OTHER Cellphone ICs 154

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SI4713-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4721-B20-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified				3 mm
LARA-R211-02B-02	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	100		RECTANGULAR	UNSPECIFIED	YES	1			3.8 V		MICROELECTRONIC ASSEMBLY				65 Cel	-20 Cel		UNSPECIFIED	R-XXMA-N100	4	2.87 mm	24 mm			NOT SPECIFIED	NOT SPECIFIED	26 mm
SKY13524-639LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	90 Cel	-30 Cel		QUAD	S-XQCC-N14		.5 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
AD607ARSZ	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3		260	7.2 mm
AD607ARS	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
SARA-R412M-02B	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	BUTT	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM	R-XBGA-B96	4	2.78 mm	16 mm			NOT SPECIFIED	NOT SPECIFIED	26 mm
SKY13522-644LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	8	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	90 Cel	-30 Cel		QUAD	S-XQCC-N8		.5 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.1 mm
AD607ARS-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
AD607ARSZ-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3		260	7.2 mm
SI4711-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4711-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
BGA777N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
SI4713-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SARA-G350-02S-00	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	96		RECTANGULAR	UNSPECIFIED	YES	1			3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		UNSPECIFIED	R-XXMA-N96	4	2.65 mm	16 mm			60	245	26 mm
SI4721-B20-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4710-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4710-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4712-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY13437-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1			2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel	-35 Cel		QUAD	R-XQMA-N22	3	.9 mm	2.5 mm				260	3.2 mm
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
CC2511F32RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC1111F32RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3			Not Qualified	e4	30	260
CC2511F32RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
RF3183	Qorvo	RF AND BASEBAND CIRCUIT	OTHER	BUTT	11	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				85 Cel	-30 Cel		BOTTOM	S-PBCC-B11		1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
RF3183TR13	Qorvo	RF AND BASEBAND CIRCUIT	OTHER	BUTT	11	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				85 Cel	-30 Cel		BOTTOM	S-PBCC-B11		1 mm	5 mm	Not Qualified				5 mm
SARA-G340-02S-00	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	96		RECTANGULAR	UNSPECIFIED	YES	1			3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		UNSPECIFIED	R-XXMA-N96	4	2.65 mm	16 mm			60	245	26 mm
SI4720-B20-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD	S-XQCC-N20	3	.6 mm	3 mm	Not Qualified	e3	40	260	3 mm
SKY13526-485LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HQCCN	SQUARE	UNSPECIFIED	YES	1			2.85 V		CHIP CARRIER, HEAT SINK/SLUG				90 Cel	-30 Cel		QUAD	S-XQCC-N14		.6 mm	2 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
SKY66291-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	UNSPECIFIED	16					1			5 V									UNSPECIFIED	S-XXSS-X16	3						260
SKY13491-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		SQUARE	UNSPECIFIED	YES	1			2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel	-30 Cel		QUAD	S-XQMA-N22	3	.9 mm	2.5 mm				260	2.9 mm
SKY13529-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	17		RECTANGULAR	UNSPECIFIED	YES	1			2.85 V		MICROELECTRONIC ASSEMBLY				90 Cel	-35 Cel		QUAD	R-XQMA-N17		.84 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY65174-21	Skyworks Solutions	RF FRONT END CIRCUIT	OTHER	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-35 Cel		DUAL	S-XDMA-N10		.95 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
TCM4400APN	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-25 Cel		QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified				12 mm
TCM4400PNR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-25 Cel		QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified				12 mm
TCM4400PN	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V	3/5,3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12 mm
CC2511F16RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
TCM4400EPNR	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK			.5 mm	85 Cel	-25 Cel		QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified				12 mm
TRF4400PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TCM4400EPETR	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK			.4 mm	85 Cel	-25 Cel		QUAD	S-PQFP-G80		1.2 mm	10 mm	Not Qualified				10 mm
TRF4900	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified				7.8 mm
TCM4400EGGM	Texas Instruments	BASEBAND CIRCUIT	OTHER	BALL	80	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.03 mA	3 V	3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA80,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-25 Cel		BOTTOM	S-PBGA-B80		1.4 mm	10 mm	Not Qualified				10 mm
CC2511F8RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC2511F32RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC2511F8RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2511F16RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
TRF6900	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-20 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TCM8010-37FR	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4 V	3.7/4	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel	-30 Cel		QUAD	S-PQFP-G44		2.25 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.