BGA Digital Transmission Controllers 163

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS26556	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified			245	17 mm
DS26528GA5+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS26524GN	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.45 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified				17 mm
DS26524GN+	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.45 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e1	30	260	17 mm
DS26401N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.33 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.77 mm			17 mm	Not Qualified	e0			17 mm
DS26514G	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	17 mm
DS34S104GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e0			17 mm
DS26524G	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.45 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e0			17 mm
DS34S101GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e1		225	17 mm
DS26514G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26528GNA4	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e0			17 mm
DS26524G+	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.45 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e1			17 mm
DS21FT42+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B300		2.54 mm			27 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	27 mm
DS21455N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FT40	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B300		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FF42N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e3			27 mm
DS21FT44N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FT44+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B300	4	2.53 mm			27 mm	Not Qualified	e1			27 mm
DS21FF44	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FF42+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e1	30	260	27 mm
DS21455N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified	e3			27 mm
DS21FF44N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FT42N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FT40N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B300		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FT42	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FT44	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FF42	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21FT44N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B300	4	2.53 mm			27 mm	Not Qualified	e1	30	260	27 mm
DS21FF42N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21455+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified	e3			27 mm
DS21455	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm			27 mm	Not Qualified	e0			27 mm
IDT82V8313BBG	Renesas Electronics	FRAMER	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm			17 mm	Not Qualified	e1			17 mm
IDT82V2108BB	Renesas Electronics	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.97 mm			13 mm	Not Qualified	e0	30	225	13 mm
82V8313BBG	Renesas Electronics	FRAMER	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm			17 mm	Not Qualified	e1			17 mm
82V2108BB	Renesas Electronics	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.97 mm			13 mm	Not Qualified	e0	30	225	13 mm
T8100A---BAL-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.32 mm			23 mm	Not Qualified	e0	30	225	23 mm
TFRA08C13	Broadcom	FRAMER		BALL	352	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	8	CMOS		3.3 V		GRID ARRAY						TIN LEAD	BOTTOM	X-PBGA-B352						Not Qualified	e0	30	225
T8102---BAL3-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.32 mm			23 mm	Not Qualified	e0	30	225	23 mm
L-TTSI002081BL-2	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	240	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B240		2.07 mm			19 mm	Not Qualified	e1	40	260	19 mm
TFRA84J131BL-21	Broadcom	FRAMER	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V	1.5,3.3	GRID ARRAY	BGA909,34X34,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B909		2.51 mm			35 mm	Not Qualified	e0	30	225	35 mm
TTSI2K32T	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.32 mm			23 mm	Not Qualified	e0	30	225	23 mm
TTSI016641BL-1	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B324		2.51 mm			23 mm	Not Qualified	e0	30	225	23 mm
T-8100A--BAL4-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.32 mm			23 mm	Not Qualified	e0			23 mm
T-8105---BAL4-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.32 mm			23 mm	Not Qualified	e0			23 mm
TTSI004161BL-2	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	240	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B240		2.07 mm			19 mm	Not Qualified	e0	30	225	19 mm
TFRA84J131BL-3	Broadcom	FRAMER	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V	1.5,3.3	GRID ARRAY	BGA909,34X34,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B909		2.51 mm			35 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	35 mm
T8100---BAL	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.13 mm			23 mm	Not Qualified	e0	30	225	23 mm
T8105---BAL3-BB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217		2.32 mm			23 mm	Not Qualified	e0	30	225	23 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.