Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G128 |
1.6 mm |
14 mm |
e3 |
14 mm |
|||||||||||||||||
Intel |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||
|
Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
700 mA |
1 V |
GRID ARRAY |
BGA144,12X12,40 |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
10312.5 Mbps |
S-PBGA-B144 |
4 |
3.25 mm |
13 mm |
Not Qualified |
e1 |
30 |
260 |
13 mm |
||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
104 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
108 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B104 |
1.57 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
|||||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
2.5,2.5/3.3 |
FLATPACK |
QFP100,.7X.9 |
Network Interfaces |
.635 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
R-PQFP-G100 |
Not Qualified |
||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
.9 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N48 |
1 mm |
7 mm |
7 mm |
||||||||||||||||
|
Texas Instruments |
TOKEN RING TRANSCEIVER |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
GRID ARRAY |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B256 |
e1 |
255 |
|||||||||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA64,8X8,32 |
Network Interfaces |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B64 |
1.36 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||
Cypress Semiconductor |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Network Interfaces |
1 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1500 Mbps |
S-PBGA-B100 |
3 |
1.4 mm |
11 mm |
Not Qualified |
e0 |
11 mm |
||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
104 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
108 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B104 |
1.57 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
80 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G80 |
3 |
1.2 mm |
12 mm |
e3 |
12 mm |
|||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
4.9 mm |
||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
SOP8,.24 |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.752 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9025 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||
|
Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 mA |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N20 |
2 |
1 mm |
3.5 mm |
e4 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||||||
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
169 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B169 |
1.5 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
|||||||||||||||||
Holt Integrated Circuits |
MIL-STD-1553 DATA BUS TRANSCEIVER |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
500 mA |
3.3 V |
FLATPACK, THIN PROFILE |
TQFP32,.35SQ,32 |
.8 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G32 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e0 |
30 |
240 |
7 mm |
||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
1.55,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
GRID ARRAY, LOW PROFILE |
BGA144,12X12,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
.00001 Mbps |
S-PBGA-B144 |
1.4 mm |
13 mm |
13 mm |
|||||||||||||||||
|
Cortina Systems |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.1 mA |
5 V |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Network Interfaces |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||
Dialog Semiconductor |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
38 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G38 |
1.2 mm |
4.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9.7 mm |
||||||||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
||||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
BUTT |
63 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL GOLD |
BOTTOM |
R-PBGA-B63 |
3 |
2.45 mm |
17.5 mm |
e4 |
30 |
260 |
20.5 mm |
|||||||||||||
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
169 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B169 |
3 |
1.5 mm |
14 mm |
Not Qualified |
14 mm |
||||||||||||||||||
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
169 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B169 |
3 |
1.5 mm |
14 mm |
Not Qualified |
e1 |
30 |
260 |
14 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
|||||||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B400 |
3 |
2.33 mm |
27 mm |
Not Qualified |
e1 |
27 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
UNSPECIFIED |
12 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
.03 mA |
3.3 V |
2.5/3.3 |
MICROELECTRONIC ASSEMBLY |
MODULE,12LEAD,.7 |
Other Telecom ICs |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDMA-X12 |
17.78 mm |
Not Qualified |
e3 |
27.94 mm |
||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
|||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
47 |
RECTANGULAR |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
R-XXMA-N47 |
3.34 mm |
17.78 mm |
26.67 mm |
||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
DMOS |
1 |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.4 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
|||||||
National Semiconductor |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
105 Cel |
-40 Cel |
TIN LEAD |
QUAD |
100 Mbps |
S-PQFP-G48 |
3 |
Not Qualified |
e0 |
40 |
260 |
||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
10 Mbps |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
|||||||||||
|
Holt Integrated Circuits |
MIL-STD-1553 DATA BUS TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
3 |
1 mm |
7 mm |
e4 |
260 |
7 mm |
|||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
1 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
TSSOP48,.40 |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
100 Mbps |
R-PDSO-G48 |
2.794 mm |
7.493 mm |
e3 |
15.875 mm |
||||||||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
FLATPACK, FINE PITCH |
QFP128,.68X.91,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
e3 |
260 |
20 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G128 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G128 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQCC-N32 |
1 mm |
5 mm |
e3 |
5 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.072 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.072 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.