NO LEAD Network Interfaces 1,113

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1028TK/5V0/10:1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				260	3 mm
TJA1054U	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP							UPPER		R-XUUC-N15				Not Qualified
TJA1049TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
MC33FS6502CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm			40	260	7 mm
TJA1020U/N1,027	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			12 V		UNCASED CHIP							UPPER		R-XUUC-N13
TJA1441ATK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	60 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N8		1 mm	3 mm					3 mm
UJA1168TK/VX,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified			260
TJA1028TK/3V3/10	NXP Semiconductors	MIL-STD-1553 DATA BUS TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
TJA1041AU,006	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14
TJA1145ATK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	65 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm				DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm					4.5 mm
UJA1162TK,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	.081 mA		4.5/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified		30	260
TJA1041AU/V,029	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14
TJA1020U/V,029	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			12 V		UNCASED CHIP							UPPER		R-XUUC-N13
TJA1102HN	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N56		1 mm	8 mm					8 mm
UJA1164TK,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N14	1	1 mm	3 mm			30	260	4.5 mm
TJA1462BTK	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
TJA1041AU/V,025	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14
TJA1041AU/V,027	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14
UJA1169ATK/X	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20		.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm					5.5 mm
NTS0101GS,132	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.35 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N6	1	.35 mm	1 mm		e3	30	260	1 mm
TJA1463ATK	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N14		1 mm	4.5 mm					3 mm
TJA1443ATK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	60 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm					4.5 mm
PCA82C250U/N4	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP				125 Cel	-40 Cel		UPPER		R-XUUC-N8				Not Qualified
TJA1041AU	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP							UPPER		R-XUUC-N14				Not Qualified
TJA1028TK/5V0/10	NXP Semiconductors	MIL-STD-1553 DATA BUS TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		S-PDSO-N8		1 mm	3 mm					3 mm
TJA1028TK/5V0/10,1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				260	3 mm
TJA1050U/N1	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP				125 Cel	-40 Cel		UPPER		R-XUUC-N8				Not Qualified
UJA1167ATK/X	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	28 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm					4.5 mm
MC33FS6500NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm			40	260	7 mm
TJA1046TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		R-PDSO-N14		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	4.5 mm
TJA1021U/10	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100; AEC-Q101			12 V		UNCASED CHIP							UPPER		R-XUUC-N
TJA1040U	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP							UPPER		R-XUUC-N8				Not Qualified
PCA82C251U	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1			1	78 mA	5 V		UNCASED CHIP	DIE OR CHIP			125 Cel	-40 Cel		UPPER		R-XUUC-N8			1.78 mm	Not Qualified				2.84 mm
TJA1020U/V,027	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			12 V		UNCASED CHIP							UPPER		R-XUUC-N13
TJA1055U	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	UNSPECIFIED	UNSPECIFIED	YES	1					5 V		UNCASED CHIP							UPPER		X-XUUC-N14				Not Qualified
TJA1050U	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP				125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	UPPER		R-XUUC-N8				Not Qualified	e4
TJA1024HG	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		R-PQCC-N24		1 mm	3.5 mm					5.5 mm
TJA1050U/N1,027	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP				125 Cel	-40 Cel		UPPER		R-XUUC-N8				Not Qualified
TJA1041AU,029	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100			5 V		UNCASED CHIP							UPPER		R-XUUC-N14
UJA1163TK,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified		30	260
TLT9255WLC	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	45 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel	TIN	DUAL	5 Mbps	R-PDSO-N14	2A	1.1 mm	3 mm		e3			4.5 mm
TLT9251VLE	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	48 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	TIN	DUAL	5 Mbps	S-PDSO-N8	2A	1.1 mm	3 mm		e3			3 mm
TLE6250CV33	Infineon Technologies	CAN TRANSCEIVER		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	BCDMOS				3.3 V		UNCASED CHIP							UPPER		X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TLE9250VLE	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm		e3			3 mm
TLE9261-3BQX	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9263-3BQX	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	2	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE92603QXXUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE9263-3BQXV33	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	2	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.