SQUARE Cellphone ICs 1,150

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HD155121F	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V	3/3.3,3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G48		1.7 mm	7 mm	Not Qualified				7 mm
ZMD44102	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.4 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N48		.9 mm	7 mm	Not Qualified				7 mm
UPB1005K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N36		1 mm	6 mm	Not Qualified	e0			6 mm
F5280AVGK	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	49	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				GRID ARRAY				105 Cel	-40 Cel	Tin (Sn)	BOTTOM	S-PBGA-B49	3				e3	NOT SPECIFIED	260
ISL5216KI-1Z	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
ISL5216KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		700 mA	2.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	12 mm		e0			12 mm
ISL5217KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
F5280AVGK8	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	49	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				GRID ARRAY				105 Cel	-40 Cel	Tin (Sn)	BOTTOM	S-PBGA-B49	3				e3	NOT SPECIFIED	260
F6101NTGK8	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	40		SQUARE		YES	1	BICMOS								95 Cel	-40 Cel	TIN	QUAD	S-XQCC-N40	1				e3		260
HD155101BF	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD	S-PQFP-G48		1.7 mm	7 mm	Not Qualified				7 mm
HSP50216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	12 mm	Not Qualified	e1			12 mm
UPB1005K	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N36		1 mm	6 mm	Not Qualified	e0			6 mm
ISL5216KI-1	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		700 mA	2.5 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm
ISL5416KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm		e1			17 mm
IDTF1130NBGI	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48		.8 mm	7 mm					7 mm
F1180NBGI	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		YES	1		410 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm		e3		260	7 mm
ISL5416KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm		e0	20	220	17 mm
ISL5217KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm
LUCW3030ACA-DB	Broadcom	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	100 Cel	-35 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
ACMD-4102-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	9	QCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-20 Cel	GOLD	BOTTOM	S-XBCC-N9	3	1.05 mm	2.4 mm	Not Qualified	e4			2.4 mm
LUCW3020CCS-DB	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.2 mm	10 mm	Not Qualified	e0	30	240	10 mm
AJAV-5602-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5601-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
WS1405-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8	HQCCN	SQUARE		YES	1		520 mA	3.4 V		CHIP CARRIER, HEAT SINK/SLUG	SOLCC8,.16,32		.8 mm	85 Cel	-30 Cel		DUAL	S-XQCC-N8		1.1 mm	3 mm					3 mm
AJAV-5501-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		GRID ARRAY, HEAT SINK/SLUG			.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm				260	3 mm
ALM-2506-TR1G	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			2.85 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm				DUAL	S-PDSO-N6		1.2 mm	2 mm	Not Qualified				2 mm
AJAV-5508-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
ALM-2506-TR2G	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			2.85 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm				DUAL	S-PDSO-N6		1.2 mm	2 mm	Not Qualified				2 mm
LUCW3020CCS	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.2 mm	10 mm	Not Qualified	e0	30	240	10 mm
WS1405-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8	HQCCN	SQUARE		YES	1		520 mA	3.4 V		CHIP CARRIER, HEAT SINK/SLUG	SOLCC8,.16,32		.8 mm	85 Cel	-30 Cel		DUAL	S-XQCC-N8		1.1 mm	3 mm					3 mm
AJAV-5501-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		GRID ARRAY, HEAT SINK/SLUG			.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm				260	3 mm
ACMD-4102-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	9	QCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-20 Cel	GOLD	BOTTOM	S-XBCC-N9	3	1.05 mm	2.4 mm	Not Qualified	e4			2.4 mm
ALM-2506-BLKG	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			2.85 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm				DUAL	S-PDSO-N6		1.2 mm	2 mm	Not Qualified				2 mm
HPMX-7202-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.55 mm	5 mm	Not Qualified	e0			5 mm
LUCW3030ACA	Broadcom	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	100 Cel	-35 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
AJAV-5602-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5601-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5508-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
S1M8656A01-F0T0	Samsung	BASEBAND CIRCUIT	OTHER	BUTT	48	VBCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B48		.8 mm	7 mm	Not Qualified				7 mm
S1M8657X01-F0T0	Samsung	BASEBAND CIRCUIT	OTHER	BUTT	48	VBCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B48		.8 mm	7 mm	Not Qualified				7 mm
S1T8536X01-T0R0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-10 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
S1M8659X01-F0T0	Samsung	RF AND BASEBAND CIRCUIT	OTHER	BUTT	32	BCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3 V		CHIP CARRIER			.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B32			5 mm	Not Qualified				5 mm
S1M8653BQ	Samsung	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.05 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G80		1.8 mm	12 mm	Not Qualified				12 mm
S1M8656A01-E0T0	Samsung	BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
S1M8657X01-E0T0	Samsung	BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
S1M8662AX01-F0T0	Samsung	BASEBAND CIRCUIT	OTHER	BUTT	32	VBCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B32		.8 mm	5 mm	Not Qualified				5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.