Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
OTHER |
BUTT |
63 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
70 Cel |
-20 Cel |
NICKEL GOLD |
BOTTOM |
R-PBGA-B63 |
3 |
2.38 mm |
17.5 mm |
e4 |
30 |
260 |
20.5 mm |
|||||||||||||
|
Murata Manufacturing |
WIRELESS LAN CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||
Microchip Technology |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
HYBRID |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N49 |
3.175 mm |
17.78 mm |
26.67 mm |
||||||||||||||||||||
Microchip Technology |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
HYBRID |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N49 |
3.175 mm |
17.78 mm |
26.67 mm |
||||||||||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
OTHER |
BUTT |
63 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
70 Cel |
-20 Cel |
NICKEL GOLD |
BOTTOM |
R-PBGA-B63 |
3 |
2.38 mm |
17.5 mm |
e4 |
30 |
260 |
20.5 mm |
|||||||||||||
Murata Manufacturing |
WIRELESS LAN CIRCUIT |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
NICKEL GOLD |
DUAL |
R-XDMA-N49 |
3.175 mm |
17.78 mm |
e4 |
26.67 mm |
|||||||||||||||||||
Microchip Technology |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
HYBRID |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N49 |
3.175 mm |
17.78 mm |
26.67 mm |
||||||||||||||||||||
Azurewave Technologies |
WIRELESS LAN CIRCUIT |
NO LEAD |
130 |
TFLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
LGA130,30X20,20 |
.5 mm |
85 Cel |
-30 Cel |
BOTTOM |
866.7 Mbps |
R-XBGA-N130 |
1.85 mm |
12 mm |
OTHER DATA RATES ARE 400, 192.6, 300, 150, 54, 48, 36,24,18,12,6,11,5.5, 2,1 MBPS W.R.T DIFF WLAN |
16 mm |
|||||||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
||||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
BUTT |
63 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL GOLD |
BOTTOM |
R-PBGA-B63 |
3 |
2.45 mm |
17.5 mm |
e4 |
30 |
260 |
20.5 mm |
|||||||||||||
Microchip Technology |
WIRELESS LAN CIRCUIT |
OTHER |
NO LEAD |
44 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
HYBRID |
3.3 V |
MICROELECTRONIC ASSEMBLY |
2 mm |
85 Cel |
-30 Cel |
QUAD |
R-XQMA-N44 |
3.5 mm |
20 mm |
37 mm |
||||||||||||||||||||
Microchip Technology |
WIRELESS LAN CIRCUIT |
OTHER |
NO LEAD |
44 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
HYBRID |
3.3 V |
MICROELECTRONIC ASSEMBLY |
2 mm |
85 Cel |
-30 Cel |
QUAD |
R-XQMA-N44 |
3.5 mm |
20 mm |
37 mm |
||||||||||||||||||||
Murata Manufacturing |
WIRELESS LAN CIRCUIT |
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Murata Manufacturing |
WIRELESS LAN CIRCUIT |
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Murata Manufacturing |
WIRELESS LAN CIRCUIT |
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Murata Manufacturing |
WIRELESS LAN CIRCUIT |
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|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
BOTTOM |
R-XBGA-N24 |
3 |
260 |
||||||||||||||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
BALL |
16 |
BGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-XBGA-B16 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
UNSPECIFIED |
16 |
SQUARE |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
UNSPECIFIED |
S-XXMA-X16 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
|
Silicon Labs |
WIRELESS LAN CIRCUIT |
NO LEAD |
58 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
.85 mm |
85 Cel |
-40 Cel |
QUAD |
65 Mbps |
R-XQMA-N58 |
13.7 mm |
12.9 mm |
|||||||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
BALL |
24 |
BGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
GRID ARRAY |
BOTTOM |
R-XBGA-B24 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
3 |
260 |
|||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
NO LEAD |
16 |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
QUAD |
S-XQMA-N16 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
UNSPECIFIED |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
UNSPECIFIED |
R-XXMA-X24 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
|||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
|||||||||||||
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N64 |
1 mm |
9 mm |
9 mm |
||||||||||||||||||||
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
63 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-N63 |
2.45 mm |
17.5 mm |
20.5 mm |
||||||||||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
||||||||||||||
|
STMicroelectronics |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.044 mA |
2.5 V |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
|||||||||
|
STMicroelectronics |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.044 mA |
2.5 V |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
|||||||||
NXP Semiconductors |
WIRELESS LAN CIRCUIT |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
4.4 mm |
Not Qualified |
7.8 mm |
||||||||||||||||||
|
NXP Semiconductors |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
1 |
.33 mm |
1.2 mm |
260 |
1.4 mm |
||||||||||||||||
|
NXP Semiconductors |
WIRELESS LAN CIRCUIT |
1 |
260 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
WIRELESS LAN CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
WIRELESS LAN CIRCUIT |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.