NO LEAD Network Interfaces 1,113

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

MAX3987ETM+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N48

1

.8 mm

7 mm

e3

30

260

7 mm

MAX2828ETN+T

Analog Devices

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e3

30

260

8 mm

MAX13345EETD+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

14

VSON

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N14

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX13345EETD+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

14

VSON

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N14

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3980UTH+T

Analog Devices

INTERFACE CIRCUIT

OTHER

NO LEAD

44

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC44,.28SQ,20

Analog Transmission Interfaces

.5 mm

85 Cel

0 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N44

1

.8 mm

7 mm

Not Qualified

e3

30

260

7 mm

MAX13342EETD+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

14

VSON

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N14

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX13342EETD+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

14

VSON

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N14

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX2830ETM+T

Analog Devices

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

.104 mA

3/3.3

CHIP CARRIER, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e3

30

260

7 mm

MAX33015EATB+

Analog Devices

CAN TRANSCEIVER

NO LEAD

10

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

70 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC10,.12,20

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

5 Mbps

R-PDSO-N10

1

.8 mm

3 mm

e4

30

260

4 mm

MAX2828ETN+

Analog Devices

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N56

3

.8 mm

8 mm

Not Qualified

e3

30

260

8 mm

MAX33014EATB+T

Analog Devices

CAN TRANSCEIVER

NO LEAD

10

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

70 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC10,.12,20

.5 mm

125 Cel

-40 Cel

DUAL

5 Mbps

R-PDSO-N10

.8 mm

3 mm

4 mm

AX-SFJK-API-1-01-TB05

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2X.27,20

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

.0006 Mbps

R-PQCC-N40

1

1 mm

5 mm

e4

260

7 mm

AX-SFJK-API-1-01-XXXX

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.27,20

.5 mm

85 Cel

-40 Cel

QUAD

.0006 Mbps

R-PQCC-N40

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

AX-SFJK-1-01-XXXX

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.27,20

.5 mm

85 Cel

-40 Cel

QUAD

.0006 Mbps

R-PQCC-N40

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

AX-SFJK-1-01-TX30

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2X.27,20

.5 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

.0006 Mbps

R-PQCC-N40

1

1 mm

5 mm

30

260

7 mm

AX-SFJK-1-01-TB05

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2X.27,20

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

.0006 Mbps

R-PQCC-N40

1

1 mm

5 mm

e4

260

7 mm

AX-SFJK-API-1-01-TX30

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2X.27,20

.5 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

.0006 Mbps

R-PQCC-N40

1

1 mm

5 mm

30

260

7 mm

NCN5130MNG

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N40

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

NCV7446MW0R2G

Onsemi

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

14

HVSSON

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

AEC-Q100

2

105 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

SOLCC14,.12,25

.65 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

5 Mbps

R-PDSO-N14

1

.9 mm

3 mm

e3

30

260

4.5 mm

NCV7422MW0R2G

Onsemi

LIN TRANSCEIVER

AUTOMOTIVE

NO LEAD

14

HVSON

RECTANGULAR

UNSPECIFIED

YES

2

AEC-Q100

2

13 mA

12 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12,25

.65 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

.02 Mbps

R-PDSO-N14

1

.9 mm

3 mm

e3

30

260

4.5 mm

NCN5110MNG

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N40

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

NCV7357MW3R2G

Onsemi

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

1

105 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

5 Mbps

S-XDSO-N8

1

.9 mm

3 mm

e3

30

260

3 mm

NCN5121MNG

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N40

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

NCV7329MW0R2G

Onsemi

LIN TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1

6.5 mA

12 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

SOLCC8,.12,25

.65 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

.02 Mbps

S-PDSO-N8

1

.9 mm

3 mm

e3

30

260

3 mm

TN100QT

STMicroelectronics

WIRELESS LAN CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.044 mA

2.5 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

TN100Q

STMicroelectronics

WIRELESS LAN CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.044 mA

2.5 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

L6362A

STMicroelectronics

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

24 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.45 mm

125 Cel

-40 Cel

DUAL

S-PDSO-N12

1 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

935191500027

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

125 Cel

-40 Cel

UPPER

R-XUUC-N8

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

935290083029

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

12 V

UNCASED CHIP

UPPER

R-XUUC-N13

935191500005

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

125 Cel

-40 Cel

UPPER

R-XUUC-N8

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

935263364005

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

125 Cel

-40 Cel

UPPER

R-XUUC-N8

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

935263364027

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

125 Cel

-40 Cel

UPPER

R-XUUC-N8

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

SJA1124AHG

NXP Semiconductors

ETHERNET TRANSCEIVER

NO LEAD

24

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

12 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

R-PQCC-N24

1 mm

3.5 mm

5.5 mm

BGS8458Z

NXP Semiconductors

WIRELESS LAN CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.6 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

1

.33 mm

1.2 mm

260

1.4 mm

TJR1443ATK

NXP Semiconductors

CAN TRANSCEIVER

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

125 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12,25

.65 mm

175 Cel

-40 Cel

DUAL

5 Mbps

R-PDSO-N14

1 mm

3 mm

4.5 mm

935271076027

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

12 V

UNCASED CHIP

UPPER

R-XUUC-N13

935261511027

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

15

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

UPPER

R-XUUC-N15

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

935261511005

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

15

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

UPPER

R-XUUC-N15

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

PN5331B3HN/C270,51

NXP Semiconductors

SUPPORT CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

2

1 mm

6 mm

Not Qualified

e4

260

6 mm

PN5331B3HN/C270

NXP Semiconductors

SUPPORT CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

Not Qualified

6 mm

935290083027

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

12 V

UNCASED CHIP

UPPER

R-XUUC-N13

F104X8A,699

NXP Semiconductors

ETHERNET TRANSCEIVER

AUTOMOTIVE

NO LEAD

138

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1 V

CHIP CARRIER, VERY THIN PROFILE

.65 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N138

.85 mm

12 mm

12 mm

F104S8A

NXP Semiconductors

ETHERNET TRANSCEIVER

OTHER

NO LEAD

138

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

125 Cel

0 Cel

QUAD

S-PQCC-N138

.85 mm

12 mm

12 mm

935293622115

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

DUAL

R-PDSO-N6

.5 mm

1 mm

1.45 mm

935300642118

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

DUAL

S-PDSO-N8

1 mm

3 mm

3 mm

935294616118

NXP Semiconductors

CAN TRANSCEIVER

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

67 mA

13 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12,25

.65 mm

150 Cel

-40 Cel

DUAL

R-PDSO-N14

1 mm

3 mm

4.5 mm

935294212118

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

DUAL

S-PDSO-N8

1 mm

3 mm

3 mm

MC34CM3120EPR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

5 mm

5 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.