Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQCC-N32 |
1 mm |
5 mm |
e3 |
5 mm |
|||||||||||||
|
Startech.com |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
XFM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
FLANGE MOUNT |
60 Cel |
0 Cel |
UNSPECIFIED |
100 Mbps |
R-XXFM-X |
|||||||||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
Not Qualified |
|||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
4 |
1.55 V |
CHIP CARRIER |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
e4 |
NOT SPECIFIED |
260 |
||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.113 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
2 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
7.8 mm |
||||||||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
2 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
7.8 mm |
||||||||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY, LOW PROFILE |
1 mm |
110 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
1.4 mm |
15 mm |
15 mm |
||||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
1890 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
e1 |
17 mm |
|||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
85 Cel |
-45 Cel |
QUAD |
1000 Mbps |
S-PQFP-G256 |
3 |
1.6 mm |
28 mm |
TMII MODE SUPPORTS 200 MBPS DATA RATE |
28 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N24 |
.9 mm |
4 mm |
e3 |
4 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N24 |
.9 mm |
4 mm |
e3 |
4 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
TSSOP48,.40 |
.635 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
100 Mbps |
R-PDSO-G48 |
2.794 mm |
7.493 mm |
e3 |
15.875 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
1.2,2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N72 |
1 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
e4 |
NOT SPECIFIED |
260 |
5 mm |
|||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
150 mA |
1.2 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1 mm |
110 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
1.4 mm |
15 mm |
15 mm |
|||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1.2 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
90 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
2 mm |
17 mm |
17 mm |
|||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
FLATPACK |
QUAD |
S-PQFP-G100 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
National Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
250 mA |
5 V |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J84 |
Not Qualified |
e0 |
|||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
BALL |
117 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1 V |
GRID ARRAY, LOW PROFILE |
BGA117,9X13,40 |
1 mm |
BOTTOM |
1000 Mbps |
R-PBGA-B117 |
1.54 mm |
10 mm |
Not Qualified |
IT ALSO REQUIRES 2.5V DIGITAL SUPPLY |
14 mm |
|||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
121 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
R-PBGA-B121 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
.5 mm |
TIN |
QUAD |
1000 Mbps |
R-PQFP-G128 |
1.6 mm |
14 mm |
e3 |
20 mm |
||||||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
1000 Mbps |
|||||||||||||||||||||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
CMOS |
1000 Mbps |
||||||||||||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 V |
GRID ARRAY |
BGA324,18X18,40 |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
10300 Mbps |
S-PBGA-B324 |
2.82 mm |
19 mm |
19 mm |
|||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
186 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
BGA186(UNSPEC) |
BOTTOM |
S-PBGA-B186 |
3 |
||||||||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
110 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
10000 Mbps |
S-PBGA-B256 |
2.7 mm |
17 mm |
e1 |
17 mm |
||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
CMOS |
TIN |
e3 |
||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
1 |
CMOS |
1 |
1000 Mbps |
3 |
260 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
4 |
1.32 mA |
3.3 V |
3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA256,20X20,50 |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B256 |
3 |
1.745 mm |
27 mm |
Not Qualified |
e1 |
20 |
260 |
27 mm |
||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
144 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
1 V |
GRID ARRAY |
BOTTOM |
1000 Mbps |
R-PBGA-B144 |
3 |
260 |
|||||||||||||||||||||||
|
Infineon Technologies |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
4 |
1.1 mA |
3.3 V |
3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA256,20X20,50 |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B256 |
3 |
1.745 mm |
27 mm |
Not Qualified |
e1 |
20 |
260 |
27 mm |
||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
UNSPECIFIED |
9 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
FIBER OPTIC |
70 Cel |
0 Cel |
UNSPECIFIED |
R-XXFO-X9 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.8 V |
BOTTOM |
5000 Mbps |
S-PBGA-B |
|||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
|||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
4 |
1.32 mA |
3.3 V |
3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA256,20X20,50 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1500 Mbps |
S-PBGA-B256 |
3 |
1.745 mm |
27 mm |
Not Qualified |
e1 |
20 |
260 |
27 mm |
||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.1 mA |
5 V |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
10 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e3 |
40 |
260 |
11.5062 mm |
|||||||
|
Intel |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
85 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-XQCC-N48 |
.9 mm |
6 mm |
6 mm |
|||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BUTT |
96 |
BCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
1 V |
1,2.5 |
CHIP CARRIER |
SLGA96,15X15,24 |
Network Interfaces |
.6 mm |
BOTTOM |
1000 Mbps |
S-XBCC-B96 |
.8 mm |
9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
|||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.