SQUARE Modems 210

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Fax Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ST75C540FP-A	STMicroelectronics	MODEM-DATA/FAX/VOICE	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			.165 mA	5 V	5	FLATPACK, LOW PROFILE	QFP80,.64SQ	Modems	.65 mm	70 Cel	14.4 kbps	0 Cel	NICKEL PALLADIUM GOLD	QUAD	.0144 Mbps	S-PQFP-G80		1.6 mm	14 mm	Not Qualified		e4			14 mm
STLC60135	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G144		4.07 mm	28 mm	Not Qualified		e4			28 mm
ST7546CQFP	STMicroelectronics		COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS				3.3/5,5	FLATPACK	QFP44,.63SQ,40	Modems	1 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G44				Not Qualified		e0
STLC7546CFN	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3/5,5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified		e3			11.5062 mm
ST75C50	STMicroelectronics	MODEM-DATA/FAX/VOICE	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			.65 mm	70 Cel	14.4 kbps	0 Cel		QUAD	.0144 Mbps	S-PQFP-G160		4.07 mm	28 mm	Not Qualified	FULL DUPLEX				28 mm
STLC7546TQFP4Y	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	3.3/5,5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQFP-G44		1.6 mm	10 mm	Not Qualified		e0			10 mm
STLC7545TQFP4Y	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	3.3/5,5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	.0384 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified		e4			10 mm
STLC7550TQFP	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified		e0			10 mm
ST75C540TQFP	STMicroelectronics	MODEM-DATA/FAX	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			.165 mA	5 V	5	FLATPACK, LOW PROFILE	QFP80,.64SQ	Modems	.65 mm	70 Cel	14.4 kbps	0 Cel	TIN LEAD	QUAD	.0144 Mbps	S-PQFP-G80		1.6 mm	14 mm	Not Qualified		e0			14 mm
TS75C961CFN-S	STMicroelectronics	MODEM	COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.0096 Mbps	S-PQCC-J52		5.08 mm	19.1262 mm	Not Qualified	DATA RATE MIN:300BPS	e0			19.1262 mm
STLC1510	STMicroelectronics	MODEM	INDUSTRIAL	BALL	132	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA132,14X14,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	MATTE TIN	BOTTOM	1.5 Mbps	S-PBGA-B132	1	1.7 mm	12 mm	Not Qualified		e3			12 mm
ST7537	STMicroelectronics	MODEM	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES						5,10	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28				Not Qualified		e0
STLC75C53TQFP	STMicroelectronics	MODEM	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES				200 mA	5 V	5	FLATPACK	QFP80,.63SQ,32	Modems	.8 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G80				Not Qualified		e0
ST70135A	STMicroelectronics	MODEM	COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK	QFP144,1.2SQ	Modems	.65 mm	70 Cel		0 Cel	TIN LEAD	QUAD	8 Mbps	S-PQFP-G144		4.07 mm	28 mm	Not Qualified		e0			28 mm
STLC60134TR	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD	8 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	DATA RATE:1MBPS UPSTREAM WITH 32KBPS GRANULARITY				10 mm
STLC7550	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified		e0			10 mm
STLC60134S	STMicroelectronics	MODEM-SUPPORT CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3/3.3,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	80 Cel		-40 Cel	TIN LEAD	QUAD	.008192 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	DATA RATE: 640K BITS/SEC UPSTREAM	e0			10 mm
ST7544CFN	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		37 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Modems	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD	.0288 Mbps	S-PQCC-J44		4.57 mm	16.5862 mm	Not Qualified		e3			16.5862 mm
ST7538P	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BCDMOS			5 V	5,9	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.0048 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified	HALF DUPLEX	e4			10 mm
E-STLC7550TQF7	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel		QUAD	.056 Mbps	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e3/e4			7 mm
TS7514CFNTR	STMicroelectronics	PROGRAMMABLE MODEM	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	-5 V		5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
ST75C530TQFP	STMicroelectronics	MODEM-DATA/FAX	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			.15 mA	5 V	5	FLATPACK, LOW PROFILE	QFP80,.64SQ	Modems	.65 mm	70 Cel	14.4 kbps	0 Cel	TIN LEAD	QUAD	.0144 Mbps	S-PQFP-G80		1.6 mm	14 mm	Not Qualified		e0			14 mm
UCB1100LP/X3	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel	TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
TDA8263HN/C1,518	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4			5 mm
UCB1300BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
UCB1200BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
TDA8296HN	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40		SQUARE	PLASTIC/EPOXY	YES							CHIP CARRIER								QUAD		S-PQCC-N40				Not Qualified
TDA8262HN	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-20 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
UCB1300BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
UCB1200BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
TDA8262HN/C1,118	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4			5 mm
TDA8263HN	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
935288611518	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V				6 mm
935288611557	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V				6 mm
935288611551	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V				6 mm
PEF22827ELV1.1	Infineon Technologies	MODEM	INDUSTRIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	YES						1.8,3.3	GRID ARRAY, FINE PITCH	BGA225,15X15,32	Modems	.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B225	3			Not Qualified				235
PEF22827ELV1.1-G	Infineon Technologies	MODEM	INDUSTRIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	YES						1.8,3.3	GRID ARRAY, FINE PITCH	BGA225,15X15,32	Modems	.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B225				Not Qualified
VDSL6100I	Infineon Technologies	MODEM	INDUSTRIAL	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	YES						1.8,3.3	GRID ARRAY, FINE PITCH	BGA225,15X15,32	Modems	.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B225				Not Qualified
SAB82511-N	Infineon Technologies	MODEM	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		290 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Modems	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44				Not Qualified		e0
MAX2395ETI	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD		S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e0			5 mm
73K324L-28IHR/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28		4.572 mm	11.54 mm	Not Qualified					11.54 mm
MAX2980CCB-T	Maxim Integrated		COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			3.3 V	3.3	FLATPACK	QFP64,.47SQ,20	Modems	.5 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G64				Not Qualified		e0
MAX2395EGI	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD		S-XQCC-N28	1	.9 mm	5 mm	Not Qualified		e0			5 mm
73M2901CE-IM/F	Maxim Integrated	MODEM	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				15.5 mA		3/3.3	CHIP CARRIER	LCC32,.2SQ,20	Modems	.5 mm	85 Cel		-40 Cel		QUAD		S-PQCC-N32	3			Not Qualified			30	260
73K222AL-IH	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.012 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.572 mm	11.5062 mm	Not Qualified	FULL DUPLEX				11.5062 mm
MAX2395ETI+	Maxim Integrated	MODEM-MODULATOR	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
73M2901CE-IMR/F	Maxim Integrated	MODEM	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				15.5 mA		3/3.3	CHIP CARRIER	LCC32,.2SQ,20	Modems	.5 mm	85 Cel		-40 Cel		QUAD		S-PQCC-N32	3			Not Qualified			30	260
73M2901CL-IGT/F	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	40	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	S-PQFP-G40		1.6 mm	10 mm	Not Qualified					10 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.