Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
100000 Mbps |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
2.5,2.5/3.3 |
FLATPACK |
QFP100,.7X.9 |
Network Interfaces |
.635 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
R-PQFP-G100 |
Not Qualified |
||||||||||||||||||
Maxlinear |
ETHERNET TRANSCEIVER |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.28SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N56 |
.9 mm |
7 mm |
ALSO REQUIRE 1.8V,3.3V SUPPLY |
7 mm |
|||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
.9 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
2 |
.9 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N48 |
1 mm |
7 mm |
7 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5 mA |
12 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
.02 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||||||
Intel |
ETHERNET TRANSCEIVER |
OTHER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
0 Cel |
QUAD |
S-XQCC-N48 |
.9 mm |
3 mm |
3 mm |
||||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
BALL |
224 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
R-PBGA-B224 |
||||||||||||||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
3 |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
BOTTOM |
1000 Mbps |
S-PBGA-B100 |
||||||||||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
58.3 mA |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
.5 mm |
70 Cel |
0 Cel |
QUAD |
.0001 Mbps |
S-PQFP-G48 |
1.2 mm |
7 mm |
40 |
260 |
7 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
135 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
LCC135,.47SQ,25 |
.65 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
1000 Mbps |
S-PBGA-B135 |
.85 mm |
12 mm |
e4 |
12 mm |
||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
GRID ARRAY |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B256 |
e1 |
255 |
|||||||||||||||||||
National Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-9 V |
1 |
180 mA |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
19.305 mm |
||||||||||||
National Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-9 V |
1 |
.18 mA |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
19.305 mm |
||||||||||||
National Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
-9 V |
1 |
.18 mA |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
e0 |
||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
4 |
250 mA |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1000 Mbps |
S-PQCC-N36 |
3 |
.9 mm |
6 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
e4 |
30 |
260 |
6 mm |
||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA64,8X8,32 |
Network Interfaces |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B64 |
1.36 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
132 |
PLASTIC/EPOXY |
YES |
CMOS |
.2036 mA |
1.2,2.5,3.3 |
SLGA132,18X18,20 |
Network Interfaces |
70 Cel |
0 Cel |
Not Qualified |
|||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
-9 V |
1 |
130 mA |
-9 |
CHIP CARRIER |
LDCC28,.5SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
e0 |
11.505 mm |
|||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
-9 V |
1 |
130 mA |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
19.175 mm |
|||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
-9 V |
1 |
120 mA |
-9 |
CHIP CARRIER |
LDCC28,.5SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J28 |
Not Qualified |
e0 |
|||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
1890 mA |
1 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
QUAD |
S-XQCC-N64 |
1 mm |
9 mm |
9 mm |
||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
104 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
108 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B104 |
1.57 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
80 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G80 |
3 |
1.2 mm |
12 mm |
e3 |
12 mm |
|||||||||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-N32 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
MILITARY |
FLAT |
68 |
HGQFF |
SQUARE |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
MIL-PRF-38535 Class V |
1 |
1 V |
FLATPACK, HEAT SINK/SLUG, GUARD RING |
TPAK68,2.5SQ,25 |
.635 mm |
125 Cel |
-55 Cel |
QUAD |
1000 Mbps |
S-CQFP-F68 |
3.91 mm |
13.05 mm |
13.05 mm |
|||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
1 |
1.2 V |
UNSPECIFIED |
3 |
260 |
||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
256 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
GRID ARRAY |
70 Cel |
0 Cel |
BOTTOM |
R-PBGA-B256 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
1 |
CMOS |
CHIP CARRIER |
3 |
260 |
||||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
1000 Mbps |
R-PBGA-B100 |
3 |
260 |
|||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
117 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
R-PBGA-B117 |
3 |
260 |
|||||||||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
100000 Mbps |
S-PQCC-N36 |
3 |
.9 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
NO LEAD |
28 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.16X.2,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100000 Mbps |
R-PQCC-N28 |
2 |
1 mm |
4 mm |
the 1.25-Gbps rate of the SGMII is excessive |
e4 |
260 |
5 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQCC-N32 |
1 mm |
5 mm |
e3 |
5 mm |
|||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
1.55,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
GRID ARRAY, LOW PROFILE |
BGA144,12X12,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
.00001 Mbps |
S-PBGA-B144 |
1.4 mm |
13 mm |
13 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.