CAN FD/LIN TRANSCEIVER Network Interfaces 180

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

MC33FS6503CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6523CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.32SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS4507LAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

2

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS4507LAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

2

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6510LAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6513NAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6522LAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS4503CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS4503CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6520LAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6520LAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6521CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS4508CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS4508CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6502LAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6522LAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6502LAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS4502CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS4501NAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6508CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6502CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6503CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6522CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6518CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6517NAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6527NAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6506CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS4505CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6511CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6518NAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6522NAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6528NAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6500NAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6525KAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6512NAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6523NAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6521NAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6510LAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6508NAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6517LAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

2

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6504LAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

3

40

260

MC33FS6522CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

AEC-Q100

3

40

260

MC33FS6507NAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS6506NAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS4505CAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS4501CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

3

40

260

MC33FS6505CAER2

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

MC33FS4507NAE

NXP Semiconductors

CAN FD/LIN TRANSCEIVER

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.