mm	85 Cel		-40 Cel	GOLD OVER NICKEL		QUAD	S-XQCC-N16		3	1 mm	4 mm				e4		260	4 mm
SKY73083-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N36		3	1.15 mm	6 mm	Not Qualified					260	6 mm
SKY73208-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36		SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel		-40 Cel			QUAD	S-XQMA-N36		3	1.45 mm	6 mm						260	6 mm
SKY73420-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm						QUAD	S-XQCC-N36			.9 mm	6 mm					NOT SPECIFIED	NOT SPECIFIED	6 mm
SKY77762-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1					3.4 V		MICROELECTRONIC ASSEMBLY				75 Cel		-30 Cel			DUAL	S-XDMA-N10			1 mm	3 mm					NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY85402-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N20		3	.9 mm	4 mm						260	4 mm
AD6688BBPZ-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel			BOTTOM	S-PBGA-B196		3	1.53 mm	12 mm					30	260	12 mm
ADF7020BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3		260	7 mm
ADF7021-VBCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm
ADRF6701ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES				BICMOS		5 V	5	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N40					Not Qualified				NOT SPECIFIED	NOT SPECIFIED
AT86RF231-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N32			1 mm	5 mm	Not Qualified			e3			5 mm
HMC422MS8ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN		DUAL	S-PDSO-G8		1	1.1 mm	3 mm				e3		260	3 mm
HMC689LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N24		1	1 mm	4 mm				e3	30	260	4 mm
TCM320AC57PT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
LMV225TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM	S-PBGA-B4		1	.675 mm	1.014 mm	Not Qualified						1.014 mm
CC2400RSU	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N48			1 mm	7 mm	Not Qualified						7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.