Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Broadcom |
MILITARY |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
5 V |
5 |
GRID ARRAY |
PGA68,11X11 |
Network Interfaces |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
S-XPGA-P68 |
Not Qualified |
e0 |
|||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
140 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
84 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
1 V |
1,2.5,2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC84,.4SQ,16 |
Network Interfaces |
.4 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N84 |
.85 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
|||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
-9 V |
1 |
120 mA |
-9 V |
-9 |
CHIP CARRIER |
LDCC20,.4SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J20 |
Not Qualified |
e0 |
||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
200 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
100 Mbps |
S-PQCC-J44 |
Not Qualified |
e0 |
||||||||||||||
Broadcom |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J20 |
Not Qualified |
e0 |
||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
4 |
450 mA |
3.3 V |
3.3 |
FLATPACK |
QFP160,1.2SQ |
Network Interfaces |
.635 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
100 Mbps |
S-PQFP-G160 |
Not Qualified |
e0 |
||||||||||||||
Broadcom |
LAN SWITCHING CIRCUIT |
COMMERCIAL |
BALL |
524 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B524 |
31 mm |
Not Qualified |
e0 |
30 |
225 |
31 mm |
|||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
176 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
4 |
QUAD |
S-PQFP-G176 |
||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
3.3 V |
FLATPACK |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G160 |
4.07 mm |
28 mm |
Not Qualified |
e0 |
30 |
225 |
28 mm |
|||||||||||||||
Broadcom |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
5 V |
5 |
GRID ARRAY |
PGA68,11X11 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
S-XPGA-P68 |
Not Qualified |
e0 |
|||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
200 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
100 Mbps |
S-PQCC-J44 |
Not Qualified |
e0 |
|||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
576 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B576 |
Not Qualified |
|||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
84 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
1 V |
1,2.5,2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC84,.4SQ,16 |
Network Interfaces |
.4 mm |
70 Cel |
0 Cel |
MATTE TIN OVER NICKEL |
QUAD |
S-XQCC-N84 |
.85 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
FLATPACK |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
1250 Mbps |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||||
Broadcom |
SUPPORT CIRCUIT |
SQUARE |
400000 Mbps |
||||||||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
324 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1.2 V |
BOTTOM |
S-PBGA-B324 |
|||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 V |
GRID ARRAY |
BOTTOM |
10000 Mbps |
S-PBGA-B256 |
||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
S-PBGA-B121 |
|||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK |
QUAD |
S-PQFP-G208 |
||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
|||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
S-PBGA-B400 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
212 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B212 |
3 |
1.017 mm |
11 mm |
11 mm |
|||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
85 Cel |
-45 Cel |
QUAD |
1000 Mbps |
S-PQFP-G256 |
1.6 mm |
28 mm |
TMII MODE SUPPORTS 200 MBPS DATA RATE |
28 mm |
||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
-40 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.5 V |
FLATPACK |
QFP64,.47SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
ALSO OPERATES AT 3.3V SUPPLY |
10 mm |
|||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
70 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-PQFP-G256 |
1.6 mm |
28 mm |
TMII MODE SUPPORTS 200 MBPS DATA RATE |
28 mm |
|||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
121 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
S-PBGA-B121 |
Not Qualified |
||||||||||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
27343.75 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G208 |
4.1 mm |
28 mm |
28 mm |
|||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
212 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B212 |
3 |
1.017 mm |
11 mm |
11 mm |
|||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
24 |
1450 mA |
1.2 V |
GRID ARRAY |
BGA400,20X20,50 |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PBGA-B400 |
2.33 mm |
27 mm |
27 mm |
|||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
OTHER |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
480 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B480 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B256 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
S-PBGA-B256 |
||||||||||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
24 |
1450 mA |
1.2 V |
GRID ARRAY |
BGA400,20X20,50 |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PBGA-B400 |
2.33 mm |
27 mm |
27 mm |
|||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK |
QUAD |
S-PQFP-G208 |
Not Qualified |
|||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
8 |
892 mA |
2.5,2.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Network Interfaces |
1 mm |
70 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
.892 mA |
2.5 V |
2.5,2.5/3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G208 |
4.1 mm |
28 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
28 mm |
||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.