Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N24 |
.9 mm |
4 mm |
e3 |
4 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N24 |
.9 mm |
4 mm |
e3 |
4 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
1.2,2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N72 |
1 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
||||||||||
|
Microchip Technology |
CAN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
40 |
260 |
3 mm |
|||||||||
|
Onsemi |
CAN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
.075 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
S-PDSO-N8 |
1 |
.9 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-N8 |
||||||||||||||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
60 mA |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
OTHER |
NO LEAD |
44 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
2 mm |
85 Cel |
-30 Cel |
UNSPECIFIED |
R-XXMA-N44 |
3.5 mm |
20 mm |
NOT SPECIFIED |
NOT SPECIFIED |
37 mm |
||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
Infineon Technologies |
CAN FD, LIN TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
7 mm |
|||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
e4 |
NOT SPECIFIED |
260 |
5 mm |
|||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
.25 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.16,32 |
.8 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 mm |
4 mm |
e3 |
4 mm |
||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
BOTTOM |
R-XBGA-N24 |
3 |
260 |
||||||||||||||||||||||||||
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.7 V |
CHIP CARRIER |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N56 |
.8 mm |
8 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
||||||||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N56 |
3 |
.8 mm |
8 mm |
Not Qualified |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
Analog Devices |
CAN TRANSCEIVER |
NO LEAD |
10 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 Mbps |
R-PDSO-N10 |
1 |
.8 mm |
3 mm |
e4 |
30 |
260 |
4 mm |
|||||||||||
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
1 |
105 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
S-XDSO-N8 |
1 |
.9 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
TIN |
QUAD |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||
Maxim Integrated |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
.8 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||
|
Diodes Incorporated |
LAN SWITCHING CIRCUIT |
NO LEAD |
42 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
QUAD |
R-XQCC-N42 |
||||||||||||||||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
4 mm |
|||||||||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
85 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-XQCC-N48 |
.9 mm |
6 mm |
6 mm |
|||||||||||||||||
|
Silicon Labs |
WIRELESS LAN CIRCUIT |
NO LEAD |
58 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
.85 mm |
85 Cel |
-40 Cel |
QUAD |
65 Mbps |
R-XQMA-N58 |
13.7 mm |
12.9 mm |
|||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
85 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-XQCC-N48 |
.9 mm |
6 mm |
6 mm |
|||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
Tin (Sn) |
QUAD |
S-XQCC-N48 |
e3 |
|||||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N64 |
1 mm |
9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
|||||||||||||||
|
Atmel |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
1 mm |
5 mm |
Not Qualified |
5 mm |
|||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
128 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
8 |
CHIP CARRIER |
70 Cel |
0 Cel |
QUAD |
R-XQCC-N128 |
||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
NO LEAD |
68 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
CHIP CARRIER |
QUAD |
R-XQCC-N68 |
||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e3 |
40 |
260 |
4 mm |
||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
NO LEAD |
16 |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
QUAD |
S-XQMA-N16 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
OTHER |
NO LEAD |
56 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.05,1.8,3.3 |
CHIP CARRIER |
LCC56,.31SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-PQCC-N56 |
1 |
Not Qualified |
e3 |
|||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
OTHER |
NO LEAD |
56 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.05,1.8,3.3 |
CHIP CARRIER |
LCC56,.31SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-PQCC-N56 |
1 |
Not Qualified |
e3 |
|||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
1 |
53 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.2SQ,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
.9 mm |
5 mm |
e3 |
5 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
e3 |
5 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
e4 |
5 mm |
|||||||||||||
|
Microchip Technology |
CAN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
85 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
5 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.95 mA |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
e3 |
3 mm |
|||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
|||||||||||||
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
|||||||||||||
|
Micrel |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N24 |
2 |
.9 mm |
4 mm |
e4 |
40 |
260 |
4 mm |
||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
1.2,2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N72 |
1 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.