COMMERCIAL Digital Transmission Controllers 200

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS3170+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	70 Cel	MATTE TIN	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e3			11 mm
DS3143	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.25 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3174+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e1			27 mm
DS31412	Maxim Integrated	FRAMER	COMMERCIAL	BALL	349	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.96 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA349,19X19,50	Digital Transmission Controllers	1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B349		2.35 mm			27 mm	Not Qualified	e0			27 mm
DS3170	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e0			11 mm
DS3146	Maxim Integrated	FRAMER	COMMERCIAL	BALL	349	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.48 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA349,19X19,50	Digital Transmission Controllers	1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B349		2.35 mm			27 mm	Not Qualified	e0			27 mm
DS3171	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3134	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.34 mm			27 mm	Not Qualified	e0			27 mm
DS3170L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS26528G	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.875 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e0			17 mm
DS26519G	Maxim Integrated	FRAMER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.925 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA484,22X22,40	Other Telecom ICs	1 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B484	3	2.41 mm		CEPT PCM-30/E-1	23 mm	Not Qualified	e0		245	23 mm
DS26528G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.875 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e1	30	260	17 mm
DS26522G	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.22 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	70 Cel		BOTTOM	S-PBGA-B144	3	1.75 mm	T-1(DS1)	CEPT PCM-30/E-1	13 mm	Not Qualified				13 mm
DS26503L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26528	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	70 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS26518G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	UNSPECIFIED	YES	1		.45 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	TIN SILVER COPPER	BOTTOM	S-XBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e1	30	260	17 mm
DS26401	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.33 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.77 mm			17 mm	Not Qualified	e0			17 mm
DS26528GA3	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS26401+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.78 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26528GA2	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS26518G	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	UNSPECIFIED	YES	1		.45 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel		BOTTOM	S-XBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified			245	17 mm
DS26503L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26504L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26519G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.925 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA484,22X22,40	Other Telecom ICs	1 mm	70 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484	3	2.41 mm		CEPT PCM-30/E-1	23 mm	Not Qualified	e1	30	260	23 mm
DS26522G+	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.22 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	70 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.75 mm	T-1(DS1)	CEPT PCM-30/E-1	13 mm	Not Qualified	e1	30	260	13 mm
DS2282/87-22282-000	Maxim Integrated	FRAMER	COMMERCIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY				70 Cel	TIN LEAD	SINGLE	R-XSMA-N30						Not Qualified	e0
DS26502L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26502L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26528GA5	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel		BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	17 mm
DS26556	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified			245	17 mm
DS26528GA5+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS26504L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26514G	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel		BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	17 mm
DS26524G	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.45 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e0			17 mm
DS2282	Maxim Integrated	FRAMER	COMMERCIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY				70 Cel	TIN LEAD	SINGLE	R-XSMA-N30						Not Qualified	e0
DS26514G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26524G+	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.45 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e1			17 mm
DS2182Q	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	4.57 mm			11.505 mm	Not Qualified	e0			11.505 mm
DS2151QB+T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS2151QB/T&R+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.5862 mm	Not Qualified	e3			16.5862 mm
DS21FT42+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel		BOTTOM	S-PBGA-B300		2.54 mm			27 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	27 mm
DS2182N	Maxim Integrated	FRAMER	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	TIN LEAD	DUAL	R-PDIP-T28	1	5.08 mm			15.24 mm	Not Qualified	e0			36.83 mm
DS2154L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2156L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2141AQ/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS2156G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	70 Cel	MATTE TIN	BOTTOM	S-PBGA-B100			T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3			10 mm
DS2143Q+T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS21FT40	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B300		2.54 mm			27 mm	Not Qualified	e0			27 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.