SQUARE Cellphone ICs 1,150

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA1921BE	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified			e3			7 mm
BGU7075Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16		3	1.4 mm	8 mm						260	8 mm
SA1921-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS				FLATPACK				85 Cel		-40 Cel	TIN		QUAD	S-PQFP-G48					Not Qualified			e3
SA2400ABE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
AFRX5G372	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	20	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC20,.25SQ,35		.9 mm	105 Cel		-40 Cel			QUAD	S-PQCC-N20			1.218 mm	6.2 mm							6.2 mm
UAA3580HN	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS	.063 mA	1.8 V	2.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	70 Cel		-30 Cel	TIN/NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N24			1 mm	4 mm	Not Qualified			e3/e4			4 mm
BGU7061,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16			1.4 mm	8 mm							8 mm
BGU7078	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16			1.4 mm	8 mm							8 mm
BGU7063	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16		3	1.4 mm	8 mm							8 mm
BGU7062,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16			1.4 mm	8 mm							8 mm
SA900BE-S	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
BGU7258X	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20		.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	S-PDSO-N6		1	.5 mm	1.6 mm				e4	30	260	1.6 mm
BGU7258	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20		.5 mm	85 Cel		-40 Cel			DUAL	S-PDSO-N6			.5 mm	1.6 mm					NOT SPECIFIED	NOT SPECIFIED	1.6 mm
SA1920BE-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
SA3601	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			BOTTOM	S-PBCC-B32			.8 mm	5 mm	Not Qualified						5 mm
BGU7073	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16			1.4 mm	8 mm							8 mm
PCF5083H/6V2/F4	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm						QUAD	S-PQFP-G128			1.6 mm	14 mm	Not Qualified						14 mm
BGU7061	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16			1.4 mm	8 mm							8 mm
SA1921BE-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
PCF5083H/5V2/F3-T	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm						QUAD	S-PQFP-G128			1.6 mm	14 mm	Not Qualified						14 mm
PCF5083H/001/F2	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.64SQ,16	Other Telecom ICs	.4 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G128			1.6 mm	14 mm	Not Qualified						14 mm
BGU7062,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16			1.4 mm	8 mm							8 mm
BGA7210X	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32		1	.85 mm	5 mm						260	5 mm
BGA7351	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32		1	1 mm	5 mm							5 mm
BGA7350,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32		1	1 mm	5 mm					30	260	5 mm
BGA7350,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32			1 mm	5 mm							5 mm
BGA7210,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32			.85 mm	5 mm							5 mm
BGA7351,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32		1	1 mm	5 mm					30	260	5 mm
BGA7351,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32			1 mm	5 mm							5 mm
BGA7204,515	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32			.85 mm	5 mm							5 mm
BGA7204,115	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32		1	.85 mm	5 mm					30	260	5 mm
BGA7210	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32		1	.85 mm	5 mm							5 mm
BGA7350	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32		1	1 mm	5 mm							5 mm
BGA7204	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	S-PQCC-N32		1	.85 mm	5 mm				e4			5 mm
CMY191	Infineon Technologies	RF AND BASEBAND CIRCUIT		GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm						DUAL	S-PDSO-G10			1.1 mm	3 mm	Not Qualified						3 mm
PMB2240	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel			QUAD	S-PQFP-G48			1.1 mm	7 mm	Not Qualified						7 mm
CMH192	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N20			.9 mm	3.5 mm	Not Qualified						3.5 mm
PMB2411	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48			1.1 mm	7 mm	Not Qualified						7 mm
CMH82	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N20			.9 mm	3.5 mm	Not Qualified						3.5 mm
OC1120-0810WLB25	Infineon Technologies	BASEBAND CIRCUIT		BALL	25		SQUARE		YES	1				10 mA	1.8 V						85 Cel		-25 Cel			BOTTOM	R-XBGA-B25			.43 mm	2.554 mm							2.926 mm
BGSX24MU16E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	16	HLGA	SQUARE	UNSPECIFIED	YES	1			RFCMOS		2.8 V		GRID ARRAY, HEAT SINK/SLUG	LGA16,5X5,16		.4 mm	85 Cel		-40 Cel			BOTTOM	S-XBGA-N16		3	.64 mm	2 mm							2 mm
BGA735L16	Infineon Technologies	RF FRONT END CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-30 Cel			QUAD	S-XQCC-N16			.4 mm	2.3 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGA735L16E6327XTSA1	Infineon Technologies	RF FRONT END CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-30 Cel			QUAD	S-XQCC-N16			.4 mm	2.3 mm							2.3 mm
MAX5863ETM+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e3	30	260	7 mm
MAX5866ETM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn85Pb15)		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified			e0	20	240	7 mm
MAX1958ETP	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N20		1	.8 mm	5 mm	Not Qualified			e0		245	5 mm
MAX5864ETM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS	.0165 mA	3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD	S-XQCC-N48	VOLTAGE		.8 mm	7 mm	Not Qualified	DIFFERENTIAL	1.5 V	e0			7 mm
MAX19994AETX+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N36		1	.8 mm	6 mm	Not Qualified			e3	30	260	6 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.