RF AND BASEBAND CIRCUIT Cellphone ICs 1,460

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC786LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N24		1	1 mm	4 mm					e3	30	260	4 mm
LT5558EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N16		1	.8 mm	4 mm	Not Qualified				e3	30	260	4 mm
MAX4003EUA/GH9-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel			DUAL	S-PDSO-G8		1	1.1 mm	3 mm								3 mm
SI4710-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD	S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4710-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD	S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
MAX4003EBL+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	S-PBGA-B8		1	.67 mm	1.52 mm	Not Qualified				e1	30	260	1.52 mm
MAX4003EBL	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN LEAD		BOTTOM	S-PBGA-B8		1	.67 mm	1.52 mm	Not Qualified				e0			1.52 mm
MAX4003EBL-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN LEAD		BOTTOM	S-PBGA-B8		1	.67 mm	1.52 mm	Not Qualified				e0			1.52 mm
MAX4003EBL+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	S-PBGA-B8		1	.67 mm	1.52 mm	Not Qualified				e1	30	260	1.52 mm
RYZ014A000FZ00#HD0	Renesas Electronics	RF AND BASEBAND CIRCUIT																											3									250
SI4136-F-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N28		3	.9 mm	5 mm	Not Qualified				e3		260	5 mm
SI4712-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD	S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
AFSC5G23D37T2	NXP Semiconductors	RF AND BASEBAND CIRCUIT																											3								40	260
CC1110EMK868-915	Texas Instruments	RF AND BASEBAND CIRCUIT
HMC786LP4E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	R-PQCC-N24		1	1 mm	4 mm	Not Qualified				e3		260	4 mm
LISA-U200-03S-02	U-blox Ag	RF AND BASEBAND CIRCUIT
SKY13437-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel		-35 Cel			QUAD	R-XQMA-N22		3	.9 mm	2.5 mm							260	3.2 mm
TRF372017IRGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.25 mA	3.3 V	3.3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	S-PQCC-N48		2	1 mm	7 mm	Not Qualified				e4	30	260	7 mm
ADF7020-1BCPZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3	30	260	7 mm
CC1000PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified				e4	30	260	9.7 mm
MAX5865ETM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS		3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD	S-XQCC-N48	VOLTAGE	1	.8 mm	7 mm	Not Qualified	DIFFERENTIAL		1.5 V	e0		245	7 mm
MAX5865ETM+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified				e3	30	260	7 mm
SKY78117-14	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY									UNSPECIFIED	R-XXMA-N34										NOT SPECIFIED	NOT SPECIFIED
SKY78215-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT
1168	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16			.95 mm	4 mm	Not Qualified							4 mm
BGS14MPA9E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT																											1
BGSX22G2A10E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1			CMOS				CHIP CARRIER									BOTTOM	R-XBCC-B10		1
LARA-R202-02B-03	U-blox Ag	RF AND BASEBAND CIRCUIT																											4
LTC5594IUH#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N32		1	.8 mm	5 mm					e3		260	5 mm
NRF24L01-REEL7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N20		2	.95 mm	4 mm					e3		260	4 mm
SI4713	Silicon Labs	RF AND BASEBAND CIRCUIT		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm						QUAD	S-XQCC-N20			.6 mm	3 mm	Not Qualified							3 mm
TEF8102EN/N1Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT																											2									260
TOBY-L210-65S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				65 Cel		-20 Cel			BOTTOM	R-XBGA-N152		4	2.87 mm	24.8 mm			-40 to 85 extended operating temp available					35.6 mm
TRF370317IRGER	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.245 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N24		2	1 mm	4 mm	Not Qualified				e4	30	260	4 mm
TRF370317IRGET	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.245 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N24		2	1 mm	4 mm	Not Qualified				e4	30	260	4 mm
AD6636BBC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel		-40 Cel			BOTTOM	S-PBGA-B256		3	1.85 mm	17 mm							240	17 mm
AD6672BCPZ-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.145 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N32		3	.8 mm	5 mm	Not Qualified				e3	30	260	5 mm
AD6672BCPZRL7-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.145 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N32		3	.8 mm	5 mm	Not Qualified				e3	30	260	5 mm
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-30 Cel	TIN		DUAL	R-PDSO-N6		1	.4 mm	1.3 mm					e3			2 mm
BGA7L1BN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	TIN		BOTTOM	R-PBCC-N6		1	.4 mm	.7 mm					e3			1.1 mm
CC1100RTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N20		3	.95 mm	4 mm	Not Qualified				e3	30	260	4 mm
CC2511F32RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	S-XQCC-N36		3	.9 mm	6 mm	Not Qualified				e4	NOT SPECIFIED	260	6 mm
J-N3-B3E6-LR	Telit Communications Plc	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE				85 Cel		-40 Cel			DUAL	R-PDSO-N24			2.4 mm	12.2 mm								16 mm
LMV228TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL		VFBGA	RECTANGULAR	UNSPECIFIED	YES	1		1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	R-XBGA-B4		1							e1	30	260
LT5527EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N16		1	.8 mm	4 mm	Not Qualified				e3	30	260	4 mm
RFFM6903	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		GRID ARRAY, HEAT SINK/SLUG				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		BOTTOM	S-PBGA-B28		3	1.05 mm	6 mm					e4	30	260	6 mm
RFFM6903TR13	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		GRID ARRAY, HEAT SINK/SLUG				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		BOTTOM	S-PBGA-B28		3	1.05 mm	6 mm					e4	30	260	6 mm
RFFM6903TR7	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		GRID ARRAY, HEAT SINK/SLUG				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		BOTTOM	S-PBGA-B28		3	1.05 mm	6 mm					e4	30	260	6 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.