Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
.000285 mA |
3/3.3 |
CHIP CARRIER |
LCC20,.20SQ,25 |
Modems |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N20 |
1 |
Not Qualified |
e3 |
||||||||||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.000285 mA |
3/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.20SQ,25 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.0012 Mbps |
S-XQCC-N20 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
260 |
4 mm |
|||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.0048 Mbps |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF |
e4 |
30 |
260 |
4 mm |
|||||||||||
Microchip Technology |
PROGRAMMABLE MODEM |
INDUSTRIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.2 mm |
7 mm |
7 mm |
|||||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.15SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||||
Microchip Technology |
PROGRAMMABLE MODEM |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.25SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
.9 mm |
6 mm |
6 mm |
|||||||||||||||||
Microchip Technology |
PROGRAMMABLE MODEM |
INDUSTRIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.2 mm |
7 mm |
7 mm |
|||||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15.5 mA |
3/3.3 |
FLATPACK |
TQFP32,.35SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G32 |
Not Qualified |
|||||||||||||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.0048 Mbps |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
GULL WING |
48 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.2304 Mbps |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
|||||||||||
Synaptics |
MODEM-DATA/FAX/VOICE |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 mA |
3.3 V |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
.8 mm |
70 Cel |
14.4 kbps |
0 Cel |
QUAD |
.056 Mbps |
S-PQFP-G32 |
1.6 mm |
7 mm |
7 mm |
|||||||||||||||
|
Conexant Systems |
MODEM |
COMMERCIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Modems |
.65 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
.002 Mbps |
S-XQCC-N16 |
1 |
.9 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.15SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.03125 Mbps |
S-PQFP-G32 |
3 |
1.2 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
|||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN/NICKEL PALLADIUM GOLD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
e3/e4 |
40 |
260 |
11.4808 mm |
||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.03125 Mbps |
S-PQFP-G32 |
3 |
1.2 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
|||||||||||
Microchip Technology |
PROGRAMMABLE MODEM |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.25SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
.9 mm |
6 mm |
6 mm |
|||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQFP-G52 |
2.43 mm |
10 mm |
Not Qualified |
FULL DUPLEX |
10 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
S-PQFP-G52 |
2.43 mm |
10 mm |
Not Qualified |
FULL DUPLEX |
10 mm |
|||||||||||||||
Texas Instruments |
MODEM-MODULATOR |
GULL WING |
48 |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK |
QUAD |
S-PQFP-G48 |
Not Qualified |
|||||||||||||||||||||||||||
Texas Instruments |
MODEM-MODULATOR |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.75 V |
3.75 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||
Texas Instruments |
MODEM-MODULATOR |
INDUSTRIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.75 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.2 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
208 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
6 Mbps |
S-PQFP-G208 |
4.1 mm |
28 mm |
Not Qualified |
28 mm |
||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
208 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
6 Mbps |
S-PQFP-G208 |
4.1 mm |
28 mm |
Not Qualified |
28 mm |
||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
S-PQFP-G52 |
2.43 mm |
10 mm |
Not Qualified |
FULL DUPLEX |
10 mm |
|||||||||||||||
|
Texas Instruments |
MODEM |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
33 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
120 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
2 |
e4 |
30 |
260 |
||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J44 |
5.08 mm |
16.5862 mm |
Not Qualified |
FULL DUPLEX |
16.5862 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
FULL DUPLEX |
10 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
S-PQCC-J44 |
5.08 mm |
16.5862 mm |
Not Qualified |
FULL DUPLEX |
16.5862 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J44 |
5.08 mm |
16.5862 mm |
Not Qualified |
16.5862 mm |
||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.