28 Network Interfaces 63

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC33889BPEGR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.045 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	.125 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
NE83C92A	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS							CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
NQ83C92A	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		-9 V	1	130 mA		-9	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified		e0			11.505 mm
NQ83C92C	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		-9 V	1	120 mA		-9	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28				Not Qualified		e0
DP83TC813RRHFRQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	28	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.16X.2,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	R-PQCC-N28	2	1 mm	4 mm		the 1.25-Gbps rate of the SGMII is excessive	e4		260	5 mm
MCZ33889DEG	Freescale Semiconductor	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.018 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.125 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
MCZ33889BEG	Freescale Semiconductor	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.018 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.125 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
MCZ33989EG	Freescale Semiconductor	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
78Q8392L-28CH/F	Analog Devices	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	28	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		-9 V	1	.065 mA	9 V	+-9	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel		QUAD	10 Mbps	S-PQCC-N28		4.572 mm	11.5316 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	11.5316 mm
LXT905PC	Intel	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1	.1 mA	5 V	3.3/5	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	10 Mbps	S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified		e3	40	260	11.5062 mm
MC33889BDW	Freescale Semiconductor	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.018 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL	.125 Mbps	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified		e0	30	240	17.925 mm
78Q8392-28CH	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			-9 V					CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
78Q902-CH	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
78Q902-CP	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T28		5.588 mm	15.24 mm	Not Qualified					35.941 mm
TCM2202J	Texas Instruments		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		MOS							IN-LINE	DIP28,.6	Network Interfaces	2.54 mm	70 Cel	0 Cel		DUAL		R-XDIP-T28				Not Qualified
DP83223V	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28		SQUARE	PLASTIC/EPOXY	YES	1				1	135 mA	5 V						70 Cel	0 Cel		QUAD		S-PQCC-J28
DP83910AV/NOPB	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				4		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-J28	2A	4.57 mm	11.43 mm	Not Qualified		e3	30	245	11.43 mm
DP83910AV/63SN	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				4		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-J28	2A	4.57 mm	11.43 mm			e3	30	245	11.43 mm
DP83TC813SRHFTQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	28	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.16X.2,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	R-PQCC-N28	2	1 mm	4 mm		the 1.25-Gbps rate of the SGMII is excessive	e4		260	5 mm
DP83TC813SRHFRQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	28	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.16X.2,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	R-PQCC-N28	2	1 mm	4 mm		the 1.25-Gbps rate of the SGMII is excessive	e4		260	5 mm
DP83TC813RRHFTQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	28	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.16X.2,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	R-PQCC-N28	2	1 mm	4 mm		the 1.25-Gbps rate of the SGMII is excessive	e4		260	5 mm
DP83910AV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28	2A	4.57 mm	11.43 mm	Not Qualified		e0		245	11.43 mm
NB4N7132DTG	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					.125 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3	30	260	9.7 mm
NB4N1158DTG	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					.075 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified		e3		260	9.7 mm
LC80101M	Onsemi		INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				15 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28				Not Qualified
NB4N7132DTR2G	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					.125 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3	30	260	9.7 mm
NB4N1158DTR2G	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					.075 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified		e3		260	9.7 mm
MK5033P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		CMOS					5 V	5	IN-LINE	DIP28,.6	Network Interfaces	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T28				Not Qualified		e0
MK5033N	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					5 V	5	IN-LINE	DIP28,.6	Network Interfaces	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDIP-T28				Not Qualified		e0
NE83Q92A-T	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS							CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
NE8392AA	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			-9 V					CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
NE8392CA	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		-9 V		180 mA			CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
NE83C92A-T	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS							CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
NE8392CA-T	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		-9 V		180 mA			CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
NE83Q92A	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		-9 V	1	.09 mA		-9	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
NE86C92D-T	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified					17.9 mm
NE86C92D	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified					17.9 mm
NE86C92N	NXP Semiconductors	ETHERNET TRANSCEIVER	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS					5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T28		5.08 mm	15.24 mm	Not Qualified					36.51 mm
NE8392AA-T	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			-9 V					CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified					11.5062 mm
MC33889BPEG	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.045 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	.125 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
MC33989PEG	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.045 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
MC33889DPEG	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.045 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	.125 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
MC33989PEGR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.045 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
MC33889DPEGR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.045 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	.125 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
TLE6263GNUMA1	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						13.5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G28		2.65 mm	7.6 mm	Not Qualified					18.1 mm
TLE62633GXUMA1	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						13.5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G28		2.65 mm	7.6 mm				NOT SPECIFIED	NOT SPECIFIED	18.1 mm
TLE6260-1G	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1		13.5 V	13.5	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm			TIN LEAD	DUAL	.125 Mbps	R-PDSO-G28		2.65 mm	7.6 mm	Not Qualified		e0			18.1 mm
TLE6260-2G	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1		13.5 V	13.5	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm			TIN LEAD	DUAL	.125 Mbps	R-PDSO-G28		2.65 mm	7.6 mm	Not Qualified		e0			18.1 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.