Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
10 V |
5,10 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
.0024 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e3 |
11.5062 mm |
||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
-5 V |
125 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
|||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
IN-LINE |
DIP24,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T24 |
15.24 mm |
Not Qualified |
e0 |
|||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
37 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0192 Mbps |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
e0 |
16.5862 mm |
|||||||||
|
STMicroelectronics |
MODEM-DATA/FAX/VOICE |
COMMERCIAL |
GULL WING |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.15 mA |
5 V |
5 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
Modems |
.65 mm |
70 Cel |
14.4 kbps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.0144 Mbps |
S-PQFP-G80 |
1.6 mm |
14 mm |
Not Qualified |
e4 |
14 mm |
||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
1.8,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12.03 Mbps |
S-PQFP-G144 |
1.6 mm |
20 mm |
Not Qualified |
IT ALSO REQUIRES 3.3V SUPPLY |
e4 |
20 mm |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
.04 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e0 |
11.5062 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0096 Mbps |
S-PQCC-J52 |
5.08 mm |
19.1262 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
19.1262 mm |
|||||||||
STMicroelectronics |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
3.3/5,5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0096 Mbps |
S-PQCC-J52 |
5.08 mm |
19.1262 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
19.1262 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
35 mA |
5 V |
+-5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
-10 Cel |
TIN LEAD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
HALF DUPLEX |
e0 |
11.5062 mm |
||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP48,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0096 Mbps |
R-PDIP-T48 |
15.24 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
|||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
35 mA |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
-10 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
HALF DUPLEX |
11.5062 mm |
|||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0096 Mbps |
R-PDIP-T48 |
15.24 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
|||||||||||||||
|
STMicroelectronics |
MODEM-DATA/FAX/VOICE |
COMMERCIAL |
GULL WING |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.165 mA |
5 V |
5 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
Modems |
.65 mm |
70 Cel |
14.4 kbps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.0144 Mbps |
S-PQFP-G80 |
1.6 mm |
14 mm |
Not Qualified |
e4 |
14 mm |
||||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G144 |
4.07 mm |
28 mm |
Not Qualified |
e4 |
28 mm |
|||||||||||||
STMicroelectronics |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
3.3/5,5 |
FLATPACK |
QFP44,.63SQ,40 |
Modems |
1 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G44 |
Not Qualified |
e0 |
|||||||||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3/5,5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e3 |
11.5062 mm |
||||||||||
STMicroelectronics |
MODEM-DATA/FAX/VOICE |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
.65 mm |
70 Cel |
14.4 kbps |
0 Cel |
QUAD |
.0144 Mbps |
S-PQFP-G160 |
4.07 mm |
28 mm |
Not Qualified |
FULL DUPLEX |
28 mm |
||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
3.3/5,5 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Modems |
.8 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
3.3/5,5 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Modems |
.8 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.0384 Mbps |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
e4 |
10 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
30 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
.0024 Mbps |
R-PDIP-T48 |
5.08 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Modems |
.8 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||
STMicroelectronics |
MODEM-DATA/FAX |
COMMERCIAL |
GULL WING |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.165 mA |
5 V |
5 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
Modems |
.65 mm |
70 Cel |
14.4 kbps |
0 Cel |
TIN LEAD |
QUAD |
.0144 Mbps |
S-PQFP-G80 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
30 mA |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
e0 |
36.83 mm |
||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
.0096 Mbps |
R-PDIP-T48 |
15.24 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
|||||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.0096 Mbps |
S-PQCC-J52 |
5.08 mm |
19.1262 mm |
Not Qualified |
DATA RATE MIN:300BPS |
e0 |
19.1262 mm |
|||||||||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
BALL |
132 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
2.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA132,14X14,32 |
Other Telecom ICs |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
1.5 Mbps |
S-PBGA-B132 |
1 |
1.7 mm |
12 mm |
Not Qualified |
e3 |
12 mm |
|||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5,10 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
200 mA |
5 V |
5 |
FLATPACK |
QFP80,.63SQ,32 |
Modems |
.8 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G80 |
Not Qualified |
e0 |
|||||||||||||||
STMicroelectronics |
MODEM |
COMMERCIAL |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3 |
FLATPACK |
QFP144,1.2SQ |
Modems |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
8 Mbps |
S-PQFP-G144 |
4.07 mm |
28 mm |
Not Qualified |
e0 |
28 mm |
||||||||||
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
8 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
DATA RATE:1MBPS UPSTREAM WITH 32KBPS GRANULARITY |
10 mm |
|||||||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Modems |
.8 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
OTHER |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Other Telecom ICs |
.5 mm |
80 Cel |
-40 Cel |
TIN LEAD |
QUAD |
.008192 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
DATA RATE: 640K BITS/SEC UPSTREAM |
e0 |
10 mm |
|||||||||
STMicroelectronics |
MODEM-DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
35 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
.0096 Mbps |
R-PDIP-T48 |
5.08 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
||||||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
37 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
.0288 Mbps |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
e3 |
16.5862 mm |
||||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.0048 Mbps |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
HALF DUPLEX |
e4 |
10 mm |
||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MODEM-MODULATOR |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
35 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
.0096 Mbps |
R-PDIP-T48 |
5.08 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
||||||||||||||
|
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Modems |
.5 mm |
70 Cel |
0 Cel |
QUAD |
.056 Mbps |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
Not Qualified |
e3/e4 |
7 mm |
|||||||||
STMicroelectronics |
PROGRAMMABLE MODEM |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-5 V |
5 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
11.5062 mm |
||||||||||||||
STMicroelectronics |
MODEM-DATA/FAX |
COMMERCIAL |
GULL WING |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.15 mA |
5 V |
5 |
FLATPACK, LOW PROFILE |
QFP80,.64SQ |
Modems |
.65 mm |
70 Cel |
14.4 kbps |
0 Cel |
TIN LEAD |
QUAD |
.0144 Mbps |
S-PQFP-G80 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.