Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
||||||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N56 |
3 |
.8 mm |
8 mm |
e3 |
30 |
260 |
8 mm |
|||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N44 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.5 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.104 mA |
3/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||
|
Analog Devices |
CAN TRANSCEIVER |
NO LEAD |
10 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 Mbps |
R-PDSO-N10 |
1 |
.8 mm |
3 mm |
e4 |
30 |
260 |
4 mm |
|||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N56 |
3 |
.8 mm |
8 mm |
Not Qualified |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
Analog Devices |
CAN TRANSCEIVER |
NO LEAD |
10 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
.5 mm |
125 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N10 |
.8 mm |
3 mm |
4 mm |
||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
.0006 Mbps |
R-PQCC-N40 |
1 |
1 mm |
5 mm |
e4 |
260 |
7 mm |
||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
.0006 Mbps |
R-PQCC-N40 |
1 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
.0006 Mbps |
R-PQCC-N40 |
1 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
.0006 Mbps |
R-PQCC-N40 |
1 |
1 mm |
5 mm |
30 |
260 |
7 mm |
||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
.0006 Mbps |
R-PQCC-N40 |
1 |
1 mm |
5 mm |
e4 |
260 |
7 mm |
||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
.0006 Mbps |
R-PQCC-N40 |
1 |
1 mm |
5 mm |
30 |
260 |
7 mm |
||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
1 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||||
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
AEC-Q100 |
2 |
105 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
R-PDSO-N14 |
1 |
.9 mm |
3 mm |
e3 |
30 |
260 |
4.5 mm |
||||||||
|
Onsemi |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
2 |
AEC-Q100 |
2 |
13 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.02 Mbps |
R-PDSO-N14 |
1 |
.9 mm |
3 mm |
e3 |
30 |
260 |
4.5 mm |
|||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
1 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||||
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
1 |
105 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
S-XDSO-N8 |
1 |
.9 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
1 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||||
|
Onsemi |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
6.5 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.02 Mbps |
S-PDSO-N8 |
1 |
.9 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
||||||||
|
STMicroelectronics |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.044 mA |
2.5 V |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
|||||||||
|
STMicroelectronics |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.044 mA |
2.5 V |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
|||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.45 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-N12 |
1 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
5 V |
UNCASED CHIP |
125 Cel |
-40 Cel |
UPPER |
R-XUUC-N8 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
13 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
12 V |
UNCASED CHIP |
UPPER |
R-XUUC-N13 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
5 V |
UNCASED CHIP |
125 Cel |
-40 Cel |
UPPER |
R-XUUC-N8 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
5 V |
UNCASED CHIP |
125 Cel |
-40 Cel |
UPPER |
R-XUUC-N8 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
5 V |
UNCASED CHIP |
125 Cel |
-40 Cel |
UPPER |
R-XUUC-N8 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
QUAD |
R-PQCC-N24 |
1 mm |
3.5 mm |
5.5 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
1 |
.33 mm |
1.2 mm |
260 |
1.4 mm |
||||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
125 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
175 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N14 |
1 mm |
3 mm |
4.5 mm |
|||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
13 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
12 V |
UNCASED CHIP |
UPPER |
R-XUUC-N13 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
15 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
5 V |
UNCASED CHIP |
UPPER |
R-XUUC-N15 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
15 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
5 V |
UNCASED CHIP |
UPPER |
R-XUUC-N15 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||
|
NXP Semiconductors |
SUPPORT CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
Not Qualified |
e4 |
260 |
6 mm |
||||||||||||||
NXP Semiconductors |
SUPPORT CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
1 mm |
6 mm |
Not Qualified |
6 mm |
|||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
13 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
12 V |
UNCASED CHIP |
UPPER |
R-XUUC-N13 |
||||||||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
138 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
CHIP CARRIER, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N138 |
.85 mm |
12 mm |
12 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
OTHER |
NO LEAD |
138 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
0 Cel |
QUAD |
S-PQCC-N138 |
.85 mm |
12 mm |
12 mm |
||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
.5 mm |
1 mm |
1.45 mm |
||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||||||||
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
R-PDSO-N14 |
1 mm |
3 mm |
4.5 mm |
|||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
|||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
1 mm |
5 mm |
5 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.