FRAMER Digital Transmission Controllers 432

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS26519G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.925 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA484,22X22,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484	3	2.41 mm		CEPT PCM-30/E-1	23 mm	Not Qualified	e1	30	260	23 mm
DS26528GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.875 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e0			17 mm
DS26528GN+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.875 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e1	30	260	17 mm
DS34S132GN+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	676	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B676	3	2.41 mm			27 mm	Not Qualified				27 mm
DS2282/87-22282-000	Maxim Integrated	FRAMER	COMMERCIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	R-XSMA-N30						Not Qualified	e0
DS26556N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e0			17 mm
DS26504LN+T&R	Maxim Integrated	FRAMER																													NOT SPECIFIED	NOT SPECIFIED
DS34S102GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e0			17 mm
DS26502L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26502LN+T	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm			10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
DS34T101GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B484	3	2.41 mm			23 mm	Not Qualified	e0		245	23 mm
DS26502L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26519GNA2	Maxim Integrated	FRAMER																													NOT SPECIFIED	NOT SPECIFIED
DS26401N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.33 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.77 mm			17 mm	Not Qualified	e0			17 mm
DS33R11	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified	e0		245	27 mm
DS34S132GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	676	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B676		2.41 mm			27 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	27 mm
DS26528GA5	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	17 mm
DS26519GN+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.925 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA484,22X22,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484	3	2.41 mm		CEPT PCM-30/E-1	23 mm	Not Qualified	e1	30	260	23 mm
DS26556	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified			245	17 mm
DS26521L+	Maxim Integrated	FRAMER																			MATTE TIN			3						e3	30	260
DS26528GA5+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS26401N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.33 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.77 mm			17 mm	Not Qualified	e0			17 mm
DS26401A2	Maxim Integrated	FRAMER																													NOT SPECIFIED	NOT SPECIFIED
DS26401A2+	Maxim Integrated	FRAMER																													NOT SPECIFIED	NOT SPECIFIED
DS26504L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26514G	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	17 mm
DS34S104GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e0			17 mm
DS34S108DK-L7	Maxim Integrated	FRAMER																													NOT SPECIFIED	NOT SPECIFIED
DS34S101GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e1		225	17 mm
DS2282	Maxim Integrated	FRAMER	COMMERCIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	R-XSMA-N30						Not Qualified	e0
DS26514G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26528GNA4	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e0			17 mm
DS26504LNB2	Maxim Integrated	FRAMER																			MATTE TIN			3						e3	30	260
DS2141Q	Maxim Integrated	FRAMER		J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm			TIN LEAD	QUAD	S-PQCC-J44		4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS2182Q	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	4.57 mm			11.505 mm	Not Qualified	e0			11.505 mm
DS2151QB+T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS2151QN+	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44		4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e3			16.585 mm
DS2151QB/T&R+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.5862 mm	Not Qualified	e3			16.5862 mm
DS2155GNB	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B100	1		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified				10 mm
DS21FT42+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B300		2.54 mm			27 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	27 mm
DS2182N	Maxim Integrated	FRAMER	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	1	5.08 mm			15.24 mm	Not Qualified	e0			36.83 mm
DS2181AQN	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified	e0			16.585 mm
DS2180AQN+T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3			16.585 mm
DS2182AQN	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28		4.57 mm			11.505 mm	Not Qualified	e0			11.505 mm
DS2154L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2181AQN+T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3			16.585 mm
DS21455N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2156L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.