RF AND BASEBAND CIRCUIT Cellphone ICs 1,460

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC2420ZRTC	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		.9 mm	7 mm	Not Qualified					7 mm
GC5016-PBZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	252	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B252	3	2.02 mm	17 mm	Not Qualified		e1	30	260	17 mm
CC2420RTCR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC1260RGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
AFE7799IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
TRF6903PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e4	30	260	7 mm
LMV228SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified		e0			2.5 mm
CC2510F16RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm	6 mm	Not Qualified		e4	NOT SPECIFIED	260	6 mm
LMH6521SQ/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	2		245 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	26 dB	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm			e3	30	260	5 mm
CC2510F16RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified		e4	30	260	6 mm
GC5316IZED	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	388	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA388,26X26,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B388	3	2.5 mm	27 mm	Not Qualified		e1	30	260	27 mm
CC2510F16RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified		e4	30	260	6 mm
TRF4903PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.043 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.8 mm
CC2510F16RHH	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
HPA00420RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	2	1 mm	4 mm			e4	30	260	4 mm
TRF4000PWP	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	80 Cel	-30 Cel			DUAL	R-PDSO-G14		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
LMV226TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL		VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-XBGA-B4	1					e1	30	260
LMV226TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified		e1			1.014 mm
LMV228TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified					1.014 mm
LMH6523SQ	Texas Instruments	RF AND BASEBAND CIRCUIT
CC2511F16RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified		e4	NOT SPECIFIED	260	6 mm
LMH2110TMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel			BOTTOM	R-PBGA-B6		.675 mm	.84 mm	Not Qualified					1.24 mm
LMH6522SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	4		485 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC54,.2X.39,20		.5 mm	85 Cel	-40 Cel	25.74 dB	MATTE TIN	QUAD	R-XQCC-N54	2	.8 mm	5.5 mm			e3	30	260	10 mm
LMV225URX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL		VFBGA	SQUARE	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH							TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1					e1	30	260
TRF6900	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-20 Cel			QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
TRF6901PTG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e4	30	260	7 mm
LMV228SD/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD		HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		8 mA			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE							MATTE TIN	DUAL	R-PDSO-N6	1					e3	30	260
LMV228URX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT																					TIN SILVER COPPER			1					e1	30	260
LMV228SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified		e3			2.5 mm
CC2420RTC	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
TRF6903PT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e4	30	260	7 mm
TRF6903PTG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e4	30	260	7 mm
LMV225UR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified		e0	40	260	.975 mm
CC2510F8RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified		e4	30	260	6 mm
CC2400-STR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified					7 mm
LMV225TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1		8 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified		e1	30	260	1.014 mm
LMV225TL/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1		8 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified		e1	30	260	1.014 mm
CC2400-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	.005 mA	1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7 mm
TRF5901PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.053 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e4	30	260	7 mm
TRF4400PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel			DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.8 mm
LMH2100TM/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		9.2 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.844 mm			e1	30	260	1.244 mm
CC2420RGZ	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm	7 mm						7 mm
LMV226TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified					1.014 mm
LMH9126IRRLR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG				105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-XQCC-N12	2					e4	30	260
HPA01083RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	2	1 mm	4 mm			e4	30	260	4 mm
LMV226URX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT																					TIN SILVER COPPER			1					e1	30	260
GC5018IZDL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	305	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B305	3	2.02 mm	19 mm	Not Qualified		e1	30	260	19 mm
LMV225SD/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA	2.7 V		SMALL OUTLINE, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified		e3	30	260	2.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.