COMMERCIAL Digital Transmission Controllers 200

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	ISDN Access Rate	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS2141AQ+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			CHIP CARRIER			1.27 mm	70 Cel			MATTE TIN	QUAD		S-PQCC-J44		3	4.57 mm			16.585 mm	Not Qualified		e3	30	260	16.585 mm
DS2141AQ	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Digital Transmission Controllers	1.27 mm	70 Cel			TIN LEAD	QUAD		S-PQCC-J44		3	4.57 mm			16.585 mm	Not Qualified		e0			16.585 mm
DS2155L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	70 Cel			TIN LEAD	QUAD		S-PQFP-G100		3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified		e0			14 mm
DS2155L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	70 Cel			MATTE TIN	QUAD		S-PQFP-G100		3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified		e3	30	260	14 mm
DS2143Q	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel			TIN LEAD	QUAD		S-PQCC-J44		3	4.57 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified		e0		245	16.585 mm
DS2143Q+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			CHIP CARRIER			1.27 mm	70 Cel			MATTE TIN	QUAD		S-PQCC-J44		3	4.57 mm			16.585 mm	Not Qualified		e3	30	260	16.585 mm
DS3112+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel			MATTE TIN	BOTTOM		S-PBGA-B256		3	2.34 mm			27 mm	Not Qualified		e3			27 mm
DS3112	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B256		3	2.34 mm			27 mm	Not Qualified		e0			27 mm
DS3112DK	Analog Devices	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			GRID ARRAY			1.27 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B256			2.34 mm			27 mm	Not Qualified		e0			27 mm
TP3404V	Texas Instruments	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	BASIC	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	70 Cel	2.4 V	.4 V	TIN LEAD	QUAD	.144 Mbps	S-PQCC-J28	U	2A	4.57 mm			11.43 mm	Not Qualified	1 Amp	e0		245	11.43 mm
TP3404V/NOPB	Texas Instruments	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	BASIC	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	70 Cel	2.4 V	.4 V	MATTE TIN	QUAD	.144 Mbps	S-PQCC-J28	U	3	4.57 mm			11.43 mm	Not Qualified	1 Amp	e3	30	245	11.43 mm
TP3404V/63SN	Texas Instruments	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES				5 V	5	BASIC	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	70 Cel	2.4 V	.4 V	MATTE TIN	QUAD	.144 Mbps	S-PQCC-J28	U	2A					Not Qualified	1 Amp	e3	30	245
DS3171+	Analog Devices	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.273 mA	3.3 V	3.3		GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel			TIN SILVER COPPER	BOTTOM		S-PBGA-B400			2.54 mm			27 mm	Not Qualified		e1			27 mm
DS3173+	Analog Devices	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.449 mA	3.3 V	3.3		GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel			TIN SILVER COPPER	BOTTOM		S-PBGA-B400			2.54 mm			27 mm	Not Qualified		e1			27 mm
DS3112D1+	Analog Devices	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			GRID ARRAY			1.27 mm	70 Cel				BOTTOM		S-PBGA-B256		3	2.34 mm			27 mm	Not Qualified					27 mm
DS2155G/T	Analog Devices	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			GRID ARRAY, FINE PITCH			.8 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B100						10 mm	Not Qualified		e0			10 mm
DS21Q59L+	Analog Devices	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel			MATTE TIN	QUAD		S-PQFP-G100		3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified		e3	30	260	14 mm
PEB2055-N	Infineon Technologies	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0095 mA	5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel			Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44			4.57 mm			16.6 mm	Not Qualified		e0			16.6 mm
PEB2035-N	Infineon Technologies	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.018 mA	5 V	5		CHIP CARRIER	LDCC44,.7SQ	Digital Transmission Controllers	1.27 mm	70 Cel			TIN LEAD	QUAD		S-PQCC-J44			4.57 mm			16.6 mm	Not Qualified		e0			16.6 mm
PEB20560V2.1	Infineon Technologies	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.115 mA	3.3 V	3.3		FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.65 mm	70 Cel				QUAD		S-PQFP-G160			2.75 mm			28 mm	Not Qualified					28 mm
PEB2054-N	Infineon Technologies	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0095 mA	5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel			Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44			4.57 mm			16.6 mm	Not Qualified		e0			16.6 mm
PEB2035-P	Infineon Technologies	FRAMER	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.018 mA	5 V	5		IN-LINE	DIP40,.6	Digital Transmission Controllers	2.54 mm	70 Cel			TIN LEAD	DUAL		R-PDIP-T40			5.1 mm			15.24 mm	Not Qualified		e0			50.9 mm
PEB2052-N	Infineon Technologies	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel			Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44			4.57 mm			16.6 mm	Not Qualified		e0			16.6 mm
