FRAMER Digital Transmission Controllers 432

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS2143QN/T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS2180AQ+T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3			16.585 mm
DS21Q41AFP	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		5 V	5	FLATPACK	QFP80,.7X.9,32	Digital Transmission Controllers	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	R-PQFP-G80		3.4 mm			14 mm	Not Qualified	e0			20 mm
DS2151QBX/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.5862 mm	Not Qualified	e0			16.5862 mm
DS2151Q+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44		4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e3			16.585 mm
DS21FT44N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B300	4	2.53 mm			27 mm	Not Qualified	e1	30	260	27 mm
DS21FF42N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21Q59DK	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	14 mm
DS2151QB+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS2153QN-A7/T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		CEPT PCM-30/E-1	16.5862 mm	Not Qualified	e0			16.5862 mm
DS21Q58LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2154N	Maxim Integrated	FRAMER		GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK						TIN LEAD	QUAD	S-PQFP-G100						Not Qualified	e0
DS21455+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified	e3			27 mm
DS2153QN-A7	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		CEPT PCM-30/E-1	16.5862 mm	Not Qualified	e0			16.5862 mm
DS2156L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2151Q	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44		4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e0			16.585 mm
DS21Q44TN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87	Digital Transmission Controllers	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e0			20 mm
DS2151QNB/T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e0			16.585 mm
DS2155LB	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G100	1	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified				14 mm
DS21Q42T	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Digital Transmission Controllers	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e0			20 mm
DS2181AQN+	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.5862 mm	Not Qualified	e3			16.5862 mm
DS21455	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2180AQ/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
IDT82V8313DR	Renesas Electronics	FRAMER	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	Digital Transmission Controllers	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm			28 mm	Not Qualified	e0			28 mm
IDT82V8313BBG	Renesas Electronics	FRAMER	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm			17 mm	Not Qualified	e1			17 mm
UPD72103L	Renesas Electronics	FRAMER		J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5	CHIP CARRIER	LDCC68,1.0SQ	Digital Transmission Controllers	1.27 mm			Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J68						Not Qualified	e0
IDT82V2108PXG	Renesas Electronics	FRAMER	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, FINE PITCH	QFP128,.67X.93,20	Digital Transmission Controllers	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm			14 mm	Not Qualified	e3			20 mm
IDT82V2108BB	Renesas Electronics	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.97 mm			13 mm	Not Qualified	e0	30	225	13 mm
UPD72103GC	Renesas Electronics	FRAMER		GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5	FLATPACK	QFP80,.7SQ	Digital Transmission Controllers	.635 mm			Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G80						Not Qualified	e0
UPD72103GF	Renesas Electronics	FRAMER		GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		5 V	5	FLATPACK	QFP80,.7X.9,32	Digital Transmission Controllers	.8 mm			Tin/Lead (Sn/Pb)	QUAD	R-PQFP-G80						Not Qualified	e0
UPD72103ALP	Renesas Electronics	FRAMER	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS	50 mA	5 V	5	CHIP CARRIER	LDCC68,1.0SQ	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J68						Not Qualified	e0
82V8313BBG	Renesas Electronics	FRAMER	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B208	3	1.97 mm			17 mm	Not Qualified	e1			17 mm
UPD72103CW	Renesas Electronics	FRAMER		THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		5 V	5	IN-LINE	DIP64(UNSPEC)	Digital Transmission Controllers				Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T64						Not Qualified	e0
UPD72103AGC-3B9	Renesas Electronics	FRAMER	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS	50 mA	5 V	5	FLATPACK	QFP80,.7SQ	Digital Transmission Controllers	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G80						Not Qualified	e0
82V8313DR	Renesas Electronics	FRAMER	INDUSTRIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		3.3 V	3.3	FLATPACK	QFP208,1.2SQ,20	Digital Transmission Controllers	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G208						Not Qualified	e0
82V2108PXG	Renesas Electronics	FRAMER	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, FINE PITCH	QFP128,.67X.93,20	Digital Transmission Controllers	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	3.4 mm			14 mm	Not Qualified	e3	30	260	20 mm
82V2108BB	Renesas Electronics	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.97 mm			13 mm	Not Qualified	e0	30	225	13 mm
82V2108PXGBBG	Renesas Electronics	FRAMER
TFRA08C13	Broadcom	FRAMER		BALL	352	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	8	CMOS		3.3 V		GRID ARRAY						TIN LEAD	BOTTOM	X-PBGA-B352						Not Qualified	e0	30	225
TFRA84J131BL-21	Broadcom	FRAMER	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V	1.5,3.3	GRID ARRAY	BGA909,34X34,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B909		2.51 mm			35 mm	Not Qualified	e0	30	225	35 mm
TFRA84J131BL-3	Broadcom	FRAMER	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V	1.5,3.3	GRID ARRAY	BGA909,34X34,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B909		2.51 mm			35 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	35 mm
T7230A--ML	Broadcom	FRAMER	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J68		5.08 mm			24.2316 mm	Not Qualified	e0	30	225	24.2316 mm
TFRA28J133BAL-1-DB	Broadcom	FRAMER	INDUSTRIAL	BALL	456	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B456		2.54 mm			35 mm	Not Qualified	e0	30	225	35 mm
T7230A--TL	Broadcom	FRAMER	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G80		1.6 mm			12 mm	Not Qualified	e0	30	240	12 mm
T-7630---TL-DB	Broadcom	FRAMER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G144		1.6 mm			20 mm	Not Qualified	e0	30	225	20 mm
TFRA08C13-DB	Broadcom	FRAMER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B352		2.54 mm			35 mm	Not Qualified	e0	30	225	35 mm
T-7633---TL-DB	Broadcom	FRAMER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G144		1.6 mm			20 mm	Not Qualified	e0	30	225	20 mm
L-TFRA84J131BL-3	Broadcom	FRAMER	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B909		2.51 mm			35 mm	Not Qualified	e1	40	250	35 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.