INDUSTRIAL Network Interfaces 742

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX13345EEBC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	e1	30	260	2.12 mm
DS33W11DK+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.82 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
MAX3987ETM+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL			HVQCCN				1					2.5 V					.5 mm	85 Cel	-40 Cel	MATTE TIN				1	.8 mm	7 mm		e3	30	260	7 mm
MAX2992ECB+	Analog Devices	REED-SOLOMON ENCODER/DECODER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.2 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64	3	1.6 mm	10 mm		e3	30	260	10 mm
DS33X82+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified	e1	30	260	17 mm
NB4N7132DTG	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.125 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
AX-SFJK-API-1-01-TB05	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40	1	1 mm	5 mm		e4		260	7 mm
AX-SFJK-API-1-01-XXXX	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel		QUAD	.0006 Mbps	R-PQCC-N40		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
NB4N1158DTG	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.075 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified	e3		260	9.7 mm
LC80101M	Onsemi		INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			15 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28				Not Qualified
AX-SFJK-1-01-XXXX	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel		QUAD	.0006 Mbps	R-PQCC-N40		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
AX-SFJK-1-01-TX30	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2X.27,20		.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	.0006 Mbps	R-PQCC-N40	1	1 mm	5 mm			30	260	7 mm
AX-SFJK-1-01-TB05	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40	1	1 mm	5 mm		e4		260	7 mm
NB4N7132DTR2G	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.125 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
LA2335M	Onsemi		INDUSTRIAL	GULL WING	10	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				1	9.4 mA	3.3 V	3.3,5	SMALL OUTLINE, SHRINK PITCH	SOP10,.25,40	Network Interfaces	1 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G10				Not Qualified
LA2333T	Onsemi	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.2 mm	4.4 mm					6.5 mm
LA2351M	Onsemi	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G30		2.45 mm	7.9 mm					15.2 mm
NB4N1158DTR2G	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.075 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified	e3		260	9.7 mm
AX-SFJK-API-1-01-TX30	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2X.27,20		.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	.0006 Mbps	R-PQCC-N40	1	1 mm	5 mm			30	260	7 mm
AMIS40615AGA	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				12 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	MATTE TIN/NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.7272 mm	3.937 mm	Not Qualified	e3/e4	40	260	8.69 mm
NCN5130MNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N40		1 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
NCN5110MNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N40		1 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
AMIS40616AGA	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				12 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	MATTE TIN/NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.7272 mm	3.937 mm	Not Qualified	e3/e4	40	260	8.69 mm
NCN5121MNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N40		1 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
STE101P	STMicroelectronics	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		1		3.3 V	3.3	FLATPACK	QFP64,.47SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-PQFP-G64				Not Qualified
STULPI01ATBR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B36	3	1.16 mm	3.6 mm	Not Qualified	e1	30	260	3.6 mm
STE100P	STMicroelectronics	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
TN100QT	STMicroelectronics	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.044 mA	2.5 V	2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	40	260	7 mm
TN100Q	STMicroelectronics	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.044 mA	2.5 V	2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	40	260	7 mm
E-STE101P	STMicroelectronics	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-PQFP-G64	3	1.54 mm	10 mm	Not Qualified	e4			10 mm
PX1011BI-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
PX1011AI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1012AI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
SA2421DH-T	NXP Semiconductors	WIRELESS LAN CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified				7.8 mm
PX1011BI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified	e1	30	260	9 mm
BGS8458Z	NXP Semiconductors	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.6 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6	1	.33 mm	1.2 mm				260	1.4 mm
PX1041AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B208		1.5 mm	15 mm	Not Qualified	e1			15 mm
PX1011AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011B-EL1/N,551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1012AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
935295735118	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			30	260	4.9 mm
935300644118	NXP Semiconductors	CAN TRANSCEIVER	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
MC92603VM	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.8 V		GRID ARRAY			1 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.6 mm	17 mm	Not Qualified	e1	40	260	17 mm
MC34CM3120EPR2	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		1 mm	5 mm					5 mm
MC13201	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
MC34CM3120EP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		1 mm	5 mm					5 mm
935303555118	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
MCR20AVHM	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	LGA	SQUARE	UNSPECIFIED	YES	1				.0195 mA	2.7 V	2.7	GRID ARRAY	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	105 Cel	-40 Cel	NICKEL GOLD	BOTTOM		S-XBGA-N32	3			Not Qualified	e4	40	260

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.