CAN FD/LIN TRANSCEIVER Network Interfaces 180

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Part	Manufacturer	Telecom IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC33FS6507KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6507KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6510CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6505KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6515NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6500CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS4506CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6510CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100							TIN			3			e3	40	260
MC33FS6510NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6502CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6517KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6515LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6525KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6517NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6507CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4502LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6507NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4500LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS4507CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4503NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6506NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6511NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6514LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6520CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6511CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6513CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER																			3				40	260
MC33FS6514LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6505NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6500LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS4505NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6528CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6521CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6518CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6500LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS4506NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6518NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4507KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4507NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4500NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6505CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6505KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6527CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6521NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS4505LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4506NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6512CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100										3				40	260
MC33FS6516NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6520CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER									AEC-Q100							TIN			3			e3	40	260

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.