INDUSTRIAL Network Interfaces 742

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX2829ETN-T	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX2829ETN+T	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm		e3	30	260	8 mm
SN65HVD252D	Texas Instruments	TOKEN RING TRANSCEIVER	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			1	.08 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
TLK106LRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1				4		1.55 V		CHIP CARRIER				105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-XQCC-N32	2				e4	NOT SPECIFIED	260
TLK1211RCP	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.113 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	30	260	10 mm
VSC8489YJU-13	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY, LOW PROFILE			1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm					15 mm
1893CKILF	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	e3	30	260	8 mm
ATA6565-GCQW1	Microchip Technology	CAN TRANSCEIVER	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2			AEC-Q100	2	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	85 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	4.5 mm
MAX13051ESA	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX13051ESA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
PX1011BI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
TUSB1210BRHBTQ1	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	2	1 mm	5 mm		e4	NOT SPECIFIED	260	5 mm
VSC8489YJU-02	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				2	150 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm					15 mm
VSC8254YMR-01	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B256		2.7 mm	17 mm		e1			17 mm
MAX2829ETN	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.7 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX2829ETN+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm	Not Qualified	e3	30	260	8 mm
SI4464-B1B-FM	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm		e3			4 mm
CYP15G0403DXB-BGXI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
MAX4890EETJ	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX4890EETJ+	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
SI4461-B1B-FM	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm					4 mm
SI4464-B1B-FMR	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm		e3			4 mm
CYW15G0403DXB-BGI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e0			27 mm
AC101TF	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G80		1.2 mm	12 mm	Not Qualified				12 mm
B10011S-MFPG1Y	Atmel	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		5 V	5,7/32	SMALL OUTLINE	SOP16,.25	Network Interfaces	1.27 mm	105 Cel	-40 Cel	MATTE TIN	DUAL	.25 Mbps	R-PDSO-G16	1	1.75 mm	3.8 mm	Not Qualified	e3		260	9.9 mm
BCM54185B0IFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	400	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		8				GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-PBGA-B400
CYP15G0201DXB-BBXI	Infineon Technologies	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		2	.71 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified	e1		260	15 mm
CYP15G0401DXB-BGI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4		3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e0			27 mm
ELLXT971ABE.A4	Intel	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1.26 mm	7 mm	Not Qualified		40	260	7 mm
WBLXT9785HED0	Intel	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	208	HFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V		FLATPACK, HEAT SINK/SLUG, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G208		4.1 mm	28 mm	Not Qualified				28 mm
KSZ8051MNLV-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm		e3			5 mm
KSZ8051RNLUB-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm		e4			5 mm
VSC8664XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm		e1			17 mm
CC3120RNMARGKR	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm		e4	30	260	9 mm
CC3120RNMARGKT	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm		e4	30	260	9 mm
KS8001LI	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		1.8 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	100 Mbps	S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
KSZ8031RNLI-TR	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N24	2	.9 mm	4 mm		e4	40	260	4 mm
KSZ8041MLLI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	TS 16949	1	58.3 mA	3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQFP-G48		1.6 mm	7 mm		e3			7 mm
KSZ8051RNLV-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm					5 mm
KSZ8841-32MVLI	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G128		1.6 mm	14 mm	Not Qualified	e3			14 mm
LAN8810I-AKZE	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V	1.2,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N72		1 mm	10 mm	Not Qualified	e3			10 mm
TLK1221RHAR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.113 mA	2.5 V	2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1300 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
VSC7444YIH-02	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1					7500 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B672		2.71 mm	27 mm		e1	NOT SPECIFIED	NOT SPECIFIED	27 mm
TLK2201AIRCPG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	1600 Mbps	S-PQFP-G64		1 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
TLK2211RCP	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.23 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1300 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	30	260	10 mm
TLK2201AIRCP	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	1600 Mbps	S-PQFP-G64		1 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
TLK2211RCPRG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.23 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1300 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	30	260	10 mm
TLK2201BIRCPRG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1600 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	NOT SPECIFIED	260	10 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.