PEB2055	Infineon Technologies	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	9.5 mA	5 V			CHIP CARRIER			1.27 mm	70 Cel				QUAD		S-PQCC-J44			4.57 mm			16.6 mm	Not Qualified					16.6 mm
PEB2035A3P	Infineon Technologies	FRAMER	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		5 V	5		IN-LINE	DIP40,.6	Digital Transmission Controllers	2.54 mm	70 Cel			Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40							Not Qualified		e0
PEB2030	Infineon Technologies	FRAMER	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC	NO		MOS					IN-LINE	DIP24,.6	Digital Transmission Controllers	2.54 mm	70 Cel			Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T24							Not Qualified		e0
PEB2035N-VB1	Infineon Technologies	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Digital Transmission Controllers	1.27 mm	70 Cel			Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44							Not Qualified		e0
PEB20256E	Infineon Technologies	FRAMER	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V			GRID ARRAY			1.27 mm	70 Cel				BOTTOM		S-PBGA-B388			2.54 mm			35 mm	Not Qualified					35 mm
PEB20550	Infineon Technologies	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.015 mA	5 V	5		FLATPACK	QFP80,.7SQ	Other Telecom ICs	.65 mm	70 Cel			TIN LEAD	QUAD		S-PQFP-G80			2.45 mm			14 mm	Not Qualified		e0			14 mm
PEB2054	Infineon Technologies	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	9.5 mA	5 V			CHIP CARRIER			1.27 mm	70 Cel				QUAD		S-PQCC-J44			4.57 mm			16.6 mm	Not Qualified					16.6 mm
PEB2035-C	Infineon Technologies	FRAMER	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS	18 mA	5 V	5		IN-LINE	DIP40,.6	Digital Transmission Controllers	2.54 mm	70 Cel			Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40							Not Qualified		e0
PEB2035A3N	Infineon Technologies	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Digital Transmission Controllers	1.27 mm	70 Cel			Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44							Not Qualified		e0
PEB2035P-VB1	Infineon Technologies	FRAMER	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		5 V	5		IN-LINE	DIP40,.6	Digital Transmission Controllers	2.54 mm	70 Cel			Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40							Not Qualified		e0
DS3172	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3		GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B400			2.54 mm			27 mm	Not Qualified		e0			27 mm
DS3172+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3		GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel			TIN SILVER COPPER	BOTTOM		S-PBGA-B400		3	2.54 mm			27 mm	Not Qualified		e1			27 mm
DS3144	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.32 mA	3.3 V	3.3		GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B144		3	1.75 mm			13 mm	Not Qualified		e0			13 mm
DS3142	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.17 mA	3.3 V	3.3		GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B144		3	1.75 mm			13 mm	Not Qualified		e0			13 mm
DS3120	Maxim Integrated	FRAMER	COMMERCIAL	BALL	316	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V			GRID ARRAY			1.27 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B316			2.53 mm			27 mm	Not Qualified		e0			27 mm
DS3112+W	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			GRID ARRAY			1.27 mm	70 Cel			MATTE TIN	BOTTOM		S-PBGA-B256		3	2.34 mm			27 mm	Not Qualified		e3			27 mm
DS3142+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			GRID ARRAY			1 mm	70 Cel				BOTTOM		S-PBGA-B144			1.75 mm			13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm
DS3148	Maxim Integrated	FRAMER	COMMERCIAL	BALL	349	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.64 mA	3.3 V	3.3		GRID ARRAY, HEAT SINK/SLUG	BGA349,19X19,50	Digital Transmission Controllers	1.27 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B349			2.35 mm			27 mm	Not Qualified		e0			27 mm
DS3160	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel			TIN LEAD	QUAD		S-PQFP-G100			1.6 mm			14 mm	Not Qualified		e0			14 mm
DS3112D1	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			GRID ARRAY			1.27 mm	70 Cel				BOTTOM		S-PBGA-B256		3	2.34 mm			27 mm	Not Qualified					27 mm
DS3141	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3		GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B144		3	1.75 mm			13 mm	Not Qualified		e0			13 mm
DS3142N+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			GRID ARRAY			1 mm	70 Cel				BOTTOM		S-PBGA-B144			1.75 mm			13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm
DS3173	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.449 mA	3.3 V	3.3		GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B400			2.54 mm			27 mm	Not Qualified		e0			27 mm
DS3174	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.725 mA	3.3 V	3.3		GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel			TIN LEAD	BOTTOM		S-PBGA-B400			2.54 mm			27 mm	Not Qualified		e0			27 mm
DS3141+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			GRID ARRAY			1 mm	70 Cel			TIN SILVER COPPER	BOTTOM		S-PBGA-B144		3	1.75 mm			13 mm	Not Qualified		e1			13 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.