NO LEAD Network Interfaces 1,113

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1027TK/20	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8	1	1 mm	3 mm				30	260	3 mm
LAN8671B1T-E/U3B	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	10 Mbps	S-PQCC-N24		.9 mm	4 mm						4 mm
MAX2837ETM+	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N48	1	.8 mm	6 mm			e3	30	260	6 mm
RN171-I/RM400	Microchip Technology	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	NO	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	NICKEL GOLD	DUAL		R-XDMA-N49		3.175 mm	17.78 mm			e4			26.67 mm
SN65HVD102RGBR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					2 mA	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4 mm
TCAN1043ATDMTRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	8 Mbps	R-PDSO-N14	2	1 mm	3 mm			e4			4.5 mm
TCAN1043HGDMTRQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	Matte Tin (Sn)	DUAL	5 Mbps	R-PDSO-N14	2	1 mm	3 mm			e3	NOT SPECIFIED	NOT SPECIFIED	4.5 mm
TJA1051TK,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm				DUAL	1 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
TJA1051TK/E,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm				DUAL	1 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
TLIN1024ARGYRQ1	Texas Instruments	LIN TRANSCEIVER		NO LEAD	24	HVFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	4		AEC-Q100	4	7.5 mA	8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.14X.21,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.02 Mbps	R-PQCC-N24	2	1 mm	3.5 mm			e4		260	5.5 mm
DP83TC811SWRNDRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQCC-N36	3	.9 mm	6 mm			e4	30	260	6 mm
KSZ8091RNBIA	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	2	.9 mm	5 mm			e3	30	260	5 mm
KSZ9021GN-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-XQCC-N64	3	.9 mm	8 mm			e4	30	260	8 mm
LAN9370-V/KCXVAO	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	4		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	100 Mbps	S-PQCC-N64		.9 mm	8 mm						8 mm
MCP2561FD-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
PTCAN1043ADMTRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N14		1 mm	3 mm						4.5 mm
RN171-I/RM480	Microchip Technology	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID	TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N49		3.175 mm	17.78 mm						26.67 mm
TCAN1051GDRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
TJA1029TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8	1	1 mm	3 mm						3 mm
TLK106RHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	1.55,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Network Interfaces	.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
UJA1169ATK	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm						5.5 mm
UJA1169ATK/3	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm						5.5 mm
MAX14819ATM+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N48	1	.8 mm	7 mm			e3	30	260	7 mm
TJA1101AHN	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N36	1	1 mm	6 mm			e4	30	260	6 mm
UJA1167TK,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES				AEC-Q100	1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified			30	260
UJA1169ATK/F	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm						5.5 mm
VSC8540XMV-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N68	3	.9 mm	8 mm			e3		260	8 mm
ATA663454-GDQW-VAO	Microchip Technology	LIN TRANSCEIVER		NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.5 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC16,.13,25		.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-N16		1 mm	3 mm			e3			5.5 mm
KSZ8061MNXI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
MCP2003BT-E/MC	Microchip Technology	LIN TRANSCEIVER		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N8		1 mm	2 mm						3 mm
PEF7071VV16SLLHU	Intel	ETHERNET TRANSCEIVER		NO LEAD	48	QCCN	RECTANGULAR	UNSPECIFIED	YES	1								CHIP CARRIER							QUAD		R-XQCC-N48							NOT SPECIFIED	NOT SPECIFIED
RN131G-I/RM475	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm				NOT SPECIFIED	NOT SPECIFIED	37 mm
TJA1153ATK/0Z	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel			DUAL	5 Mbps	R-PDSO-N14	1	1 mm	3 mm					260	4.5 mm
TLE9261QXXUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48	3	.9 mm	7 mm						7 mm
TLIN10283DRBRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8		SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	135 mA	12 V			SOP8(UNSPEC)			125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	S-PDSO-G8	2					e4	30	260
TLIN1029DRBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	5 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	S-PDSO-N8	2	1 mm	3 mm			e4	30	260	3 mm
TUSB1210BRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
WGI218LM/SLK3B	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	Network Interfaces	.4 mm	85 Cel	0 Cel		QUAD	1000 Mbps	S-XQCC-N48		.9 mm	6 mm	Not Qualified					6 mm
1894K-33LFT	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
ADIN1100CCPZ	Analog Devices	ETHERNET TRANSCEIVER		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	10 Mbps	S-XQCC-N40	3	.8 mm	6 mm		ESD FOR TXN, TXP, RXN, RXP Pins is 3B			260	6 mm
ATA663454-GDQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1.15 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N16		.9 mm	3 mm			e3			5.5 mm
KSZ8051RNLUTR	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-PQCC-N32		.9 mm	5 mm	Not Qualified					5 mm
KSZ8051RNLU-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-XQCC-N32	2	1 mm	5 mm			e4	40	260	5 mm
MCP2025-500E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
TLIN2029DRBRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100			12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	S-PDSO-N8	2	1 mm	3 mm			e4	30	260	3 mm
VSC8531XMW-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	125 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N48		.9 mm	6 mm						6 mm
GPY115C0VI	Maxlinear	ETHERNET TRANSCEIVER		NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.28SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N56		.9 mm	7 mm		ALSO REQUIRE 1.8V,3.3V SUPPLY				7 mm
KSZ8091RNAIA-G3XX-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949			1.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24		.9 mm	4 mm			e3			4 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.