NO LEAD Network Interfaces 1,113

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
KSZ8091RNDCA	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm	4 mm			e3	30	260	4 mm
KSZ9031RNXVC	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N48		1 mm	7 mm						7 mm
LAN8740-EN	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		1 mm	5 mm						5 mm
MCP2557FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm			e3			3 mm
NTS0104BQ	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	4						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-PQCC-N14	1	1 mm	2.5 mm	Not Qualified		e4			3 mm
TLE72593LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			8 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm			e3			3 mm
WGI219LMSLKJ3	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	0 Cel		QUAD		S-XQCC-N48		.9 mm	3 mm						3 mm
TLE7251VLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm			e3			3 mm
ATA6560-GBQW-N	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		.9 mm	3 mm						3 mm
ATA6663-FAQW-1	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					2 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		.9 mm	3 mm			e3			3 mm
DP83TG720RWRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	4	250 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm		IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
TCAN1051GVDRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	30	260	3 mm
ATA663231-GBQW-VAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
ATA663254-FAQW	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
TLE9271QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	10 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm			e3			7 mm
MCP2557FDT-H/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		.5 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm			e4			3 mm
UJA1162ATK/0Z	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14	1	1 mm	3 mm		ESD FOR BAT, WAKE IS 3A AND CANH,CANL IS 3B			260	4.5 mm
88E1112-XX-NNC1C000	Marvell Technology	ETHERNET TRANSCEIVER		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N64		1 mm	9 mm						9 mm
ATA663231-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
LTC4257CDD#PBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4257CDD#TRPBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
RTL8201E-VB-GR	Realtek Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-PQCC-N32		1 mm	5 mm						5 mm
SN65HVD101RGBR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 mA	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4 mm
TJA1059TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		R-PDSO-N14	1	1 mm	3 mm						4.5 mm
TLE7257LEXUMA1	Infineon Technologies	LIN TRANSCEIVER		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100	1		7 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	TIN	DUAL	.02 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm			e3			3 mm
DP83TC811SWRNDTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQCC-N36	3	.9 mm	6 mm			e4	30	260	6 mm
DP83TC813RRHFRQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	28	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.16X.2,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	R-PQCC-N28	2	1 mm	4 mm		the 1.25-Gbps rate of the SGMII is excessive	e4		260	5 mm
LAN8741A-EN-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N32		1 mm	5 mm			e3			5 mm
NCV7327MW0R2G	Onsemi	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	6.5 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	S-XDSO-N8	1	.9 mm	3 mm			e3	30	260	3 mm
PTCAN1057VDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1								125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2					e4	30	260
SI4467-A2A-IM	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
TLK106RHBR	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V	1.55,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Network Interfaces	.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
UJA1167ATK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	28 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm						4.5 mm
1893CKLFT	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
ATA6566-GBQW0	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
ATA6566-GBQW0-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
ATA6566-GBQW1	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	2 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
ATA6566-GBQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
ATA663211-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
AW-CM276NF	Azurewave Technologies	WIRELESS LAN CIRCUIT		NO LEAD	130	TFLGA	RECTANGULAR	UNSPECIFIED	YES	1				1		3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH	LGA130,30X20,20		.5 mm	85 Cel	-30 Cel		BOTTOM	866.7 Mbps	R-XBGA-N130		1.85 mm	12 mm		OTHER DATA RATES ARE 400, 192.6, 300, 150, 54, 48, 36,24,18,12,6,11,5.5, 2,1 MBPS W.R.T DIFF WLAN				16 mm
CC3100R11MRGCR	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm			e4	30	260	9 mm
DP83TC814RRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
DP83TC814SRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
ICS1893CKLFT	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
KSZ8091RNBCA-G3XX	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32		.9 mm	5 mm			e4			5 mm
KSZ8091RNBCA-G3XX-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		.9 mm	5 mm						5 mm
MAX14819ATM+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N48	1	.8 mm	7 mm			e3	30	260	7 mm
MCP2021A-330E/MD	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.