Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
TSSOP48,.40 |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
100 Mbps |
R-PDSO-G48 |
2.794 mm |
7.493 mm |
e3 |
15.875 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||
|
Analog Devices |
CAN TRANSCEIVER |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1 |
70 mA |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Network Interfaces |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
40 |
260 |
4 mm |
||||||||||||||||
|
Infineon Technologies |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
4 |
1.1 mA |
3.3 V |
3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA256,20X20,50 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B256 |
3 |
1.745 mm |
27 mm |
Not Qualified |
e1 |
20 |
260 |
27 mm |
||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
30 |
260 |
5 mm |
||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
1.55,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
|||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
110 Cel |
-40 Cel |
TIN |
DUAL |
.5 Mbps |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
250 |
4.9 mm |
||||||
|
Texas Instruments |
TOKEN RING TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
38 mA |
3.3 V |
FLATPACK |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.27 mm |
12 mm |
30 |
260 |
12 mm |
||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
.0006 Mbps |
R-PQCC-N40 |
1 |
1 mm |
5 mm |
30 |
260 |
7 mm |
||||||||||||
Cortina Systems |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA64,8X8,32 |
Network Interfaces |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B64 |
1.36 mm |
7 mm |
Not Qualified |
30 |
240 |
7 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
40 |
260 |
20 mm |
||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
5 mm |
|||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.27 mm |
12 mm |
30 |
260 |
12 mm |
||||||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
|||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
3 |
1 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
||||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
|||||||||||||
|
Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 mA |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N20 |
2 |
1 mm |
3.5 mm |
e4 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-XQCC-N40 |
3 |
.8 mm |
6 mm |
ESD FOR TXN, TXP, RXN, RXP Pins is 3B |
30 |
260 |
6 mm |
||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N48 |
.8 mm |
7 mm |
7 mm |
||||||||||||||||||||
|
Renesas Electronics |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
18 mA |
5 V |
SMALL OUTLINE |
SOP20,.4 |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G20 |
3 |
2.65 mm |
7.5 mm |
e3 |
30 |
260 |
12.8 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
e4 |
5 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N48 |
.9 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G128 |
3.4 mm |
14 mm |
20 mm |
|||||||||||||||||||
Advanced Micro Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
80 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.13 mA |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP80,.55SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
100 Mbps |
S-PQFP-G80 |
3 |
1.2 mm |
12 mm |
Not Qualified |
e0 |
12 mm |
|||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
2.5 V |
FLATPACK |
QFP64,.47SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
ALSO OPERATES AT 3.3V SUPPLY |
e3 |
260 |
10 mm |
|||||||||||
|
Holt Integrated Circuits |
MIL-STD-1553 DATA BUS TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
.8 mm |
7 mm |
e4 |
7 mm |
|||||||||||||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.16 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQCC-N56 |
3 |
1 mm |
8 mm |
Not Qualified |
e3 |
30 |
260 |
8 mm |
||||||
|
Davicom Semiconductor |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
||||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.77 mm |
17 mm |
Not Qualified |
e1 |
30 |
260 |
17 mm |
|||||||||||||
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.77 mm |
17 mm |
Not Qualified |
e1 |
30 |
260 |
17 mm |
|||||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B144 |
3 |
1.5 mm |
10 mm |
Not Qualified |
e1 |
30 |
260 |
10 mm |
|||||||||||||
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.77 mm |
17 mm |
Not Qualified |
e1 |
17 mm |
|||||||||||||||
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.77 mm |
17 mm |
Not Qualified |
e1 |
30 |
260 |
17 mm |
|||||||||||||
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.77 mm |
17 mm |
Not Qualified |
e1 |
30 |
260 |
17 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.