OTHER Cellphone ICs 154

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TCM4400EPN	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.03 mA	3 V	3	FLATPACK	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD		S-PQFP-G80		1.6 mm	12 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12 mm
TCM4400EPET	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.03 mA	3 V	3	FLATPACK	TQFP80,.48SQ,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel		QUAD		S-PQFP-G80		1.2 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
TRF4400PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel		DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4400PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel		DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4400PW	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel		DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
CC1111F8RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36	3			Not Qualified	e4	30	260
CC1111F16RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36	3			Not Qualified	e4	30	260
CC1111F16RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36	3			Not Qualified	e4	30	260
CC1111F32RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36	3			Not Qualified	e4	30	260
CC1111F8RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36	3			Not Qualified	e4	30	260
AD6654BBCZ	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e1		260	17 mm
AD6634XBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel		BOTTOM		S-PBGA-B196			15 mm	Not Qualified				15 mm
AD6635XBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel		BOTTOM		S-PBGA-B324			19 mm	Not Qualified				19 mm
AD7001AS	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		FLATPACK			.8 mm	85 Cel	-25 Cel		QUAD		S-PQFP-G44		2.45 mm	10 mm	Not Qualified				10 mm
AD6654CBCZ	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e1		260	17 mm
AD6432AST	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V	3/3.3	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Other Telecom ICs	.8 mm	85 Cel	-25 Cel		QUAD		S-PQFP-G44		1.6 mm	10 mm	Not Qualified				10 mm
AD6654BBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e0		240	17 mm
AD8348XXX	Analog Devices	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-34 Cel	TIN LEAD	DUAL		R-PDSO-G28		1.1 mm	4.4 mm	Not Qualified	e0			9.7 mm
AD6654CBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e0		240	17 mm
ADF4602BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N40		1 mm	6 mm	Not Qualified	e3			6 mm
ADF4602BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N40		1 mm	6 mm	Not Qualified	e3			6 mm
STLC4560	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
STRAFT-P98L15	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BUTT	15	TFLGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, THIN PROFILE, FINE PITCH			.75 mm	85 Cel	-25 Cel		BOTTOM		R-XBGA-B15		1.1 mm	2.7 mm					3.8 mm
STLC4560TRAY	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
MC13751FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			2.78 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
MC13146FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G24	1	1.6 mm	4 mm					4 mm
MC13145FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm					7 mm
MMM7210B	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	170	LGA	RECTANGULAR	UNSPECIFIED	YES	1				1.2 V		GRID ARRAY				85 Cel	-30 Cel		BOTTOM		R-XBGA-N170		1.2 mm	7.65 mm					9.25 mm
UMA1002T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0018 mA	3 V	3/5	SMALL OUTLINE	SOP28,.4	Cordless Telephone ICs	1.27 mm	70 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	e4			17.9 mm
UMA1002TD-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UMA1002H	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.0018 mA	3 V	3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Cordless Telephone ICs	.8 mm	70 Cel	-30 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
UMA1002T-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
SA9500DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.85 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
UAA3522HL	NXP Semiconductors	RF FRONT END CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.8 V	2.8	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	Tin (Sn)	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
UMA1000LT	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UAA2073M	NXP Semiconductors	RF FRONT END CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		34 mA	3.75 V	3.75	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA9502DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
UAA3581HN	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V	1.6,2.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24		1 mm	4 mm	Not Qualified	e3/e4			4 mm
UMA1002H-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE			.8 mm	70 Cel	-30 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
UMA1000LT-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UAA2073M-T	NXP Semiconductors	RF FRONT END CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		34 mA	3.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
UAA3535HL	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.066 mA	2.6 V	2.6,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
SA2400ABE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
UAA3580HN	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.063 mA	1.8 V	2.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24		1 mm	4 mm	Not Qualified	e3/e4			4 mm
UAA2077TS/D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.028 mA	2.8 V	2.8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.65 mm	70 Cel	-30 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified	e4			5.2 mm
PMB2208	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.014 mA	3.6 V	2.7/4.5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified			260	7.8 mm
PMB2240	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD		S-PQFP-G48		1.1 mm	7 mm	Not Qualified				7 mm
CMY212	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	8	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE				85 Cel	-30 Cel		DUAL		R-PDSO-G8		1.1 mm	1.6 mm	Not Qualified				2.9 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.