NO LEAD Network Interfaces 1,113

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TCAN1043HGDMTTQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	R-PDSO-N14	2	1 mm	3 mm			e3	NOT SPECIFIED	NOT SPECIFIED	4.5 mm
DP83848KSQ	National Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS		1		3.3 V	3.3	CHIP CARRIER	LCC40,.24SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-PQCC-N40	2			Not Qualified			40	260
KSZ9031RNXVA	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm				30	260	7 mm
KSZ9031RNXVA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm						7 mm
LAN8710AI-EZC-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		e3			5 mm
TJA1145ATK/FD	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	65 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm				DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm						4.5 mm
LAN8741A-EN	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N32		1 mm	5 mm			e3			5 mm
TCAN1043GDMTTQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	R-PDSO-N14	2	1 mm	3 mm			e3	NOT SPECIFIED	NOT SPECIFIED	4.5 mm
ADIN1200CCP32Z-R7	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm			e3		260	5 mm
TCAN1043DMTRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	2 Mbps	R-PDSO-N14	2	1 mm	3 mm			e3	NOT SPECIFIED	260	4.5 mm
MCP2558FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3			3 mm
TCAN1043DMTTQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	2 Mbps	R-PDSO-N14	2	1 mm	3 mm			e3	NOT SPECIFIED	NOT SPECIFIED	4.5 mm
TJA1059TKJ	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm			NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-N14	1	1 mm	3 mm			e4	30	260	4.5 mm
ATA6563-GBQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100;AEC-Q006	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
KSZ9031RNXUA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm						7 mm
TJA1043TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	109 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	DILCC14,.12x0.18,25		.65 mm				DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm						4.5 mm
NTS0104GU12,115	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	4						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N12	1	.5 mm	1.7 mm				30	260	2 mm
RN171-I/RM441	Microchip Technology	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID	TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N49		3.175 mm	17.78 mm						26.67 mm
ADIN1200BCP32Z-R7	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm				30	260	5 mm
KSZ8091RNDCA-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N24	2	.9 mm	4 mm			e3	30	260	4 mm
LAN8830T-V/PSA	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N48		1 mm	7 mm						7 mm
DP83TG720SWRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	4	225 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm		IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
CMWX1ZZABZ-TEMP	Murata Manufacturing	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	METAL	YES	1				1	3.6 mA	3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-MXMA-N
KSZ9031RNXUA	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; ISO/TS-16949	2		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48	3	.9 mm	7 mm			e3	40	260	7 mm
TJA1101AHN/0Z	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100 Mbps	S-PQCC-N36	1	1 mm	6 mm			e4	30	260	6 mm
TJA1028TK/5V0/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm					260	3 mm
NCV7344MW3R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm			e3	30	260	3 mm
MCP2003-E/MD	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm						4 mm
RN171-I/RM475	Microchip Technology	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID	TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N49		3.175 mm	17.78 mm						26.67 mm
RN171-I/RM481	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N49		3.175 mm	17.78 mm						26.67 mm
RN171-I/RM	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N49		3.175 mm	17.78 mm			e3			26.67 mm
TCAN1051HGDRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TJA1049TK/3J	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				AEC-Q100	1	65 mA	5 V	5	SMALL OUTLINE	SOLCC8,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N8	1			Not Qualified				260
VSC8514XMK	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	NO LEAD	138	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4	605 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG	LCC135,.47SQ,25		.65 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PQCC-N138		.85 mm	12 mm						12 mm
UJA1169ATK/XZ	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	15 Mbps	R-PDSO-N20	1	1 mm	3.5 mm			e4	30	260	5.5 mm
TCAN1042VDRBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
ICS1893CKILFT	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
KSZ9031RNXVB	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N48		1 mm	7 mm						7 mm
TUSB1210BRHBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	2	1 mm	5 mm			e4	NOT SPECIFIED	260	5 mm
DP83TG720RWRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	4	250 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm		IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
ADIN1200CCP32Z	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm				30	260	5 mm
E98103A38B	Elmos Semiconductor Ag	INTERFACE CIRCUIT		NO LEAD	32	QCCN	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, VERY THIN PROFILE				85 Cel	-25 Cel		QUAD		R-XQCC-N32					ALSO OPERATES WITH 5V NOMINAL SUPPLY
LAN8820I-ABZJ	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm			e3			8 mm
TJA1044GTK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm		ESD on pins CANH and CANL ESD is 8kV		NOT SPECIFIED	NOT SPECIFIED	3 mm
UJA1169ATK/3Z	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	15 Mbps	R-PDSO-N20	1	1 mm	3.5 mm			e4	30	260	5.5 mm
14235R-500	Dialog Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1	70 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	.078 Mbps	S-XQCC-N48		.9 mm	7 mm	Not Qualified					7 mm
KSZ8061MNGW-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N48		.9 mm	7 mm			e3			7 mm
MCP2562-H/MF	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.