Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
28 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.0048 Mbps |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
28 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.0048 Mbps |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.0048 Mbps |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.0048 Mbps |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0096 Mbps |
S-PQCC-J52 |
5.08 mm |
19.1262 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
19.1262 mm |
|||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
480 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
.0024 Mbps |
R-PDIP-T48 |
5.08 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
-5 V |
.04 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
e0 |
36.83 mm |
||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
FLATPACK, LOW PROFILE |
QFP80,.63SQ,32 |
Modems |
.65 mm |
70 Cel |
14.4 kbps |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
1.6 mm |
14 mm |
Not Qualified |
FAX RATE MIN:2.4KBPS |
e0 |
14 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
20 mA |
5 V |
+-5 |
IN-LINE |
DIP22,.4 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
e0 |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.04 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0096 Mbps |
S-PQCC-J52 |
5.08 mm |
19.1262 mm |
Not Qualified |
e0 |
19.1262 mm |
|||||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3,5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e4 |
10 mm |
|||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Modems |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.1 mA |
5 V |
5 |
FLATPACK |
QFP64,.66SQ,32 |
Modems |
.8 mm |
70 Cel |
14.4 kbps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3.4 mm |
14 mm |
Not Qualified |
FAX RATE MIN:2.4KBPS |
e4 |
14 mm |
|||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3,5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA64,8X8,32 |
Other Telecom ICs |
.8 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
1.7 mm |
8 mm |
Not Qualified |
e1 |
8 mm |
|||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
-5 V |
125 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
Not Qualified |
HALF DUPLEX; FULL DUPLEX |
e0 |
||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
-5 V |
30 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T28 |
Not Qualified |
|||||||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
3.3/5,5 |
CHIP CARRIER |
LDCC44,.7SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
.0384 Mbps |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
e3 |
16.5862 mm |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
37 mA |
5 V |
5 |
FLATPACK, LOW PROFILE |
QFP44,.63SQ,40 |
Modems |
1 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0192 Mbps |
S-PQFP-G44 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
.0384 Mbps |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
16.5862 mm |
||||||||||||||||
STMicroelectronics |
PROGRAMMABLE MODEM |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
||||||||
STMicroelectronics |
MODEM-DATA/FAX/VOICE |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Modems |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Modems |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0192 Mbps |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
DATA RATE MIN:1.2KBPS |
e0 |
36.83 mm |
|||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0096 Mbps |
R-PDIP-T48 |
15.24 mm |
Not Qualified |
e0 |
|||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, LOW PROFILE |
.8 mm |
70 Cel |
0 Cel |
QUAD |
.0384 Mbps |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||
STMicroelectronics |
MODEM |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
30 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
85 Cel |
-25 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
e0 |
36.83 mm |
||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0192 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
DATA RATE MIN:1.2KBPS |
e0 |
11.5062 mm |
||||||||||||
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
8 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
DATA RATE:1MBPS UPSTREAM WITH 32KBPS GRANULARITY |
e0 |
10 mm |
|||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
35 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC44,.7SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0096 Mbps |
S-PQCC-J44 |
4.15 mm |
16.5862 mm |
Not Qualified |
e0 |
16.5862 mm |
|||||||||
STMicroelectronics |
MODEM |
GULL WING |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, LOW PROFILE |
.65 mm |
14.4 kbps |
QUAD |
S-PQFP-G80 |
1.6 mm |
14 mm |
Not Qualified |
FAX RATE MIN:2.4KBPS |
14 mm |
|||||||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
35 mA |
5 V |
+-5 |
IN-LINE |
DIP40,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0096 Mbps |
R-PDIP-T40 |
5.08 mm |
15.24 mm |
Not Qualified |
e0 |
||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
BIPOLAR |
-5 V |
125 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-CDIP-T28 |
5.72 mm |
15.24 mm |
Not Qualified |
HALF DUPLEX; FULL DUPLEX |
e0 |
37.215 mm |
|||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
-5 V |
30 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
|||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0096 Mbps |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
36.83 mm |
||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
37 mA |
5 V |
5 |
FLATPACK, LOW PROFILE |
QFP44,.63SQ,40 |
Modems |
1 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0288 Mbps |
S-PQFP-G44 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
|||||||||
STMicroelectronics |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
20 mA |
5 V |
+-5 |
IN-LINE |
DIP22,.4 |
Modems |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
e0 |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
-5 V |
150 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
e0 |
|||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
130 mA |
5 V |
5 |
FLATPACK |
QFP64,.66SQ,32 |
Modems |
.8 mm |
70 Cel |
14.4 kbps |
0 Cel |
TIN LEAD |
QUAD |
.0144 Mbps |
S-PQFP-G64 |
3.4 mm |
14 mm |
Not Qualified |
FULL DUPLEX |
e0 |
14 mm |
|||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
11.5062 mm |
||||||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0096 Mbps |
S-PQCC-J52 |
5.08 mm |
19.1262 mm |
Not Qualified |
e0 |
19.1262 mm |
|||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0096 Mbps |
R-PDIP-T48 |
15.24 mm |
Not Qualified |
e0 |
|||||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
30 mA |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
.0024 Mbps |
S-PQCC-J52 |
5.08 mm |
19.1262 mm |
Not Qualified |
FULL DUPLEX |
19.1262 mm |
|||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP48,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0096 Mbps |
R-PDIP-T48 |
15.24 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
|||||||||||
|
STMicroelectronics |
PROGRAMMABLE MODEM |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
IN-LINE |
DIP24,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.0012 Mbps |
R-PDIP-T24 |
15.24 mm |
Not Qualified |
e3 |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Modems |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.