FRAMER Digital Transmission Controllers 432

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS21Q43AT+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS	5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e3			20 mm
DS2155LNB+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e3	30	260	14 mm
DS21Q41B	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	QFP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5 V	5	FLATPACK	QFP128,.63X.87,20	Digital Transmission Controllers	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQFP-G128						Not Qualified	e0
DS2151QN/T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e0			16.585 mm
DS2152LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm		T-1(DS1)	14 mm	Not Qualified	e3	30	260	14 mm
DS21Q44T	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87	Digital Transmission Controllers	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e0			20 mm
DS2156LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2155LC2+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2155LC1	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2154LNA2+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS21455N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified	e3			27 mm
DS2141QN	Maxim Integrated	FRAMER		J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V		CHIP CARRIER			1.27 mm			TIN LEAD	QUAD	S-PQCC-J44		4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS2155L-W	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2153Q	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44		4.572 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified	e0			16.585 mm
DS2180AQN+	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.5862 mm	Not Qualified	e3			16.5862 mm
DS2153QN+	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44		4.572 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified	e3			16.585 mm
DS2141AQ/T&R+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.5862 mm	Not Qualified	e3			16.5862 mm
DS21Q58L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS21FF44N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2180A+	Maxim Integrated	FRAMER	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDIP-T40	1	4.064 mm			15.24 mm	Not Qualified	e3	30	260	52.3875 mm
DS2155GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	GRID ARRAY, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B100	3		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS21FT42N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2143QN	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified	e0		245	16.585 mm
DS2156G	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B100	3		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS2196L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e0			14 mm
DS2180AN	Maxim Integrated	FRAMER	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T40	1	4.064 mm		T-1(DS1)	15.24 mm	Not Qualified	e0			52.3875 mm
DS2153QN-A7+T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm			16.5862 mm	Not Qualified	e3			16.5862 mm
DS2153Q-A7+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		CEPT PCM-30/E-1	16.5862 mm	Not Qualified	e3	30	260	16.5862 mm
DS2155GNC2+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e1			10 mm
DS2153QN-A7+	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		CEPT PCM-30/E-1	16.5862 mm	Not Qualified	e3	30	260	16.5862 mm
DS2141AQ+T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS2154LND2	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e0		245	14 mm
DS21Q43FP	Maxim Integrated	FRAMER		GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS	5 V		FLATPACK			.8 mm			TIN LEAD	QUAD	R-PQFP-G80		3.4 mm			14 mm	Not Qualified	e0			20 mm
DS2155GB/T&R	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B100			T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
DS2153Q-A7+T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm			16.5862 mm	Not Qualified	e3	30	260	16.5862 mm
DS2141	Maxim Integrated	FRAMER	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T40		5.08 mm			15.24 mm	Not Qualified	e0			52.075 mm
DS2155G/T&R	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	GRID ARRAY, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B100	3		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS2143	Maxim Integrated	FRAMER	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T40	1	5.08 mm		CEPT PCM-30/E-1	15.24 mm	Not Qualified	e0			52.075 mm
DS2141N	Maxim Integrated	FRAMER		THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5 V		IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T40		5.08 mm			15.24 mm	Not Qualified	e0			52.39 mm
DS2155GNB+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e1			10 mm
DS21Q44T+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87	Digital Transmission Controllers	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e3			20 mm
DS2155GNC2	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B100	3		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified				10 mm
DS2182QN/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	4.57 mm			11.505 mm	Not Qualified	e0			11.505 mm
DS2141AQN	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS2143QN+	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS21FT40N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B300		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2180AQN/T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS21458-W+	Maxim Integrated	FRAMER																		MATTE TIN									e3

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.