Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
70 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-N14 |
2 |
1 mm |
3 mm |
e4 |
260 |
4.5 mm |
||||||||||
|
Texas Instruments |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
AEC-Q100 |
2 |
7.5 mA |
8 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.02 Mbps |
R-PDSO-N14 |
2 |
.9 mm |
3 mm |
ESD Value for VSUP, LIN is 3B; Transmit Data rate 20kbps |
e4 |
30 |
260 |
4.5 mm |
|||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
AEC-Q100 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.02 Mbps |
R-PDSO-N14 |
2 |
.9 mm |
3 mm |
e4 |
30 |
260 |
4.5 mm |
|||||||||||
|
Texas Instruments |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
14 V |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
.02 Mbps |
S-PDSO-N8 |
2 |
e4 |
30 |
260 |
|||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
5 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
105 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N14 |
.9 mm |
3 mm |
4.5 mm |
||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
2 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
120 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 Mbps |
S-PDSO-N14 |
2 |
1 mm |
3 mm |
e4 |
30 |
260 |
4.5 mm |
||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-N14 |
1 mm |
3 mm |
4.5 mm |
||||||||||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-N14 |
1 mm |
3 mm |
4.5 mm |
||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
2 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Texas Instruments |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
AEC-Q100 |
2 |
8.5 mA |
8 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.02 Mbps |
R-PDSO-N14 |
2 |
.9 mm |
3 mm |
ESD for LIN, VSUP pins is 3B; Transmit Data rate is 20kbps |
e3 |
30 |
260 |
4.5 mm |
|||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
120 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 Mbps |
S-PDSO-N14 |
2 |
1 mm |
3 mm |
e4 |
30 |
260 |
4.5 mm |
||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
70 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-45 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-N14 |
2 |
1 mm |
3 mm |
e4 |
260 |
4.5 mm |
||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
70 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-N14 |
2 |
1 mm |
3 mm |
e4 |
260 |
4.5 mm |
||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
70 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-N14 |
2 |
1 mm |
3 mm |
e4 |
260 |
4.5 mm |
||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-N14 |
2 |
1 mm |
4.5 mm |
e4 |
260 |
3 mm |
||||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
8 Mbps |
S-PDSO-N8 |
2 |
1 mm |
3 mm |
e4 |
3 mm |
|||||||||||
|
Analog Devices |
CAN TRANSCEIVER |
NO LEAD |
10 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 Mbps |
R-PDSO-N10 |
1 |
.8 mm |
3 mm |
e4 |
30 |
260 |
4 mm |
|||||||||||
|
Analog Devices |
CAN TRANSCEIVER |
NO LEAD |
10 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
.5 mm |
125 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N10 |
.8 mm |
3 mm |
4 mm |
||||||||||||||||
|
Onsemi |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
2 |
AEC-Q100 |
2 |
13 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.02 Mbps |
R-PDSO-N14 |
1 |
.9 mm |
3 mm |
e3 |
30 |
260 |
4.5 mm |
|||||||||
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
1 |
105 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
S-XDSO-N8 |
1 |
.9 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.45 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-N12 |
1 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||
|
NXP Semiconductors |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
1 |
.33 mm |
1.2 mm |
260 |
1.4 mm |
||||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
125 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
175 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N14 |
1 mm |
3 mm |
4.5 mm |
|||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||||||||
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
R-PDSO-N14 |
1 mm |
3 mm |
4.5 mm |
|||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-N14 |
1 |
1 mm |
3 mm |
e4 |
30 |
260 |
4.5 mm |
||||||||||||||||
|
NXP Semiconductors |
LIN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
4 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
Not Qualified |
3 mm |
|||||||||||||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N14 |
1 mm |
3 mm |
ESD FOR BAT, WAKE IS 3A AND CANH,CANL IS 3B |
4.5 mm |
||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||||||||
|
NXP Semiconductors |
LIN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
R-PDSO-N8 |
.8 mm |
3 mm |
3 mm |
|||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
Not Qualified |
3 mm |
||||||||||||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.14,20 |
.5 mm |
DUAL |
15 Mbps |
R-PDSO-N20 |
1 mm |
3.5 mm |
5.5 mm |
|||||||||||||||||
|
NXP Semiconductors |
MIL-STD-1553 DATA BUS TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
30 |
260 |
3 mm |
|||||||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
60 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N8 |
1 mm |
3 mm |
3 mm |
|||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
60 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N8 |
1 mm |
3 mm |
3 mm |
|||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
R-PDSO-N14 |
1 |
1 mm |
3 mm |
30 |
260 |
4.5 mm |
||||||||||||||||||
|
NXP Semiconductors |
LIN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
4.5 mA |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
260 |
3 mm |
||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
60 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N8 |
1 mm |
3 mm |
3 mm |
|||||||||||||||
NXP Semiconductors |
MIL-STD-1553 DATA BUS TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
65 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
DUAL |
5 Mbps |
R-PDSO-N14 |
1 mm |
3 mm |
4.5 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.