BALL Cellphone ICs 144

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LMV232TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.675 mm	1.5095 mm			e1	30	260	1.5095 mm
AFE7920IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
LMV226UR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified		e0	40	260	.975 mm
GC5016-PBZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	252	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B252	3	2.02 mm	17 mm	Not Qualified		e1	30	260	17 mm
AFE7799IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
GC5316IZED	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	388	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA388,26X26,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B388	3	2.5 mm	27 mm	Not Qualified		e1	30	260	27 mm
LMV226TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL		VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B4	1					e1	30	260
LMV226TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified		e1			1.014 mm
LMV228TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified					1.014 mm
LMH2110TMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.675 mm	.84 mm	Not Qualified					1.24 mm
LMV225URX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL		VFBGA	SQUARE	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH						TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1					e1	30	260
LMV225UR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified		e0	40	260	.975 mm
LMV225TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1		8 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified		e1	30	260	1.014 mm
LMV225TL/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1		8 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified		e1	30	260	1.014 mm
LMH2100TM/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		9.2 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.844 mm			e1	30	260	1.244 mm
LMV226TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified					1.014 mm
GC5018IZDL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	305	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B305	3	2.02 mm	19 mm	Not Qualified		e1	30	260	19 mm
LMV228TL/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL		VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B4	1					e1	30	260
LMV225URX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified		e0	40	260	.975 mm
GC5016-PB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	252	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B252	3	2.02 mm	17 mm	Not Qualified		e0	20	220	17 mm
GC5318IZED	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B388	3	2.5 mm	27 mm	Not Qualified		e1	30	260	27 mm
LMV226UR/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL		VFBGA	SQUARE	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH						TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1					e1	30	260
CC1000-RTR2	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B28		.652 mm	2.339 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4.034 mm
CC1000-RWP2	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B28		.652 mm	2.339 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4.034 mm
CC1000_UCSP/T&R	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	GRID ARRAY	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B28		1.2 mm	2.339 mm	Not Qualified					4.034 mm
CC1000YZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B28		.652 mm	2.339 mm	Not Qualified					4.034 mm
CC1000YZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B28		.652 mm	2.339 mm	Not Qualified					4.034 mm
AD6642BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.291 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified		e1	30	260	10 mm
AD6657BBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified		e1	30	260	10 mm
ADRV9010BBCZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B289		1.43 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm
AD9986BBPZRL-4D2AC	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	324	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1			4070 mA	1 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA324,18X18,32		.8 mm	120 Cel	-40 Cel		BOTTOM	S-PBGA-B324	3	1.72 mm	15 mm				30	260	15 mm
AD6654BBCZ	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified		e1		260	17 mm
AD6650BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B121	3	1.85 mm	12 mm	Not Qualified		e1			12 mm
AD6688BBPZRL-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.53 mm	12 mm				30	260	12 mm
AD6642BBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.291 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	S-PBGA-B144	1	1.4 mm	10 mm	Not Qualified		e3			10 mm
AD6634XBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel		BOTTOM	S-PBGA-B196			15 mm	Not Qualified					15 mm
AD6635XBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel		BOTTOM	S-PBGA-B324			19 mm	Not Qualified					19 mm
AD6657BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified		e1			10 mm
AD6657ABBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.51 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified		e1	30	260	10 mm
AD9986BBPZ-4D2AC	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	324	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1			4070 mA	1 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA324,18X18,32		.8 mm	120 Cel	-40 Cel		BOTTOM	S-PBGA-B324	3	1.72 mm	15 mm				30	260	15 mm
AD6634BBC	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA196,14X14,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3		15 mm	Not Qualified		e0		240	15 mm
AD6635BBC	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B324		3.5 mm	19 mm	Not Qualified		e0			19 mm
ADRV9010BBCZ-A-RL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B289		1.43 mm	14 mm						14 mm
AD6654CBCZ	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified		e1		260	17 mm
AD6636CBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified		e1		260	17 mm
AD6654BBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified		e0		240	17 mm
AD6650BBC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B121	3	1.85 mm	12 mm	Not Qualified		e0			12 mm
AD6635BBZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B324		3.5 mm	19 mm	Not Qualified		e1			19 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.