CAN FD/LIN TRANSCEIVER Network Interfaces 180

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Part	Manufacturer	Telecom IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC33FS6523NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6515CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4505LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4506CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6526CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6527KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6508NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6528CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4500LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100							TIN			3			e3	40	260
MC33FS6528NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6526NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6525CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4500CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6511NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6516CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6513CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER																			3				40	260
MC33FS6527KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6526NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6500NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6527CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6516CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4508NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6527NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4503NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6515KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4501CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER																			3				40	260
MC33FS4500CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS4502NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS4502NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS4505KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6507LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6503NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS4502CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6525CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6525NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6520NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.