NO LEAD Network Interfaces 1,113

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
935293621132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N6		.5 mm	1 mm						1 mm
935300811118	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm			NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-N14	1	1 mm	3 mm			e4	30	260	4.5 mm
935303442118	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100	1	4 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8		1 mm	3 mm						3 mm
MC13201	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
MC34CM3120EP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		1 mm	5 mm						5 mm
MCR20AVHM	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	LGA	SQUARE	UNSPECIFIED	YES	1			.0195 mA	2.7 V	2.7	GRID ARRAY	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	105 Cel	-40 Cel	NICKEL GOLD	BOTTOM		S-XBGA-N32	3			Not Qualified		e4	40	260
935293486132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N6		.35 mm	1 mm						1 mm
MC13202	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
F104X8A	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	138	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N138		.85 mm	12 mm						12 mm
MC13203	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
935299509118	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm						3 mm
935294162118	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	AEC-Q100			5 V		SMALL OUTLINE, VERY THIN PROFILE			.65 mm				DUAL		R-PDSO-N14	1	1 mm	3 mm				30	260	4.5 mm
935293698115	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	4				3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N12		.5 mm	1.7 mm						2 mm
935293492115	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	4				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N14		1 mm	2.5 mm						3 mm
NTS0101GS	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N6	1	.35 mm	1 mm	Not Qualified		e3			1 mm
TJA1021TK/10	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		1 mm	3 mm	Not Qualified					3 mm
UJA1168TK,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES		AEC-Q100	1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified			30	260
TJA1041AU,027	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1	AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14
TJA1020U	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1				12 V		UNCASED CHIP							UPPER		R-XUUC-N13				Not Qualified
UJA1161TK,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES			1	67 mA		4.5/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified			30	260
TJA1041U	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP							UPPER		R-XUUC-N14				Not Qualified
UJA1162ATK	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm		ESD FOR BAT, WAKE IS 3A AND CANH,CANL IS 3B				4.5 mm
TJA1049TK/3	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm						3 mm
NTS0101GM,115	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm			e3	30	260	1.45 mm
TJA1021TK/10,118	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8		.8 mm	3 mm						3 mm
TJA1054U/N1,005	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP							UPPER		R-XUUC-N15				Not Qualified
TJA1021TK/20	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		1 mm	3 mm	Not Qualified					3 mm
UJA1169ATK/X/F	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm						5.5 mm
TJA1100	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N36		1 mm	6 mm						6 mm
PCA82C250U	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	DIE	UNSPECIFIED	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				125 Cel	-40 Cel		UPPER		X-XUUC-N8				Not Qualified
UJA1168TK/FDJ	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES		AEC-Q100	1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified		e4	30	260
TJA1054U/N1	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				125 Cel	-40 Cel		UPPER		R-XUUC-N15				Not Qualified
TJA1028TK/5V0/20	NXP Semiconductors	MIL-STD-1553 DATA BUS TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8	1	1 mm	3 mm				30	260	3 mm
TJA1050U/N1,005	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				125 Cel	-40 Cel		UPPER		R-XUUC-N8				Not Qualified
TJA1441DTK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100	1	60 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N8		1 mm	3 mm						3 mm
TJA1054AU,027	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1	AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N15
MC33FS6523CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm				40	260	7 mm
NTS0101GF,132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N6	1	.5 mm	1 mm			e3	30	260	1 mm
TJA1102SHN	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N56		1 mm	8 mm						8 mm
NTS0101GM	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm	Not Qualified		e3			1.45 mm
TJA1441BTK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100	1	60 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N8		1 mm	3 mm						3 mm
TJA1022TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	AEC-Q100			12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		R-PDSO-N14	1	1 mm	3 mm				30	260	4.5 mm
TJA1021U/20	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1	AEC-Q100; AEC-Q101			12 V		UNCASED CHIP							UPPER		R-XUUC-N
TJA1041AU/V,006	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1	AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14
NTS0104GU16	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	16	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	4				3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N16		.5 mm	1.8 mm	Not Qualified					2.6 mm
TJA1054U/N1,027	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP							UPPER		R-XUUC-N15				Not Qualified
TJA1054AU	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP							UPPER		R-XUUC-N15				Not Qualified
NTS0101GF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N6	1	.5 mm	1 mm	Not Qualified		e3			1 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.