Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cortina Systems |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.1 mA |
5 V |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Network Interfaces |
.8 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
10 Mbps |
S-PQFP-G32 |
1 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BALL |
117 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 V |
GRID ARRAY, LOW PROFILE |
1 mm |
BOTTOM |
R-PBGA-B117 |
1.54 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
|||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
1 |
CMOS |
FLATPACK |
TIN |
e3 |
||||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
176 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 |
QUAD |
S-PQFP-G176 |
||||||||||||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
48 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
Network Interfaces |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100000 Mbps |
S-PQFP-G48 |
4 |
1.2 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
95 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100000 Mbps |
S-PQCC-N36 |
3 |
1 mm |
6 mm |
e4 |
260 |
6 mm |
|||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
95 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100000 Mbps |
S-PQCC-N36 |
3 |
1 mm |
6 mm |
e4 |
260 |
6 mm |
|||||||||||
Intel |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B196 |
1.75 mm |
15 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
|||||||||||||||||
Intel |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B196 |
1.75 mm |
15 mm |
15 mm |
||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
.9 mm |
5 mm |
e4 |
5 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N32 |
.9 mm |
5 mm |
5 mm |
|||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
UNSPECIFIED |
12 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
.03 mA |
3.3 V |
2.5/3.3 |
MICROELECTRONIC ASSEMBLY |
MODULE,12LEAD,.7 |
Other Telecom ICs |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDMA-X12 |
17.78 mm |
Not Qualified |
e3 |
27.94 mm |
||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
80 mA |
12 V |
SMALL OUTLINE |
SOP8,.23 |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BALL |
168 |
HFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.88 V |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA168,12X14,32 |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
10000 Mbps |
R-PBGA-B168 |
1 |
2.647 mm |
10 mm |
12 mm |
||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
NICKEL PALLADIUM GOLD |
3 |
e4 |
3 |
260 |
||||||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
CMOS |
2 |
1 V |
UNSPECIFIED |
also operates with 3.3v nom supply |
|||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
128 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
FLATPACK |
TIN SILVER COPPER |
QUAD |
1000 Mbps |
R-PQFP-G128 |
3 |
ALSO AVAILABLE WITH BGA-117 AND FBGA-100 |
e1 |
260 |
|||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
.8 mm |
6 mm |
Not Qualified |
6 mm |
||||||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
|||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-PQCC-N32 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
47 |
RECTANGULAR |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
R-XXMA-N47 |
3.34 mm |
17.78 mm |
26.67 mm |
||||||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
AEC-Q100 |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.02 Mbps |
R-PQCC-N24 |
2 |
1 mm |
3.5 mm |
e3 |
30 |
260 |
5.5 mm |
|||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
302 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G302 |
1.2 mm |
24 mm |
24 mm |
||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
444 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
8 |
1.2 V |
GRID ARRAY |
BGA444,26X26,40 |
1 mm |
90 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B444 |
2.36 mm |
27 mm |
IT ALSO OPERATS AT 3.3V, SEATED HT-CALCULATED |
27 mm |
|||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
28 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
-9 V |
1 |
.065 mA |
9 V |
+-9 |
CHIP CARRIER |
LDCC28,.5SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
10 Mbps |
S-PQCC-N28 |
4.572 mm |
11.5316 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
11.5316 mm |
||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
40000 Mbps |
S-XQCC-N48 |
3 |
.8 mm |
7 mm |
30 |
260 |
7 mm |
||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
40000 Mbps |
S-XQCC-N48 |
3 |
.8 mm |
7 mm |
30 |
260 |
7 mm |
||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
144 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1 V |
GRID ARRAY |
BOTTOM |
R-PBGA-B144 |
||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
1 |
CMOS |
1 |
1000 Mbps |
3 |
260 |
|||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
324 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
BOTTOM |
S-PBGA-B324 |
3 |
260 |
||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
324 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
BOTTOM |
S-PBGA-B324 |
||||||||||||||||||||||||||||
|
Schneider Electric Sa |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
24 V |
MICROELECTRONIC ASSEMBLY |
60 Cel |
0 Cel |
UNSPECIFIED |
100 Mbps |
R-XXMA-X |
||||||||||||||||||||||||
National Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
CHIP CARRIER |
LCC40,.24SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQCC-N40 |
2 |
Not Qualified |
40 |
260 |
||||||||||||||
National Semiconductor |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
105 Cel |
-40 Cel |
TIN LEAD |
QUAD |
100 Mbps |
S-PQFP-G48 |
3 |
Not Qualified |
e0 |
40 |
260 |
||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
Not Qualified |
|||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
95 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100000 Mbps |
S-PQCC-N36 |
3 |
1 mm |
6 mm |
e4 |
260 |
6 mm |
|||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
10 Mbps |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
|||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
1 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
TSSOP48,.40 |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
100 Mbps |
R-PDSO-G48 |
2.794 mm |
7.493 mm |
e3 |
15.875 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G128 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G128 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.