NO LEAD Network Interfaces 1,113

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
VSC8531XMW-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	125 Cel	0 Cel		QUAD	1000 Mbps	S-PQCC-N48		.9 mm	6 mm						6 mm
KSZ8061RNDW-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
TLE9255WLCXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	14	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N14	2A	1.05 mm	3 mm			e3			4.5 mm
MCP2542FDT-H/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		.5 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm			e4	30	260	3 mm
LAN8742-CZ-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N24		1 mm	4 mm	Not Qualified		e3			4 mm
KSZ9031RNXUB-TRVAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48		1 mm	7 mm			e3			7 mm
MCP2561FDT-E/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
MCP2562T-E/MFVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8		1 mm	3 mm			e3			3 mm
BCM89811B1AWMLG	Broadcom	ETHERNET TRANSCEIVER		NO LEAD	36	HQCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER, HEAT SINK/SLUG							QUAD		S-XQCC-N36	3							260
LAN8742I-CZ-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N24		1 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
TCAN1051HGVDRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
MCP2542FD-E/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3	30	260	3 mm
TLE9251VLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm			e3			3 mm
KSZ9131MNXI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ9131MNXI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ9031MNXCA-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ8041RNLI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32	2	.9 mm	5 mm			e3	30	260	5 mm
LAN8742-CZ	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-XQCC-N24		1 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
TJA1057GTK/3	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
VSC8531XMW-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	125 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N48		.9 mm	6 mm						6 mm
IFX1051LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm			e3		260	3 mm
KSZ8091MNXIA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32	2	1 mm	5 mm			e3	30	260	5 mm
MCP2562FD-E/MFVAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
KSZ9131MNXC-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
NCV7344AMW0R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm			e3	30	260	3 mm
TLE9250XLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm			e3			3 mm
LAN8830-V/PSA	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N48		1 mm	7 mm						7 mm
KSZ8091RNBCA	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32	2	1 mm	5 mm			e3	30	260	5 mm
KSZ9131MNXC	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
UJA1169ATK/F/3Z	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	15 Mbps	R-PDSO-N20	1	1 mm	3.5 mm			e4	30	260	5.5 mm
88E3018-A2-NNC1I000	Marvell Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64		1 mm	9 mm			e3			9 mm
MCP2542FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3	30	260	3 mm
MCP2558FDT-H/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		.5 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm			e4			3 mm
TCAN1057AVDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2	1 mm	3 mm		ESD for CANH, CANL pins is 3B	e4		260	3 mm
UJA1169ATK/X/FZ	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	15 Mbps	R-PDSO-N20	1	1 mm	3.5 mm			e4	30	260	5.5 mm
PTCAN1044AVDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N8
VSC8514XMK-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	138	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4	605 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG	LCC135,.47SQ,25		.65 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBCC-N138		.85 mm	12 mm						12 mm
TCAN1051HDRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TJA1028TK/3V3/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
RN2483A-I/RM103	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N47		3.34 mm	17.78 mm						26.67 mm
TCAN4551RGYRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1	1		AEC-Q100					CHIP CARRIER, HEAT SINK/SLUG				125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	8 Mbps	R-XQCC-N20	2					e3	30	260
ATA6563-GBQW1	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
DP83TG720SWRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	4	225 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm		IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
VSC8514XMK-03	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	138	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4	605 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG	LCC135,.47SQ,25		.65 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PQCC-N138		.85 mm	12 mm						12 mm
LAN8830/PSA	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQCC-N48		1 mm	7 mm						7 mm
LAN8830T/PSA	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQCC-N48		1 mm	7 mm						7 mm
VSC8514XMK-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	138	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4	605 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG	LCC135,.47SQ,25		.65 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBCC-N138		.85 mm	12 mm						12 mm
TJA1057GTK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.