OTHER Cellphone ICs 154

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PMB2202	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3.6 V	2.7/4.5	SMALL OUTLINE	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	e0			7.8 mm
CMY213	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	8	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE				85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8		1.1 mm	1.6 mm	Not Qualified	e0			2.9 mm
BGA735L16	Infineon Technologies	RF FRONT END CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N16		.4 mm	2.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGA713L7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.4 mm	1.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA777L7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA735L16E6327XTSA1	Infineon Technologies	RF FRONT END CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N16		.4 mm	2.3 mm					2.3 mm
BGA777N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL	R-PDSO-N6	1	.4 mm	1.3 mm					2 mm
BGA713N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	1.3 mm					2 mm
BGA713L7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA777L7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2 mm
UPG2128TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG2121TB-E3	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	GAAS	.0045 mA	2.8 V	2.8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Other Telecom ICs	.65 mm	90 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
UPC8194K-E1	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e0			4 mm
UPC8195K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
UPC8194K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
UPG2130TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
HD155101BF	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD	S-PQFP-G48		1.7 mm	7 mm	Not Qualified				7 mm
UPC8190K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-25 Cel		QUAD	R-PQCC-N20		.9 mm	3 mm					4 mm
UPG174TA-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	90 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.53 mm	1.5 mm		e0			2.9 mm
UPC8195K-E1	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e0			4 mm
UPC8191K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-25 Cel		QUAD	R-PQCC-N20		.9 mm	3 mm					4 mm
UPG2126TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
RP-M2470BW	Littelfuse	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	48		RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	R-XXMA-N48		2.4 mm	15 mm					18 mm
RP-M2455AP	Littelfuse	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1			1.5 V		MICROELECTRONIC ASSEMBLY			1.3 mm	70 Cel	-20 Cel		QUAD	R-XQMA-N38			16 mm					22 mm
LUCW3030ACA-DB	Broadcom	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	100 Cel	-35 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
ACMD-4102-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	9	QCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-20 Cel	GOLD	BOTTOM	S-XBCC-N9	3	1.05 mm	2.4 mm	Not Qualified	e4			2.4 mm
LUCW3020CCS-DB	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.2 mm	10 mm	Not Qualified	e0	30	240	10 mm
AJAV-5602-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5601-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
ACPM-7355-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR		3.4 V		MICROELECTRONIC ASSEMBLY			.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1.05 mm	4 mm				260	5 mm
W3013BCL-TR	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified	e0	30	240	6.5 mm
AJAV-5501-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		GRID ARRAY, HEAT SINK/SLUG			.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm				260	3 mm
ACPM-5252-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		CHIP CARRIER			.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACPM-7353-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR		3.4 V		MICROELECTRONIC ASSEMBLY			.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1 mm	4 mm				260	5 mm
AJAV-5508-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
LUCW3020CCS	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.2 mm	10 mm	Not Qualified	e0	30	240	10 mm
ACFM-7104-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	UNSPECIFIED	7		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				85 Cel	-10 Cel	GOLD	UNSPECIFIED	R-XXMA-X7	3	1.2 mm	4 mm	Not Qualified	e4			7 mm
AJAV-5501-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		GRID ARRAY, HEAT SINK/SLUG			.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm				260	3 mm
ACMD-4102-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	9	QCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-20 Cel	GOLD	BOTTOM	S-XBCC-N9	3	1.05 mm	2.4 mm	Not Qualified	e4			2.4 mm
ACPM-5252-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		CHIP CARRIER			.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACPM-7353-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR		3.4 V		MICROELECTRONIC ASSEMBLY			.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1 mm	4 mm				260	5 mm
ACFM-7104-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	UNSPECIFIED	7		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				85 Cel	-10 Cel	GOLD	UNSPECIFIED	R-XXMA-X7	3	1.2 mm	4 mm	Not Qualified	e4			7 mm
ACPM-5281-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		CHIP CARRIER			.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACPM-7831-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1			3.4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDMA-N6				Not Qualified	e0
W3013BCL	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm
ACPM-7831-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1			3.4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDMA-N6				Not Qualified	e0
LUCW3030ACA	Broadcom	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	100 Cel	-35 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
ACPM-5281-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		CHIP CARRIER			.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.