HVSON Network Interfaces 300

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MCP2561FD-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
PTCAN1043ADMTRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N14		1 mm	3 mm						4.5 mm
TCAN1051GDRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TJA1029TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8	1	1 mm	3 mm						3 mm
UJA1169ATK	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm						5.5 mm
UJA1169ATK/3	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm						5.5 mm
UJA1169ATK/F	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm						5.5 mm
ATA663454-GDQW-VAO	Microchip Technology	LIN TRANSCEIVER		NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.5 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC16,.13,25		.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-N16		1 mm	3 mm			e3			5.5 mm
MCP2003BT-E/MC	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N8		1 mm	2 mm						3 mm
TJA1153ATK/0Z	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel			DUAL	5 Mbps	R-PDSO-N14	1	1 mm	3 mm					260	4.5 mm
TLIN1029DRBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	5 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	S-PDSO-N8	2	1 mm	3 mm			e4	30	260	3 mm
ATA663454-GDQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1.15 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N16		.9 mm	3 mm			e3			5.5 mm
MCP2025-500E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
TLIN2029DRBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	S-PDSO-N8	2	1 mm	3 mm			e4	30	260	3 mm
MCP2557FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3			3 mm
ATA6560-GBQW-N	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		.9 mm	3 mm						3 mm
ATA6663-FAQW-1	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					2 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		.9 mm	3 mm			e3			3 mm
TCAN1051GVDRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
ATA663231-GBQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
ATA663254-FAQW	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
MCP2557FDT-H/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		.5 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm			e4			3 mm
UJA1162ATK/0Z	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14	1	1 mm	3 mm		ESD FOR BAT, WAKE IS 3A AND CANH,CANL IS 3B			260	4.5 mm
ATA663231-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
TJA1059TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		R-PDSO-N14	1	1 mm	3 mm						4.5 mm
NCV7327MW0R2G	Onsemi	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	6.5 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	S-XDSO-N8	1	.9 mm	3 mm			e3	30	260	3 mm
PTCAN1057VDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1								125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2					e4	30	260
UJA1167ATK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	28 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm						4.5 mm
ATA6566-GBQW0	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
ATA6566-GBQW0-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
ATA6566-GBQW1	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
ATA6566-GBQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
ATA663211-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
MCP2021A-330E/MD	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
MCP2021A-330E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		1 mm	4 mm						4 mm
PTCAN1046AVDMTRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2	2		AEC-Q100	2		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N14		1 mm	3 mm						4.5 mm
SN55HVD251DRJR	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1	BICMOS		1	.065 mA	5 V	5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	Network Interfaces	.8 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	S-PDSO-N8	2	.8 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
TCAN1046AVDMTRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	2		AEC-Q100	2	260 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N14	2	1 mm	3 mm			e4		260	4.4 mm
TCAN1046VDMTRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2	2		AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	8 Mbps	R-PDSO-N14	2	.9 mm	3 mm			e3	NOT SPECIFIED	260	4.5 mm
UJA1169TKZ	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	7.5 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.15,20		.5 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	2 Mbps	R-PDSO-N20	1	1 mm	3.5 mm			e4	30	260	5.5 mm
MCP2025-500E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
MCP2544WFDT-H/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		.5 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm			e3	30	260	3 mm
PTCAN1044DRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
ATA6560-GBQW	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8		.9 mm	3 mm			e3			3 mm
ATA6560-GBQW-VAO	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
LTC2875MPDD#TRPBF	Analog Devices	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-55 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm			e3	30	260	3 mm
MCP2542WFD-E/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3	30	260	3 mm
MCP2542WFDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3	30	260	3 mm
NCV7344MW0R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm			e3	30	260	3 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.