SQUARE Cellphone ICs 1,150

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
CC1260RGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N48	3	1 mm		7 mm				e4	30	260	7 mm
AFE7799IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm		17 mm			RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
TRF6903PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
CC2510F16RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified			e4	NOT SPECIFIED	260	6 mm
LMH6521SQ/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	2		245 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	26 dB	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm		5 mm				e3	30	260	5 mm
CC2510F16RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
GC5316IZED	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	388	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA388,26X26,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B388	3	2.5 mm		27 mm	Not Qualified			e1	30	260	27 mm
CC2510F16RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
CC2510F16RHH	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified			e4	30	260	6 mm
HPA00420RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	2	1 mm		4 mm				e4	30	260	4 mm
LMV226TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified			e1			1.014 mm
LMV228TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified						1.014 mm
CC2511F16RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	NOT SPECIFIED	260	6 mm
LMV225URX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL		VFBGA	SQUARE	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH							TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1							e1	30	260
TRF6900	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-20 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
TRF6901PTG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
TLV321AC36CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
CC2420RTC	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N48	3	.9 mm		7 mm	Not Qualified			e4	30	260	7 mm
TRF6903PT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
TRF6903PTG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
TCM8010-37FR	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4 V	3.7/4	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel	-30 Cel			QUAD	S-PQFP-G44		2.25 mm		10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
TCM4400EPN	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	.03 mA	3 V	3	FLATPACK	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	12 mm
LMV225UR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm		.975 mm	Not Qualified			e0	40	260	.975 mm
CC2510F8RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
CC2400-STR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm		7 mm	Not Qualified						7 mm
LMV225TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1		8 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified			e1	30	260	1.014 mm
LMV225TL/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1		8 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified			e1	30	260	1.014 mm
CC2400-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	.005 mA	1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm		7 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7 mm
TRF5901PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.053 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
TCM4400EPET	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	.03 mA	3 V	3	FLATPACK	TQFP80,.48SQ,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.2 mm		10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
TLV321AC37IPT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
CC2420RGZ	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm		7 mm							7 mm
TLV321AC36IPTR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm							7 mm
LMV226TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified						1.014 mm
LMH9126IRRLR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG				105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-XQCC-N12	2							e4	30	260
TLV320AC56PT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
HPA01083RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	2	1 mm		4 mm				e4	30	260	4 mm
GC5018IZDL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	305	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B305	3	2.02 mm		19 mm	Not Qualified			e1	30	260	19 mm
TLV320AC57PT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
TRF5901PTG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.053 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
CC2510F16RHHR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified			e4	NOT SPECIFIED	260	6 mm
CC2510F8RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
LMV225URX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm		.975 mm	Not Qualified			e0	40	260	.975 mm
TCM8010-50FR	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		5 V	5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel			QUAD	S-PQFP-G44		2.25 mm		10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
TRF6901PT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			.04 mA	2.7 V	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
CC2510F32RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
HPA00452RSTR	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	3	.95 mm		4 mm				e4	30	260	4 mm
TCM320AC56CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.0099 mA	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	70 Cel	0 Cel	1 dB		QUAD	S-PQFP-G48		1.6 mm	13-BIT	7 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	7 mm	YES

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.