HVSON Network Interfaces 300

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Part	Manufacturer	Telecom IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
UJA1164TK,118	NXP Semiconductors	CAN TRANSCEIVER	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	67 mA	13 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N14	1	1 mm	3 mm		30	260	4.5 mm
TJA1462BTK	NXP Semiconductors	CAN FD TRANSCEIVER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm				3 mm
UJA1169ATK/X	NXP Semiconductors	CAN FD TRANSCEIVER	NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	67 mA	13 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20	.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm				5.5 mm
TJA1463ATK	NXP Semiconductors	CAN FD TRANSCEIVER	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N14		1 mm	4.5 mm				3 mm
TJA1443ATK	NXP Semiconductors	CAN TRANSCEIVER	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	60 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm				4.5 mm
TJA1028TK/5V0/10	NXP Semiconductors	MIL-STD-1553 DATA BUS TRANSCEIVER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm				3 mm
TJA1028TK/5V0/10,1	NXP Semiconductors	LIN TRANSCEIVER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm			260	3 mm
UJA1167ATK/X	NXP Semiconductors	CAN TRANSCEIVER	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	28 mA	13 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm				4.5 mm
TJA1046TK	NXP Semiconductors	INTERFACE CIRCUIT	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm				DUAL		R-PDSO-N14		1 mm	3 mm		NOT SPECIFIED	NOT SPECIFIED	4.5 mm
TLT9255WLC	Infineon Technologies	CAN FD TRANSCEIVER	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	45 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	.65 mm	150 Cel	-40 Cel	TIN	DUAL	5 Mbps	R-PDSO-N14	2A	1.1 mm	3 mm	e3			4.5 mm
TLT9251VLE	Infineon Technologies	CAN FD TRANSCEIVER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	48 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	TIN	DUAL	5 Mbps	S-PDSO-N8	2A	1.1 mm	3 mm	e3			3 mm
TLE9250XLE	Infineon Technologies	CAN TRANSCEIVER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	48 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm	e3			3 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.