BALL Cellphone ICs 144

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD9361BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.7 mm	10 mm			e1		260	10 mm
AD9361BBCZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.7 mm	10 mm			e1		260	10 mm
AD9361BBCZ-CSL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			150 mA	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.7 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
LMH2110TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		5.5 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.84 mm			e1	30	260	1.24 mm
LMH2110TM/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		5.5 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.84 mm			e1	30	260	1.24 mm
ST25R3912-AWLT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B30		.68 mm	2.865 mm				NOT SPECIFIED	NOT SPECIFIED	3.065 mm
BALF-NRG-02D3	STMicroelectronics	RF AND BASEBAND CIRCUIT		BALL	4	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,40/16		1 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B4		.69 mm	.855 mm			e1	30	260	1.385 mm
AD6636BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified		e1		260	17 mm
LMH2110TM	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.675 mm	.84 mm	Not Qualified					1.24 mm
MAX2674EWT+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm	Not Qualified		e2	30	260	1.27 mm
MAX2674EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm			e2	30	260	1.27 mm
AFE8030EDIABJ	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
AFE8030IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
MAX4003EBL+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.67 mm	1.52 mm	Not Qualified		e1	30	260	1.52 mm
MAX4003EBL	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1	.67 mm	1.52 mm	Not Qualified		e0			1.52 mm
MAX4003EBL-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1	.67 mm	1.52 mm	Not Qualified		e0			1.52 mm
MAX4003EBL+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.67 mm	1.52 mm	Not Qualified		e1	30	260	1.52 mm
AD6636BBC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm					240	17 mm
LMV228TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL		VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B4	1					e1	30	260
AFE8030EDIALK	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e0		220	17 mm
ISL5216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm			e1			15 mm
AD6688BBPZ-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.53 mm	12 mm				30	260	12 mm
LMV225TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified					1.014 mm
LMH2121TMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B4		.675 mm	.866 mm						1.07 mm
LMH2121TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		4.7 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B4	1	.675 mm	.858 mm			e1	30	260	1.058 mm
LMH2120UMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		4 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.47 mm	.816 mm			e1	30	260	1.216 mm
AFE7700IALK	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e0	20	220	17 mm
LMH2120UMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.47 mm	.825 mm	Not Qualified					1.225 mm
AFE7921IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
LMH2100TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		9.2 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.844 mm			e1	30	260	1.244 mm
LMV228TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified					1.014 mm
LMV225TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4	1	.675 mm	1.014 mm	Not Qualified					1.014 mm
AFE7988IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
TCM4400EGGM	Texas Instruments	BASEBAND CIRCUIT	OTHER	BALL	80	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	.03 mA	3 V	3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA80,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-25 Cel		BOTTOM	S-PBGA-B80		1.4 mm	10 mm	Not Qualified					10 mm
GC5322IZND	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B352	3	1.6 mm	27 mm	Not Qualified		e1	30	260	27 mm
LMV228URX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified		e0	40	260	.975 mm
LMV226TL/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL		VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B4	1					e1	30	260
LMV225UR/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL		VFBGA	SQUARE	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH						TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1					e1	30	260
TRF96001GQE	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		BOTTOM	S-PBGA-B80		1 mm	5 mm	Not Qualified					5 mm
GC5325IZND	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B352	3	1.6 mm	27 mm	Not Qualified		e1	30	260	27 mm
AFE7989IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
LMH2120UM	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.47 mm	.825 mm	Not Qualified					1.225 mm
LMH2121TME/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		4.7 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B4	1	.675 mm	.858 mm			e1	30	260	1.058 mm
LMH2120UM/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		4 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.47 mm	.816 mm			e1	30	260	1.216 mm
LMV226URX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified		e0	40	260	.975 mm
LMV228UR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm	.975 mm	Not Qualified		e0	40	260	.975 mm
TS3A26746EYZPR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	2		.05 mA	3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B6	1	.5 mm	.9 mm	Not Qualified		e1	30	260	1.4 mm
LMV232TL/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	2		13 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.675 mm	1.5095 mm			e1	30	260	1.5095 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.