NO LEAD Network Interfaces 1,113

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MCP2021A-330E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949		1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		1 mm	4 mm					4 mm
PTCAN1046AVDMTRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2	2		AEC-Q100		2		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N14		1 mm	3 mm					4.5 mm
RN131G-I/RM481	Microchip Technology	WIRELESS LAN CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID					3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		QUAD		R-XQMA-N44		3.5 mm	20 mm					37 mm
SN55HVD251DRJR	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1	BICMOS			1	.065 mA	5 V	5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	Network Interfaces	.8 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	S-PDSO-N8	2	.8 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
TCAN1046AVDMTRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	2		AEC-Q100		2	260 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N14	2	1 mm	3 mm		e4		260	4.4 mm
TCAN1046VDMTRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2	2		AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	8 Mbps	R-PDSO-N14	2	.9 mm	3 mm		e3	NOT SPECIFIED	260	4.5 mm
UJA1169TKZ	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	7.5 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.15,20		.5 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	2 Mbps	R-PDSO-N20	1	1 mm	3.5 mm		e4	30	260	5.5 mm
1893CKLF	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	e3	30	260	8 mm
DP83848HSQ	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N40		.8 mm	6 mm	Not Qualified				6 mm
ICS1893CKLF	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	e3	30	260	8 mm
LAN8670B1T-E/LMX	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	10 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
MCP2025-500E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949		1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm		e3			4 mm
MCP2544WFDT-H/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949		1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		.5 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm		e3	30	260	3 mm
PTCAN1044DRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
RN131G-I/RM475PSW	Microchip Technology	WIRELESS LAN CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID					3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		QUAD		R-XQMA-N44		3.5 mm	20 mm					37 mm
RN2483-I/RM101	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	47		RECTANGULAR		YES	1							3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel				R-XXMA-N47		3.34 mm	17.78 mm					26.67 mm
TLE7250XLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TLE9261QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLIN1024RGYRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	24	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	4		AEC-Q100				24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	.02 Mbps	R-PQCC-N24	2	1 mm	3.5 mm		e3	30	260	5.5 mm
UJA1167TK/VX,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES				AEC-Q100		1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified			260
78Q8392L-28CH/F	Analog Devices	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	28	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		-9 V	1	.065 mA	9 V	+-9	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel		QUAD	10 Mbps	S-PQCC-N28		4.572 mm	11.5316 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	11.5316 mm
ADIN2111BCPZ	Analog Devices	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	40000 Mbps	S-XQCC-N48	3	.8 mm	7 mm			30	260	7 mm
ADIN2111BCPZ-R7	Analog Devices	ETHERNET TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	40000 Mbps	S-XQCC-N48	3	.8 mm	7 mm			30	260	7 mm
ATA6560-GBQW	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8		.9 mm	3 mm		e3			3 mm
ATA6560-GBQW-VAO	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
DP83848JSQ	National Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS			1		3.3 V	3.3	CHIP CARRIER	LCC40,.24SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQCC-N40	2			Not Qualified		40	260
DP83TC812SRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm		e4		260	6 mm
DP83TD510ERHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					4		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	10 Mbps	S-PQCC-N32	1	1 mm	5 mm		e4	30	260	5 mm
HI-1582PCIF	Holt Integrated Circuits	MIL-STD-1553 DATA BUS TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	1 mm	7 mm		e4		260	7 mm
KSZ8051RNLU-TR-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949		1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm					5 mm
LAN8741AI-EN-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949		1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N32		1 mm	5 mm		e3			5 mm
LTC2875MPDD#TRPBF	Analog Devices	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-55 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm		e3	30	260	3 mm
MAX2829ETN-T	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX2829ETN+T	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm		e3	30	260	8 mm
MCP2542WFD-E/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm		e3	30	260	3 mm
MCP2542WFDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					1	140 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm		e3	30	260	3 mm
NCV7344MW0R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100		1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm		e3	30	260	3 mm
PN5331B3HN/C270:55	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm	Not Qualified	e4		260	6 mm
PTCAN1462DRBRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1	130 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
TCAN1051DRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
TJA1021TK/10/C/S90	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8		.8 mm	3 mm					3 mm
TLE7250LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TLE7250VLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm		e3			3 mm
TLK106LRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1					4		1.55 V		CHIP CARRIER				105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-XQCC-N32	2				e4	NOT SPECIFIED	260
UJA1018TK	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	4.5 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC16,.13,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N16		1 mm	5.5 mm					3.5 mm
UJA1168TK/VX/FDJ	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES				AEC-Q100		1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified	e4	30	260
1893CKILF	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	e3	30	260	8 mm
ATA6565-GCQW1	Microchip Technology	CAN TRANSCEIVER	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2			AEC-Q100		2	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	85 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	4.5 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.