NO LEAD Network Interfaces 1,113

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
IFX1051LE	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1				1	60 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	TIN	DUAL	2 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm		e3		260	3 mm
TLE6250CX3MA2	Infineon Technologies	CAN TRANSCEIVER		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	BCDMOS					5 V		UNCASED CHIP							UPPER		X-XUUC-N				Not Qualified
TLE7257LE	Infineon Technologies	LIN TRANSCEIVER		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		1		7 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	TIN	DUAL	.02 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TLE7251VLE	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100						SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TLE6250CX6SA1	Infineon Technologies	CAN TRANSCEIVER		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	BCDMOS					5 V		UNCASED CHIP							UPPER		X-XUUC-N				Not Qualified
TLE9261QXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9262BQXV33	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9263BQXV33	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		2	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9261BQX	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE7250LE	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	60 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	TIN	DUAL	2 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TLE9250XLE	Infineon Technologies	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	48 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm		e3			3 mm
TLE9260-3QX	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9271QXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	10 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel	Tin (Sn)	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE92603QXXUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9261-3QXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	.5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE6250CX3MA1	Infineon Technologies	CAN TRANSCEIVER		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	BCDMOS					5 V		UNCASED CHIP							UPPER		X-XUUC-N				Not Qualified
TLE9261QX	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9261BQXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9261-3BQXV33	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE7250VLE	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			Tin (Sn)	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm		e3	NOT SPECIFIED	NOT SPECIFIED	3 mm
TLE92613QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	150 Cel	-40 Cel		QUAD	.5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9262BQX	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9272QXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100				13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE6250C	Infineon Technologies	CAN TRANSCEIVER		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	BCDMOS					5 V		UNCASED CHIP						MATTE TIN	UPPER		X-XUUC-N				Not Qualified	e3
TLE9262-3BQXV33	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9271QXV33XUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	10 mA	6.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9272QXV33XUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	10 mA	6.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9261BQXV33XUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9263BQXV33XUMA2	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
MAX4892EETX-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N36		.8 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
78Q2123/F1	Maxim Integrated	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		.9 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX4890EETJ-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX4891ETJ	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0		245	5 mm
78Q2133/F1	Maxim Integrated	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	1	.9 mm	5 mm		e3			5 mm
MAX4892ETX-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e0			6 mm
MAX4892EETX	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N36		.8 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
78Q2133R/F1	Maxim Integrated	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	1	.9 mm	5 mm		e3			5 mm
MAX4892ETX	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e0		245	6 mm
78Q2123R/F1	Maxim Integrated	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		.9 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX4891ETJ-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified	e0			5 mm
MAX4890ETJ-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX4890ETJ	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0		245	5 mm
78Q8392L-28CH	Maxim Integrated	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	28	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		-9 V	1	.065 mA	9 V	+-9	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel		QUAD	10 Mbps	S-PQCC-N28	1	4.572 mm	11.5316 mm	Not Qualified		20	240	11.5316 mm
MAX2828ETN-D	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX3952EGK-D	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N68	3	.9 mm	10 mm	Not Qualified	e0			10 mm
MAX2828ETN+D	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.8 mm	8 mm		e3	30	260	8 mm
MAX2828ETN	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					2.7 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX13482EETE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N16	1	.8 mm	3 mm	Not Qualified	e0		245	3 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.