SQUARE Cellphone ICs 1,150

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC13150FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G24		1.6 mm	4 mm	Not Qualified	e0			4 mm
MC13192FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		40	260	5 mm
MC13193	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
MC13146FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G24	1	1.6 mm	4 mm					4 mm
MC13150FTB	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3 mA	3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
MC13192FC	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		40	260	5 mm
MC13145FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm					7 mm
MC13201FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e3	40	260	5 mm
MC13191FC	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	2	1 mm	5 mm	Not Qualified		30	240	5 mm
935295245115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
935294197515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm
MC13201FC	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e3	40	260	5 mm
935295517115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
MC13202FC	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e3	40	260	5 mm
935292558115	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm
935295517518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935296762115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
PCF5083H/F2-T	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm				QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
SA900BE-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
BGU7060	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
PCF5083H/5V2/F3	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.64SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
PCF5083H/F2	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.64SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
BGU7063,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
SA1920	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
PCF5073H	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	7 mm	Not Qualified				7 mm
UMA1002H	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0018 mA	3 V	3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Cordless Telephone ICs	.8 mm	70 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
SA1920-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
PCF5073H-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	7 mm	Not Qualified				7 mm
SA3601W	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified				5 mm
BGU7061,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
SA1638BE-S	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		24 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
BGU7062	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm					8 mm
SA1921	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
WLAN7102CZ	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		214 mA	3.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.07SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	.7 mm	2 mm				260	2 mm
UAA3522HL	NXP Semiconductors	RF FRONT END CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.8 V	2.8	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	Tin (Sn)	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
PCF5083H/6V2/F4-T	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm				QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
BGU7224	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20		.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N6		.5 mm	1.6 mm					1.6 mm
SA1638BE-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		24 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
UAA3581HN	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V	1.6,2.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24		1 mm	4 mm	Not Qualified	e3/e4			4 mm
PCF5083H/001/F2-T	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm				QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
BGU7063,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm			30	260	8 mm
UMA1002H-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE			.8 mm	70 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
SA900BE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
SA1638BE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	24 mA	3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
BGU7060Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
BGU7075	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
SA1920BE	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
UAA3535HL	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.066 mA	2.6 V	2.6,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.