BALL Cellphone ICs 144

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD6650ABC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B121	3	1.85 mm	12 mm	Not Qualified	e0		240	12 mm
AD6657ABBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.51 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified	e1	30	260	10 mm
AD6635BB	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B324	3	3.5 mm	19 mm	Not Qualified	e0		225	19 mm
AD6650ABCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B121		1.85 mm	12 mm	Not Qualified	e1			12 mm
ADRV9010BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B289		1.43 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
AD6634BBCZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3		15 mm	Not Qualified	e1		260	15 mm
ADRV9010BBCZ-A	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B289		1.43 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
AD6636CBC	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256	3	1.85 mm	17 mm				240	17 mm
AD6654CBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e0		240	17 mm
ADL5502ACBZ-P7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B8	1	.625 mm	1.46 mm	Not Qualified	e1	30	260	1.46 mm
ADL5502ACBZ-P2	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B8	1	.625 mm	1.46 mm	Not Qualified	e1		260	1.46 mm
MAX2676EWT+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2674EWT+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2676EWT+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		R-PBGA-B6	1	.69 mm	.865 mm	Not Qualified	e2	30	260	1.27 mm
STA8088EXA	STMicroelectronics	RF FRONT END CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
STLC4560	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
STLC4560TRAY	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
STA8088EX	STMicroelectronics	RF FRONT END CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
STLC4420A	STMicroelectronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	BALL	228	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1		3.6 V	1.8,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA228,13X24,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B228		1.4 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12.5 mm
MC13760	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104		1.6 mm	10 mm					10 mm
BGU8103UK	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.26 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.31 mm	.44 mm					.69 mm
OC1120-0810WLB25	Infineon Technologies	BASEBAND CIRCUIT		BALL	25		SQUARE		YES	1			10 mA	1.8 V						85 Cel	-25 Cel		BOTTOM		R-XBGA-B25		.43 mm	2.554 mm					2.926 mm
BGS8H2UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			7 mA	1.8 V		GRID ARRAY			.26 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.31 mm	.44 mm					.69 mm
BGS8L3UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.26 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.31 mm	.44 mm					.69 mm
BGS8M2UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.26 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.31 mm	.44 mm					.69 mm
MAX2676EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2202EWT+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2386EBP-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B20	1	.67 mm	2.02 mm	Not Qualified	e0			2.64 mm
MAX2383EBC+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	11	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM		R-PBGA-B11		.65 mm	1.64 mm	Not Qualified	e3			2.12 mm
MAX2202EWT+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2385EBP-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B20	1	.67 mm	2.02 mm	Not Qualified	e0			2.64 mm
MAX2383EBC	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	11	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B11	1	.67 mm	1.64 mm	Not Qualified	e0			2.12 mm
MAX2383EBC+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	11	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B11	1	.65 mm	1.64 mm	Not Qualified		30	260	2.12 mm
MAX2383EBC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	11	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B11	1	.67 mm	1.64 mm	Not Qualified	e0			2.12 mm
MAX2307EBC	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	e0			2.02 mm
MAX2202EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.69 mm	.865 mm	Not Qualified		30	260	1.27 mm
MAX2307EBC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified				2.02 mm
MAX2202EMT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.69 mm	.865 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	1.27 mm
F5280AVGK	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	49	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS					GRID ARRAY				105 Cel	-40 Cel	Tin (Sn)	BOTTOM		S-PBGA-B49	3				e3	NOT SPECIFIED	260
ISL5216KI-1Z	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
ISL5216KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			700 mA	2.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B196	3	1.5 mm	12 mm		e0			12 mm
ISL5217KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
F5280AVGK8	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	49	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS					GRID ARRAY				105 Cel	-40 Cel	Tin (Sn)	BOTTOM		S-PBGA-B49	3				e3	NOT SPECIFIED	260
HSP50216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	12 mm	Not Qualified	e1			12 mm
ISL5216KI-1	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			700 mA	2.5 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm
ISL5416KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.5 mm	17 mm		e1			17 mm
ISL5416KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B256	3	1.5 mm	17 mm		e0	20	220	17 mm
ISL5217KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.