COMMERCIAL Digital Transmission Controllers 200

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS2182QN/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	4.57 mm			11.505 mm	Not Qualified	e0			11.505 mm
DS2153Q-A7	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		CEPT PCM-30/E-1	16.5862 mm	Not Qualified	e0			16.5862 mm
DS2154LD2+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e3	30	260	14 mm
DS2180AQ+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.5862 mm	Not Qualified	e3			16.5862 mm
DS2154LD2	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e0		245	14 mm
DS2182QN+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-J28	1	4.57 mm			11.5062 mm	Not Qualified	e3		245	11.5062 mm
DS21Q58L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS21FT42	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS21458+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e1			17 mm
DS2151QBX2/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.5862 mm	Not Qualified	e0			16.5862 mm
DS2154LD1	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0		245	14 mm
DS2182A	Maxim Integrated	FRAMER	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.08 mm			15.24 mm	Not Qualified	e0			36.83 mm
DS2143Q/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS2155GC2	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	70 Cel		BOTTOM	S-PBGA-B100	1		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified				10 mm
DS2151QBX	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.5862 mm	Not Qualified	e0		245	16.5862 mm
DS2182Q/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	4.57 mm			11.505 mm	Not Qualified	e0			11.505 mm
DS21FT44	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2154LA2	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e0		245	14 mm
DS2151QBX2	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.5862 mm	Not Qualified	e0			16.5862 mm
DS2181AQ	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified	e0			16.585 mm
DS2181AQ/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0	20	240	16.585 mm
DS2155LB+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS21Q59L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2181A	Maxim Integrated	FRAMER	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel	TIN LEAD	DUAL	R-PDIP-T40	1	4.064 mm		CEPT PCM-30/E-1	15.24 mm	Not Qualified	e0			52.3875 mm
DS2182AQ	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J28		4.57 mm			11.505 mm	Not Qualified	e0			11.505 mm
DS21FF42	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2152L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm		T-1(DS1)	14 mm	Not Qualified	e0	20	240	14 mm
DS21Q43AT	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87	Digital Transmission Controllers	.5 mm	70 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e0			20 mm
DS2154L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0	20	240	14 mm
DS2155LC2	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2155G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	70 Cel	MATTE TIN	BOTTOM	S-PBGA-B100	3			CEPT PCM-30/E-1	10 mm	Not Qualified	e3			10 mm
DS2180AQ+T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3			16.585 mm
DS21Q41AFP	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		5 V	5	FLATPACK	QFP80,.7X.9,32	Digital Transmission Controllers	.8 mm	70 Cel	TIN LEAD	QUAD	R-PQFP-G80		3.4 mm			14 mm	Not Qualified	e0			20 mm
DS2151QBX/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.5862 mm	Not Qualified	e0			16.5862 mm
DS2151Q+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-J44		4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e3			16.585 mm
DS2151QB+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS21455+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified	e3			27 mm
DS2156L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2151Q	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44		4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e0			16.585 mm
DS2155LB	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel		QUAD	S-PQFP-G100	1	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified				14 mm
DS21Q42T	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Digital Transmission Controllers	.5 mm	70 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e0			20 mm
DS21455	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2180AQ/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
L-T-8100A--SC4-DB	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN BISMUTH	QUAD	S-PQFP-G208		4.1 mm			28 mm	Not Qualified	e6			28 mm
T8100---SC	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm			28 mm	Not Qualified	e0	30	225	28 mm
T8105---SC-DB	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm			28 mm	Not Qualified	e0	30	225	28 mm
T8102---SC3-DB	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm			28 mm	Not Qualified	e0	30	225	28 mm
T8102---SC-DB	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm			28 mm	Not Qualified	e0	30	225	28 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.